1. Bulk Micromachining of Silicon for MEMS Mustafa G. Guvench, Ph.D. University of Southern Maine

2. Single Crystal Silicon for MEMS

3. Mechanical Material SILICON? Stiff => Thinning is required for appreciable strain

4. Single Crystal Silicon for MEMS

6. Structure of Single Crystal Silicon

7. Miller Indices for Single Crystal Silicon

8. SCS has anisotropic properties: Electrical, Thermal, Mechanical, Chemical

9. ETCHING for BULK MICROMACHINING (Isotropic/Anisotropic)

11. ETCHING for BULK MICROMACHINING (Cavity/Cantilever Anisotropic)

12. DRY (Plasma) ETCHING

13. Deep Reactive Ion Etch (DRIE)

14. Single Crystal Silicon for MEMS

17. What is MICRO-MACHINING?

18.  What can Micromachined Parts/Systems do for us? Be a Conduit to Microscopic Domain: 1. Sensing (Information) 2. Information Processing 3. Communication 4. Manipulation (Actuation and Control)

19. Why / Why not SILICON? Semiconductor: Active Devices + Sensors (Photo-Magneto-Strain Sensing) Insulator:SiO 2, Si 3 N 4, Glass Thin Film Conductor:Aluminum, Gold, Silicides PhotoLithography:Planar control (+ & -)

20. Mechanical Material SILICON? Stiff => Thinning is required for appreciable strain

21. Micromachining of SILICON? MICROMACHINING of SILICON => (a) BULK (substrate) (b) SURFACE (films) Additive Processes: Chemical and Physical Deposition (Thin Layers only) (Single/Poly) Removal Processes:Chemical and Physical Etching (Wet/Dry/Plasma/Inert/Reactive) (Bulk/Film) (Anisotropic/Isotropic) (Bulk/Film) (Anisotropic/Isotropic)

22. BULK MICROMACHINING (Etchants: Isotropic/Anisotropic)

23. BULK MICROMACHINED (Silicon Capillary for Insulin Infuser)

26. BULK MICROMACHINED (Silicon Mask for Cylindrical Micromotion Sensor)

27. BULK MICROMACHINED (Series Connected Photovoltaic Converter Battery)

31. MOTION? HANDLING? ASSEMBLY?COUPLING? =>

32. Micro Electro Mechanical Sytems

34. M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology)

35. Three-Layer Poly-Silicon Surface Micromachining Process (to build Mechanical Parts on CMOS IC) Final cross sectional view with 7 layers

36. Three-Layer Poly-Silicon Surface Micromachining Process

37. Surface Micromachined

38. Micromachining of Projection Camera

40. M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology) M.G.Guvench

41. Surface Micromachined Silicon Sensors M.G.Guvench

42. M.G.Guvench

43. Electrostatic Field Sensors M.G.Guvench

44. M.G.Guvench

45. M.G.Guvench

46. Mass (Absorption/Deposition) Sensor M.G.Guvench

47. M.G.Guvench

48. M.G.Guvench

49. Electrostatic Field Sensors M.G.Guvench

50. Flow Skin Friction Sensors M.G.Guvench

51. M.G.Guvench

52. CMOS Analog Chip Design (Operational Amplifier) M.G.Guvench

53. MicroFab Laboratory

54. Programmable Diffusion/Oxidation System’s Controller in The MicroFab Laboratory

55. Double-Diffused P + NN + Junction PhotoDiode Made Being Tested in The MicroFabrication Lab.

56. MicroFab Laboratory

57. Surface Micromachined Silicon Sensors M.G.Guvench

58. 3-Poly Surface Micromachining Processed Sensors Cross Section

60. MEMS Switch

61. MEMS Micromotor

62. A Mass (Absorption/Deposition) Sensor M.G.Guvench