1. MEMS FOR HIGH POWER APPLICATIONS Bruce C Kim and Rahim Kasim

2. Plan-view of the MEMS switch ( The dimensions are approximately 300 x 1000 µm2)

3. Isometric-view of the MEMS switch. Fig. Top diagram depicts the switch in the open position; the gap between the gold contact and conduction path is approximately 1 µm. Bottom diagram depicts the switch in the closed position

4. Fabrication ( Metallization of 2X2 array)

5. Fabrication Anchors contact

6. Fabrication 1000 μm 100 μm Gap = 1.5 μm Anchor = 4.2 μm 110 μm 20 μm

7. Fabrication Gap = 1.5 μm Anchor = 4.2 μm

8. Fabrication Anchors Nickel Bridge Contact conduction

9. Testing Fig. Testing of the MEMS switch

10. Testing Fig. Testing of the MEMS switch

11. Testing – (I-V Closed)

12. Testing- (I-V open)

13. Conclusion Extensive testing of 4X4 array underway (ratings and number of cycles). Packaged array on PCB and testing. Integration with diodes.