1. 1 Copyright 2003 © Hong Kong Science & Technology Parks Corporation Rev.2 6/1/2003 Presented by: S W Cheung, Vice President, Business Development and Technology Support Hong Kong Science and Technology Parks Corporation 14 January 2003 IC Design / Development Support Centre

2. 2 Aims and Objective To provide total one-stop service to IC design companies from design start to production release To help IC design companies in the whole new product development process flow To attract worldwide IC Design companies to move to Hong Kong

3. 3 IC Design Is Important One of the most important technologies enabling high value-added electronic manufacturing industry Hong Kong has a few distinctively advantages over other countries in developing into a major international IC design centre

4. 4 Hong Kong’s Advantages Geographically close to PRC where… One of the biggest production centres in the world Has a very strong demand for IC High accessibility to latest market information worldwide through superb communication systems A robust financial market to help companies raise project funds Has a strong legislative regime for protection of intellectual property

5. 5 Major Successful Factors for IC Design Industry Time to market Lowest possible cost Deliver workable IC designs to end users We provide the necessary “soft” infrastructure support for the IC design industry

6. 6 Quality Infrastructure and Shared Support Facilities IC Design Data Centre for design data base storage Electronic Design Automation (EDA) Centre IC Development Support MPW (Multi-Project Wafer) Wafer Shuttle Service Probe and Test Development Centre Reliability and Failure Analysis Lab IC Designer Training Centre

7. 7 Target End Users and IC Designs HKSTP tenants, incubatees, IC companies who have R&D investments in Hong Kong plus strategic partners Small to medium size companies and incubatees Mixed signal / analog / RF IC designs using 0.18 / 0.25um process technologies Initial focus of the Centre: To support mixed signal / analog / RF IC designs with upgrade capability to support SOC designs within 2 years

8. 8 Data Center Provides a number of high end powerful computing servers shared among end users The management of Data Centre will be outsourced to an experienced neutral third party: To enable right and strict data ownership with backup operation To ensure the protection of intellectual property created by end users The computing servers will be open grid service architecture enabled to provide user enough computing power on design simulation and verification

9. 9 EDA Centre To provide design tools as shared resources for end users To provide multiple user license, users will save the upfront license fees on high cost, and less frequently used EDA tools To allow users to share the integrated EDA tools through the EDA-on-demand system, at a lower cost

10. 10 Multi-Project Wafer (MPW) Shuttle Service To allow a maximum of 16 different designs in one mask set To help end users save the total mask set cost to enjoy the MPW service

11. 11 The Probe & Test Development Centre Will be equipped with several sophisticated automatic test equipments, wafer probers, IC handlers, advanced RF lab equipments Will be supported by experienced test development engineers To help end users on test package development

12. 12 The Probe & Test Development Centre Equipments to be installed in the centre are: Agilent 93000 model P600 Mixed Signal Tester Credence Quartet Mixed Signal Tester IMS Silicon Validation System Gimini Credence ASL 3000 RFIC Tester Teradyne J750 Digital Tester Eagle ETS300 Analog Tester Electroglas 4090U Prober RF Lab Equipments

13. 13 Reliability and Failure Analysis Lab Will be equipped with IC Life and Environment test equipment. Examples are burn-in-oven, thermal shock chamber and climate test chamber for IC reliability and quality assurance To purchase advanced measurement and analysis equipment to support 0.13um and submicron IC evaluation and circuit editing. Examples are: Focus Ion Beam Scanning Electron Microscope Laser Scanning Microscope for front and backside signal acquisition

14. 14 IC Designer Training Centre To keep practitioners abreast of new technologies needed for the IC design industry To develop training program to convert electronic engineers to IC designers To collaborate with the IC Design Industry

15. 15 Acknowledgement to strategic sponsors of the IC Design/ Development Centre ASAT Cadence Credence Electroglas PCCW SUN Microsystems Synopsys And more...