1. Customized equipment for Printed circuit board industry Microelectronic industry Solar cell industry

2. Info@mass-pcb.de Hole Plugging Machines and accessories

3. Vacuum Plugging Info@mass-pcb.de Application Types of vias Squeegee System Function Advantages Vacuum Plugging Technical Data Operating Panel Micro section Power Squeegee and Plane Raze Device Contents

4. Vacuum Plugging Info@mass-pcb.de 1. Electric function and/or plating connection under a SMD-Pad, main application. 2. Sealing of via-holes for the vacuum test of printed circuit assemblies with mainly using the screen printing process. 3. Sealing of holes in ML-internal layers in order to get in high-dens holes a homogeneous resin flow of the prepreg when bonding the ML- circuitry. In America it is called “Sublam”. 4. Filling of gaps between conductors, for the time being only at low CU- xxxx< 35µm. For the time being application in Korea, for cosmetical reasons, PSR4000 solder mask. 5. Patent from the USA, production of trough-hole platings in ML-internal layers with specially formulated silver paste, which more or less solders when bonding the internal layer. 6. Coating of metal core panel for the production of new “Power LED´s” under vacuum. Application of the MASS Via Hole Filling

5. Vacuum Plugging Info@mass-pcb.de Through holes can be filled trouble free Blind via-holes allow to be plugged double-sided in one cycle Application min. 2 mil after metallizing Aspect Ratio max. 80:1 pcb: 3 – 360 mil

6. Vacuum Plugging Info@mass-pcb.de Types of vias Plated Through Holes Buried Vias Blind Vias

7. Vacuum Plugging Info@mass-pcb.de Why Plugging ? beforewith via fill

8. Vacuum Plugging Info@mass-pcb.de Process flow drilling metallizing plugging brushing, grinding next build up layer(s)

9. Vacuum Plugging Info@mass-pcb.de Button plating drilling metallizing plugging brushing, grinding next build up layer(s)

10. Vacuum Plugging Info@mass-pcb.de Squeegee System Filling with Filling head and Receiver pcb Receiver Filling head pressure side back side paste

11. Vacuum Plugging Info@mass-pcb.de Squeegee System Filling with two Filling heads (for through holes) paste Filling head Paste pressure separat adjustable Option: heatable heads

12. Vacuum Plugging Info@mass-pcb.de Squeegee System Filling with two Filling heads (for blind vias) paste Filling head Paste pressure separat adjustable Option: heatable heads

13. Vacuum Plugging Info@mass-pcb.de Boards are vertically suspended by the clamping system. Door is automatically closed and the chamber is made vacuous (about 20 sec.). The filling process starts with the paste by piston being pressed out of a cartridge into the bores by compressed air and the squeegee moved all over the pcb. The Contact pressure, filling pressure and squeegee speed are adjustable. An adjustable servomotor allows for the vertical movement. Function

14. Vacuum Plugging Info@mass-pcb.de The vacuum technique allows the blind-via holes and vias to be filled reliably without any air bubbles. All widths are covered by using different squeegees. The squeegee width to be adapted to the pcb-size. (see following „Pluggingarea“). The new cartouche systems allows the lacquer- manufacturer to fill the paste on vacuum conditions. Cartouches not used up can be put into the refrigerator. Very high aspect ratio possible, for the time being 1:80 for non-conductive pastes. With heated filling head, for the time being 1:20 possible for conductive pastes. Double-sided closing of blind-via holes in one single operation. Advantages Vacuum Plugging

15. Vacuum Plugging Info@mass-pcb.de Pluggingarea

16. Vacuum Plugging Machine Info@mass-pcb.de Dimensions (d x w x h):25“ x 99“ x 83“ Pcb widthmax 24“ min 10“ Pcb height max 30“ min 8“ Pcb thickness :0.003” to 0.36” Amount of filling cartoucheca. 300 ml Large container systemca. 2000 ml Compressed air:88 psi 6 bar Weight:1900 lbs Exhaust:ca. 600 m³/h Power Requirements: 480 V 3P/PE, 60 Hz, 5,0 kW or 400 V 3P/N/PE, 50 Hz, 5,0 kW Technical Data VCP 5000-1

17. Software Info@mass-pcb.de All Parameters adjustable by Software

18. Overview Info@mass-pcb.de

19. Squeegee System Info@mass-pcb.de

20. Large container system Info@mass-pcb.de Paste container

21. Micro section Info@mass-pcb.de Picture from a customer

22. Micro section Info@mass-pcb.de Holefilling Process with Vacuum Plugging Machine VCP Holefilling with holefiller PP 2795, Lackwerke Peters Surfaces grinded with MASS Plane Raze Device SV 100

23. Micro section Info@mass-pcb.de Pictures after plating Holefilling with holefiller PP 2795, Lackwerke Peters Surfaces grinded with MASS Plane Raze Device SV 100

24. Micro section Info@mass-pcb.de max. Aspect Ratio 1:80

25. Micro section Info@mass-pcb.de Plugged with Peters Paste PP2795

26. Micro section Info@mass-pcb.de Plugged with Peters Paste PP2795

27. VHF 300 V Info@mass-pcb.de Horizontal work plane

28. VHF 300 V Info@mass-pcb.de Fill head

29. Power Squeegee Info@mass-pcb.de Function The paste is stored inside this tool and is pressed through the holes of the PCB’s with compressed air, which is controlled by a foot switch. You simply control the compressed air as you slowly fill the holes. Advantages cost saving easy to use partial plugging of holes

30. Power Squeegee Info@mass-pcb.de Diaphragm Non-return valve Reservoir for paste Cover Compressed air

31. Power Squeegee Info@mass-pcb.de Advantages Partial Plugging of Holes No more waste from the very valuable Silver Paste No clean up or change from the paste to storage containers No direct contact between the compressed air and the paste Using of up to 44 psi pressure to push the paste through very high aspect ratio (1:30) boards

32. Plane Raze Device SV 100 Info@mass-pcb.de

33. Plane Raze Device SV 100 Info@mass-pcb.de Function The Plane Raze Device removes the cured plugging paste excess after the hole plugging process from pcbs, thus receiving a very plane and flat surface. In the same time the copper is sanded down to a specified thickness all over the board.

34. SV 100, Abrasive compound Info@mass-pcb.de Advantages Due to the special arrangement of the diamond spots the grinding disk does not load. The grinding dust allows to be well suctioned. The grinding disk remains „ sharp“ Therefore, nearly no material heating