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Slide 1-OGP status & module reinforcementDOE review, January 20, 2004 Status of OGP & Module reinforcement Andrea Allen Development Technician DOE Review January 20, 2004
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Slide 2-OGP status & module reinforcementDOE review, January 20, 2004 Overview of OGP OGP is commercial high precision (< 1 μm) automated measuring machine with programmable pattern recognition software Higher precision than gantry Provides independent survey of modules Used to cross check gantry calibration
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Slide 3-OGP status & module reinforcementDOE review, January 20, 2004 Status of OGP 2002 Beginning to write programs on OGP to automate after cure survey. à Programs not very repeatable Manually enter data from OGP into excel spreadsheets à Time consuming à Prone to data entry error
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Slide 4-OGP status & module reinforcementDOE review, January 20, 2004 Status of OGP today Reliable and repeatable programs written for all assembly plates à User friendly, only minimal knowledge of measurement software needed. Much faster than surveying on the gantry à Can survey 3 plates, 9 modules, on OGP in 20 min, same 3 plates take 45 min on the gantry à Frees gantry for production
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Slide 5-OGP status & module reinforcementDOE review, January 20, 2004 New software Bought SmartReport software to interface with exiting measurement software à Enables direct exportation of survey results into excel à Eliminates possibility of data entry error Excel macros written to analyze data à Automatically converts numbers from OGP coords to module coords à Compares measured values to nominal values à Creates text files that are uploaded to database
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Slide 6-OGP status & module reinforcementDOE review, January 20, 2004 Broken Bonds in Transport Four shipments of modules from the USA to CERN by 3 different methods of transport: à All were damaged in similar manner à Many broken bonds – particularly between sensor and pitch adaptor à Very time consuming repair work At UCSB we performed extreme drop tests that also resulted in sensor to sensor bonds being broken as shown above
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Slide 7-OGP status & module reinforcementDOE review, January 20, 2004 Reinforcement with Sylgard After many studies (drop, vibration, and thermal), TOB and TEC modules all found to be fragile UCSB developed a reinforcement technique using Sylgard. Sylgard is a silicon based encapsulant à Used to encapsulate ALL wire bonds on innermost layer of CDF à Working temperatures –50C to 200C à Radiation hard à Low thermal conductivity Apply this material to back sides of modules at sensor-PA joint and sensor-sensor joint
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Slide 8-OGP status & module reinforcementDOE review, January 20, 2004 Drop Test Results With minimal packaging we dropped the reinforced modules 1 meter! à Almost all bonds broke on the control module (with no reinforcement) à No obvious deterioration of bond pull strengths for reinforced modules
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Slide 9-OGP status & module reinforcementDOE review, January 20, 2004 Automating reinforcement Bought small gantry and glue dispensing robot to automate reinforcement à Faster and more uniform that applying by hand à Uses static mixer to dispense glue eliminating air bubbles in glue –saves time evacuating air bubbles à Both machines are easy to program and easily communicate with each other
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Slide 10-OGP status & module reinforcementDOE review, January 20, 2004 Glue Gantry Designed bracket to mount glue dispenser to gantry and fixture for module carriers Program written to dispense glue beads à Have reinforced 17 modules Very fast, can reinforce 20 modules in 15 minutes à At peak production plan on 15 modules per day Glue beads are very uniform
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Slide 11-OGP status & module reinforcementDOE review, January 20, 2004 Conclusion OGP automated and results are uploaded to database à Frees up gantry for production increasing our daily production capacity OGP provides more precise measurements than gantry à Also provides an independent measurement of gantry Problem found with wire bonds breaking during transportation à Studies found application of Sylgard beads to modules solves this problem Bought small gantry to automate reinforcement process à Can reinforce modules in a minimal amount of time
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