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IC-SOC Plan on Embedded Memory Defect Diagnostics and Yield Improvement Cheng-Wen Wu
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mem4.11DTC, NTHU 2 Agenda (8:50-10:15) Introduction Cheng-Wen Wu—NTHU Architecture & Compilation for Configurable Processors Guoling Han/Jason Cong—UCLA H.264 Advanced Video Codec Design Youn-Long Lin—NTHU Low-Power FPGA Lei He—UCLA
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mem4.11DTC, NTHU 3 Motivation & Purposes Yield of on-chip memories dominates the overall chip yield Effective memory diagnostics and failure analysis (FA) methodologies are necessary We propose a systematic and automatic methodology for defect diagnostics Fault pattern oriented approach To effectively reduce candidate defects before physical FA
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mem4.11DTC, NTHU 4 Fault Patterns Combining failure patterns and fault types SAF0CFidSAF1 Failure Patterns Failure Patterns Fault Patterns Fault Patterns SAF 0 :00011000100 SAF 1 :00100001001 CFid 0 :00100110001 ……. Fault Types
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mem4.11DTC, NTHU 5 Diagnostics Using Fault Patterns A cause-effect approach: Fault Patterns Fault Patterns Defective Netlist Defective Netlist Realistic Fault Patterns Realistic Fault Patterns Prediction Stage Application Stage SimulationReduction Defect Dictionary Defect Dictionary Defect Candidates
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mem4.11DTC, NTHU 6 Memory Defect Diagnostics (MDD) System Realistic Defect Injection Circuit-level Simulation Fault Pattern Generation Defect Dictionary Generation Faulty Circuits Simulation Results Fault Patterns Design Netlist Layout Defect Size Cond./Distr. Process In-Line Inspection March Dictionary Arch. RAM Spec. Scrambling Test Cond. Patterns Volt./Freq. Failure/Fault Pattern Analyzer AFA Fault Maps from MECA [12] Defect Dictionary Defect Candidates/Statistics
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mem4.11DTC, NTHU 7 Fault Pattern Classification
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mem4.11DTC, NTHU 8 CA Calculator Overview of FFA Short defect injection Layout Defect Distribution Layout Extractor Short Critical Area Calculator Open defect injection Open Critical area calculation Failure Factor Analyzer Defect Information Failure Factor
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mem4.11DTC, NTHU 9 Defect Models ShortOpen Fault freeFaulty Fault freeFaulty Particle
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mem4.11DTC, NTHU 10 Experiment on Industrial Designs Cell ACell B WL Gate Gnd Data Vdd BL Vdd BL Gnd Data % of Area = 114% # of Cont = 8.5 # of Via = 2 % of Area = 100% # of Cont = 8.5 # of Via = 3.5+1 Using 0.18μm CMOS Process Technology
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