1. Progress of the Forward Calorimeter R&D Presented by: Igor Emeliantchik DESY Zeuthen:R. Dollan D. Drachenberg, E. Kouznetsova, W. Lange, W. Lohmann NC PHEP, Minsk:K. Afanaciev, I. Emeliantchik Institute of Physics, AS CR, Prague:M. Tomášek, V. Vrba Instytut Fizyki UJ, Cracow:J. Zachorowski Instytut Fizyki Jądrowej PAN, Cracow:W. Wierba

2. Progress of the Forward Calorimeter R&D LCAL Status –Diamond-Tungsten Version Results of Zeuthen Group First Results of Minsk Group –Heavy Crystal Version LAT Status –Silicon Sensors Results of Prague Group Zeuthen Silicon Facilities –Laser measurement of the LAT detector displacementdisplacement

3. Diamond Measurements by Minsk Group

9. Test Setup Cosmic Telescope Alternative: Ru-Source Heavy Crystal Version of LCAL

10. Lightyield fiber readout direct readout ~ 25 %

11. Cross Talk How much light do fibers see from other crystals fiber painted with black paint

12. Cross Talk cosmics ? but ….

13. Cross section Bottom view Active area cca 0.25 cm 2 Preprototype Silicon Sensors (Prague) Sensor Structure

14. I-V curves: Vbreak-down  Vop Ileak @ Vop < cca 30 nA/cm2 nornalized for temperature 20 C

15. Vfull-depletion: substrate resistivity calculation used frequency 10 kHz

16. Wolfgang Lange, DESY Zeuthen: Silicon Detector Projects Kraków, 10-Oct-2003 Zeuthen Silicon Facilities At DESY Zeuthen we are able to perform (class 10k clean room): - Ultrasonic wire bonding (Au, Al, down to 17.5 µm wires) - Glueing with high mechanical precision and/or special hardening procedures (silver epoxies) - Measurements of single and double sided sensors on different probe stations - long term measurements (darkness, special atmosphere: N 2 or similar) - chip testing (delivered probe cards can be adapted) additional:electronics workshop with automatic SMD placement and soldering tools mechanical workshop with NC machining/milling at DESY Hamburg a ‘state of the art’ programmable wire bonder Companies / Institutions we are used to work with: - Sensors: CiS Erfurt (D), Micron Ltd. (UK), SINTEF Oslo (N), Hamamatsu (J) - chip design: IDE AS, Oslo (N) and ASIC Laboratory of University of Heidelberg (D) - probe cards: Wentworth Deutschland GmbH, München (D) - high precision printed circuit boards: Würth GmbH, Roth am See (D), Optiprint (CH) - thick film hybrids: Elbau GmbH, Berlin (D)

17. Position Measurement with Laser and CCD Camera (Cracow)

18. Position measurement