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Introduction to CMOS VLSI Design Circuit Characterization and Performance Estimation
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Outline Noise Margins Transient Analysis Delay Estimation
Logical Effort and Transistor Sizing
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Noise Margins How much noise can a gate input see before it does not recognize the input?
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Logic Levels To maximize noise margins, select logic levels at
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Logic Levels To maximize noise margins, select logic levels at
unity gain point of DC transfer characteristic
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Transient Response DC analysis tells us Vout if Vin is constant
Transient analysis tells us Vout(t) if Vin(t) changes Requires solving differential equations Input is usually considered to be a step or ramp From 0 to VDD or vice versa
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Inverter Step Response
Ex: find step response of inverter driving load cap
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Inverter Step Response
Ex: find step response of inverter driving load cap
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Delay Definitions tpd: propagation delay time
maximum time from input crossing 50% to output crossing 50% tcd : contamination delay time minimum time from input crossing 50% to output crossing 50% trf = (tr + tf )/2 tr: rise time From output crossing 0.2 VDD to 0.8 VDD tf: fall time From output crossing 0.8 VDD to 0.2 VDD
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Delay Definitions tcdr: rising contamination delay
From input crossing VDD/2 to rising output crossing VDD/2 tcdf: falling contamination delay From input crossing VDD/2 to falling output crossing VDD/2 tcd: average contamination delay tcd = (tcdr + tcdf)/2
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Simulated Inverter Delay
Solving differential equations by hand is too hard SPICE simulator solves the equations numerically Uses more accurate I-V models too! But simulations take time to write
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Delay Estimation We would like to be able to easily estimate delay
Not as accurate as simulation But easier to ask “What if?” The step response usually looks like a 1st order RC response with a decaying exponential. Use RC delay models to estimate delay C = total capacitance on output node Use effective resistance R So that tpd = RC Characterize transistors by finding their effective R Depends on average current as gate switches
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RC Delay Models Use equivalent circuits for MOS transistors
Ideal switch + capacitance and ON resistance Unit nMOS has resistance R, capacitance C Unit pMOS has resistance 2R, capacitance C Capacitance proportional to width Resistance inversely proportional to width
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Example: 3-input NAND Sketch a 3-input NAND with transistor widths chosen to achieve effective rise and fall resistances equal to a unit inverter (R).
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Example: 3-input NAND Sketch a 3-input NAND with transistor widths chosen to achieve effective rise and fall resistances equal to a unit inverter (R).
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Example: 3-input NAND Sketch a 3-input NAND with transistor widths chosen to achieve effective rise and fall resistances equal to a unit inverter (R).
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3-input NAND Caps Annotate the 3-input NAND gate with gate and diffusion capacitance.
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3-input NAND Caps Annotate the 3-input NAND gate with gate and diffusion capacitance. Cg is approximately equal to Cdiff in many processes.
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In a good layout, diffusion nodes are shared wherever possible to reduce the diffusion capacitance
The uncontacted diffusion nodes between series transistors are smaller than the contacted diffusion nodes.
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3-input NAND Caps Annotate the 3-input NAND gate with gate and diffusion capacitance.
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Elmore Delay ON transistors look like resistors
Pullup or pulldown network modeled as RC ladder Elmore delay of RC ladder
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Example: 2-input NAND Estimate worst-case rising and falling delay of 2-input NAND driving h identical gates.
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Estimate the worst case falling propagation delays of a 2-input NAND driving h identical gates
The worst case occurs when the node x is already charged up to nearly Vdd through the top nMOS Suppose A = 1, B = 0, then Y = 1, node X is nearly VDD Now change inputs to A=B=1 both node Y and node X need to discharge
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Example: 2-input NAND Estimate rising and falling propagation delays of a 2-input NAND driving h identical gates.
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Delay Components Delay has two parts
Parasitic delay, gate driving its own internal diffusion capacitance 6 or 7 RC Independent of load Effort delay, depends on the ration of external load capacitance to input capacitance, Effort delay changes with transistor width Proportional to load capacitance Logical effort and Electrical effort
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Contamination Delay Best-case (contamination) delay can be substantially less than propagation delay. Ex: If both inputs fall simultaneously, the output should be pulled up in half the time tcdr = (R/2)(6+4h)C
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Diffusion Capacitance
we assumed contacted diffusion on every s / d. Good layout minimizes diffusion area Ex: NAND3 layout shares one diffusion contact Reduces output capacitance by 2C Merged uncontacted diffusion might help too
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Layout Comparison Which layout is better?
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