1. Provisional draft EF_to_NCPsMtg_Challenge3 - 1 NCPs Meeting Brussels, 19 October 2006 ICT Work Programme 2007-08: Activities under Challenge 3 ICT Work Programme 2007-08: Activities under Challenge 3 Erastos Filos Directorate “Components & Systems” European Commission, Brussels

2. Provisional draft EF_to_NCPsMtg_Challenge3 - 2 Presentation outline R&D in electronics & its key role for Europe’s competitiveness Challenge 3 rationale Foreseen activities under Call 1 Foreseen activities under Call 2 Joint Technology Initiatives – a way to implement ETP Strategic Research Agendas

3. Provisional draft EF_to_NCPsMtg_Challenge3 - 3 The pervasiveness of electronics … Electronics underpins every business sector World GDP Electronic Equipment Semiconductors Investment: Materials & Equipment Source: Future Horizons, IFS2005, Jan 2005 € 30,050 bn € 1,050 bn € 210 bn € 38 bn

4. Provisional draft EF_to_NCPsMtg_Challenge3 - 4 Electronics: Key to intelligent products By 2010, electronics & software in cars will account for up to 40% of their value Smarter products: Electronic safety Driver customisation Resource-efficient products: Fuel efficiency Info-mobility & traffic management ICT-enabled disposal Value-adding services: Active safety features Remote diagnostics & assistance Infotainment & travel guidance

5. Provisional draft EF_to_NCPsMtg_Challenge3 - 5 Europe - losing the game ? Europe – a net importer of electronics Aggressive global competition: Asia 2/3 of world semiconductor market & 3/4 share in investment A typical semiconductor fabrication facility costs € 2.5 billion Source: European Semiconductor Industry Association, 2005

6. Provisional draft EF_to_NCPsMtg_Challenge3 - 6 European microelectronics achievements World top-10 list of semiconductor companies: –1990: 1 European company –2004: 3 European companies –2006: ? Equipment: –Wafer processing: 5 European SMEs on top 10 list Europe’s big 2 (ASML and ASM Int’l) on top 10 –Assembly equipment: 2 European companies on top 10 list Consensus building in nanoelectronics –Strategic public-private partnership VLSI Research 2003 www.eniac.eu

7. Provisional draft EF_to_NCPsMtg_Challenge3 - 7 To enable Europe’s industry to stay at the forefront of electronics developments & applications through chip making, integration & embedded systems capabilities Challenge 3: Components, Systems, Engineering www.artemis-office.org www.eniac.eu www.smart-systems-integration.org www.photonics21.de R&D objectives are in line with Strategic Research Agendas of European Technology Platforms & support international co- operation under the Intelligent Manufacturing Systems initiative cordis.europa.eu/ims

8. Provisional draft EF_to_NCPsMtg_Challenge3 - 8 Foreseen activities under Call 1: 3.3.1.1: Next-Generation Nanoelectronics Components & Electronics Integration 3.3.1.2: Organic & Large-Area Electronics & Display Systems 3.3.1.3: Embedded Systems Design 3.3.1.4: Computing Systems

9. Provisional draft EF_to_NCPsMtg_Challenge3 - 9 Next-Generation Nanoelectronics Components & Electronics Integration Smaller, higher performance, lower cost: −“More Moore” −Beyond CMOS Integration & diversification: −SoC: Systems-on-Chip −SiP: Systems-in-Package Technology materials, processes, metrology, interconnects, modelling, packaging, architectures Design increased complexity, changed performance, heterogeneity in SiP & SoC, productivity & “Design for Manufacturing” Manufacturing Cost-efficient, flexible production for silicon < 45 nm; for SoC & SiP; 450 mm wafer size; small batch/fast cycle time; equipment assessment Call 1: € 86 mn CP, NoE, CSA

10. Provisional draft EF_to_NCPsMtg_Challenge3 - 10 Organic & Large-Area Electronics & Display Systems Organic & large-area technologies: –Large-area & low-cost manufacturing –Advanced modelling, simulation & circuit design characterisation –Enabling functions: logic, memory, e-paper, systems-on-tags, RFIDs, lab-on-chip, lighting, signage, energy scavenging/storage & power management Advanced display systems: –Visualisation systems supporting Multi-viewer unaided, unrestricted 3D-viewing & natural interaction –Signal acquisition, processing & representation for 3D-systems –Portable display systems Zero-power displays, ruggedised displays Flexible/transparent devices Energy-efficient micro-projectors Lightweight high-resolution vision glasses Call 1: € 63 mn CP, NoE, CSA

11. Provisional draft EF_to_NCPsMtg_Challenge3 - 11 Embedded Systems Design Target outcomes –Theory & methods for embedded systems design Key issues: heterogeneity, composability, predictability & adaptivity International cooperation is encouraged –Suites of interoperable design tools for rapid design & prototyping Research will contribute to interoperability of tools from SME vendors; consolidating tool developers’ joint R&D work; pen tool frameworks Expected impact –Increase system development productivity (at least 1 order of magnitude) –Stimulate growth of European high-tech companies in the field –Reinforce S&T leadership in complex systems engineering Call 1: € 40 mn CP, NoE, CSA

