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Thermal Interface Material Tester
Team Members: Joe Henry Andy Hale Brian Francis Nick Tenorio Industry Sponsor: Tektronix Industry Contact: Chris Coleman Academic Advisor: Gerry Recktenwald
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Introduction TIMs! Project Aid heat transfer for electronic devices
Current standard test method inadequate Transient testing method is better Test equipment Controlled environment
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Aluminum Pucks Passive Puck Active Puck Surface Finish of 0.4 microns
(Taken from ASTM Standard D ) Active Puck Chamber Active Puck O-Ring Gland
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Ultem Manifold Guides incoming/outgoing water
Thermally Isolates active puck Guides incoming/outgoing water Provides the other half of the seal
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Active Puck and Manifold Assembly
Plumbing Fittings Threaded Inserts
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Plumbing Hot & Cold Temps Circulating Loops Solenoid Valves
Introduce electrical
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Plumbing Hot 80 deg C Cold 10 deg C
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Plumbing Temperature Switching Circulating Loops
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Structure Force Application System Puck Alignment Super Structure
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Force Application System
Spherical End Factor - Satisfies Parallelism
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Alignment System Guide Rods - Low friction - Low heat conduction
- Pucks are centered Puck Access - Mid Plate Slots - Various Sizes - Cam Lever Teflon Rail Actuating Shaft
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Alignment System Guide Slots Cam Lever Guide Rods
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Safety Factor – 2.3 Total Deformation – 0.03 in
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Pneumatics Pneumatic system function User defined pressure
Pressure measurement Pressure held constant
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Pneumatic System User Interface Pressure Gage Pressure Regulator
(Pressure Transducer Behind Panel)
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Pneumatics Constant Pressure Low friction air cylinder Accumulator
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Pneumatics Low Friction Air Cylinder Glass Cylinder Graphite Piston
Grams of friction Picture from
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Pneumatics Accumulator Pressure vessel Adds volume to system
Helps keep pressure constant Picture from
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Pneumatics
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Questions?
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