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Temperature Sensor Array Using flexible Substrate 9533701 陳俊廷
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Outline Abstract Introduction Design Fabrication Results Conclusions
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Abstract Temperature sensor array based on MEMS technology Temperature sensor array is composed of 256(16×16) sensors inside a 28×20mm 2 area Polyimide (PI) thin film (35μm) with a copper layer (40μm) on one side as the starting material Doubled-sided fabrication process is applied to create the sensing elements and interconnects for scanning circuitry Measuring the resistance of each element in the temperature sensing array
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Introduction Research on artificial skin for robots has been popular, that should be highly arrayed in a requested area on a flexible substrate Higher density on a flexible copper-polyimide substrate Temperature sensing element is a platinum resistor The temperature variation is detected by measuring the resistance change of the resistor due to temperature variation
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Design
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The resistance is proportional to length and inversely proportional to cross-sectional area The platinum layer is designed to be long and narrow ; the copper is relatively wide, in order to ensure that the resistance change is caused by the meandering platinum patterns Copper layer was designed to be 10 times larger than platinum The resistivity is 10.6μΩ-cm for platinum and 1.68μΩ-cm for copper
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Design
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Fabrication
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Results A thermocouple is used for measuring the accurate ambient temperature α is the TCR of platinum T 0 is the ambient temperature
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Conclusions A 16×16 temperature sensor array in a 28×20mm 2 area is fabricated on a flexible copper-PI substrate using MEMS fabrication technology The dimensions of the copper and the platinum patterns are carefully designed to ensure the temperature dependent resistance of the copper layer is negligible during the temperature measurement
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