12. Provisional draft EF_to_NCPsMtg_Challenge3 - 12 Computing systems Target outcomes –Novel architectures for multi-core computing systems Architectures & system software for scalable & customisable on-chip computing systems incorporating multiple networked, symmetric or heterogeneous, fixed or reconfigurable processing elements Key issues: power & performance versatility; reliability & availability –Reference architectures for generic embedded platforms Key issues: composability, networking, robustness/security, diagnosis/ maintainability, resource management, evolvability & self-organisation Expected impact –Inexpensive generic platforms with high European added value enabling European supplier companies to increase market share –Develop European competences in the use of high-end computing for the development of new applications –European excellence in computing architectures, system software & platforms Call 1: € 25 mn CP (STREP), NoE

13. Provisional draft EF_to_NCPsMtg_Challenge3 - 13 Foreseen activities under Call 2: 3.3.2.1: Photonic components & subsystems 3.3.2.2: Micro/Nanosystems 3.3.2.3: Networked Embedded & Control Systems

14. Provisional draft EF_to_NCPsMtg_Challenge3 - 14 Components & Subsystems - Lasers & solid-state sources - Image sensors - New sensors Photonic Components & Subsystems Application specific -Broadband core networks -Broadband access & LAN -Medical diagnosis & prevention -Sensors for environment, safety & security applications Underlying technologies Complementary measures Assessment of prototypes Core IntegrationManufacturingDesign methodology & tools Support measures Networking, integration & structuring Access: Expertise centres & foundries Education: Young people & graduates Consensus building: R&D strategies, int’ cooperation Call 2: € 90 mn CP, NoE, CSA

15. Provisional draft EF_to_NCPsMtg_Challenge3 - 15 Micro/Nanosystems Next generation smart systems Sensor- & actuator-based systems Nano-Bio-ICTechnologies convergence Biosensors, lab-on-a-chip, bioMEMS, autonomous implants Smart fabrics and interactive textiles Integration of intelligence in textile materials From smart systems to viable products Microsystems manufacturing technologies Innovative memory systems Emerging technologies for high density mass storage capacity Support actions Technology access, education and training, coordination & dissemination at EU level Call 2: € 83 mn CP, NoE, CSA

16. Provisional draft EF_to_NCPsMtg_Challenge3 - 16 Networked Embedded & Control Systems Target outcomes –Middleware platforms for embedded systems Key issues: composability, minimum power consumption, openness Emphasis: programmability, reconfiguration, privacy & trust –Cooperating objects and Wireless Sensor Networks Spontaneous cooperation of objects in spatial proximity Emphasis on new methods & algorithms, hardware/software platforms for distributed execution & programming & tools for self-organising systems –Control of large-scale complex distributed systems Key issues: efficiency, robustness, safety, security Applications: manufacturing plants, infrastructures Expected impact Enable entirely new services & applications Make large infrastructures more efficient, flexible & productive 100% plant availability, reduce maintenance & accidents Call 2: € 47 mn CP, NoE, CSA

17. Provisional draft EF_to_NCPsMtg_Challenge3 - 17 A spiral model of innovation capitalising on the multiple reciprocal relationships between public & private stakeholders at various knowledge stages European Technology Platforms Addressing major technological challenges in specific domains Aiming to leverage public & private investment for R&D & innovation Involving key R&D stakeholders —eg industry, the research community & public authorities Bundling fragmented R&D efforts towards agreed goals —Vision 2020 document & Strategic Research Agenda 30+ European Technology Platforms launched so far: cordis.europa.eu/technology-platforms POLICY RESEARCH BUSINESS

18. Provisional draft EF_to_NCPsMtg_Challenge3 - 18 1.Emergence & setting up: –„Bottom-up“ process with key stakeholders in a specific domain –Key deliverable: Strategic vision document 2.Definition of a Strategic Research Agenda –Co-ordinated by an Advisory Council –Consensus-based –Deployment strategy 3.Implementation of the Strategic Research Agenda ‐Through collaborative research in FP7 & with other resources, or ‐Through a Joint Technology Initiative (JTI) which integrates funding sources, eg Framework Programme, transnational & nat’l research programmes, industrial funding, 3rd party private finance Commission Staff Working Paper, SEC(2005)800 of 10 June 2005 & Status Report 2 of May 2006 cordis.europa.eu/technology-platforms/further_en.html Joint Technology Initiatives: A way to implement a Strategic Research Agenda

19. Provisional draft EF_to_NCPsMtg_Challenge3 - 19 For more information European research on the web: http://cordis.europa.eu http://cordis.europa.eu/fp7 http://ec.europa.eu/comm/research/future/ Information Society and Media: http://ec.europa.eu/information_society/ http://cordis.europa.eu/ist Directorate G: http://cordis.europa.eu/ist/directorate_g Contact: erastos.filos@ec.europa.eu