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NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Sensors, Controls and Automation Peter Kennedy Chief Technology.

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Presentation on theme: "NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Sensors, Controls and Automation Peter Kennedy Chief Technology."— Presentation transcript:

1 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Sensors, Controls and Automation Peter Kennedy Chief Technology Officer Moldflow Corporation

2 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Business of Injection Molding Part DesignMold DesignProductionMold Build Multifaceted complex business model & physics Problems found at process end Assembly & Distribution

3 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Moldflow Product Families Design Optimization Solutions

4 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Moldflow Product Families Manufacturing Solutions

5 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Process Optimization and Production Monitoring System Systematic process to set up and optimize injection molding machine Process monitoring and correction Production monitoring of discrete data Resource scheduling SPC & SQC Web-based reports ERP integration

6 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Systematic Process Set Up and Optimization Monitor machine –Pressure sensor In-cavity At barrel Hydraulic –Ram Displacement –Machine data Set up and Optimize then Monitor –Uses simplified simulation algorithms

7 NSF/DOE/APC Future of Modeling in Composites Molding Processes Workshop June 9-10, 2004 Opportunities Apply set up technology to composites –RTM –Long glass fiber Plastication Gate and mold design Develop numerical simulation models for processing and final properties –Use to define control systems for processors New Sensors for Composites –e.g. ultrasound, impedance http://www.signaturecontrol.com/)


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