1. Modeling of Coupled-Fields Problem in Materials Processing with Ultrasonic Vibrations Chunbo (Sam) Zhang, Leijun Li Materials Processing & Testing Laboratory Mechanical & Aerospace Engineering Department Utah State University Supported by NSF Grant DMI-0522908

2. Introduction  A revolutionary process technology that uses sound to merge layers of metal drawn from featureless foil stock  A complicated process with coupled mechanical and thermal fields under ultrasonic wave.  Produces true metallurgical bonds with full density  Works with a variety of metals  A revolutionary process technology that uses sound to merge layers of metal drawn from featureless foil stock  A complicated process with coupled mechanical and thermal fields under ultrasonic wave.  Produces true metallurgical bonds with full density  Works with a variety of metals

3. Benefits of UC  Low process heat enables electronics embedding  Non-destructive, fully-encapsulating fiber embedding  Complex internal geometries  Fully enclosed, sealed internal cavity creation and object embedding  Dissimilar material joining  Rapid manufacturing  Low process heat enables electronics embedding  Non-destructive, fully-encapsulating fiber embedding  Complex internal geometries  Fully enclosed, sealed internal cavity creation and object embedding  Dissimilar material joining  Rapid manufacturing

4. Schematic and Device of UC  Solidica TM Form-Action ultrasonic consolidation system purchased by Utah State University Schematic of UC Process

5. Applications of UC 3-D Complex GeometriesMetal-Matrix Composites Metal Composite Shields (Dissimilar Metal Joining) Real-time Sensing (Non-invasive, Non-destructive)

6. ANSYS Model for UC Simulation 3-D Thermo-Mechanical Coupled Dynamic Model (a) solid model, (b) meshed model 3-D Thermo-Mechanical Coupled Dynamic Model (a) solid model, (b) meshed model

7. ANSYS Simulation Conditions  Normal pressure: 1800 N  Vibration amplitude: 16 µm  Vibration frequency: 20 KHz  Preheat temperature : 300 o F  Normal pressure: 1800 N  Vibration amplitude: 16 µm  Vibration frequency: 20 KHz  Preheat temperature : 300 o F

8. Governing Equations in ANSYS for UC Linear Material Behavior Von-Mises Yielding Criteria Plastic Strain equation

9. Governing Equations in ANSYS for UC Isotropic Hardening Rule Transient Dynamic Equation for a Linear Structure

10. Governing Equations in ANSYS for UC Conduction and Convection Heat Flow

11. Simulation Results – Temperature Field Distribution of Temperature at the 700th Vibration Cycle (X-Y Plane, o F)

12. Simulation Results – Plastic Strain Field Distribution of von-Mises Plastic Strain at the 700th Vibration Cycle (X-Y Plane)

13. Conclusions  The friction heat flux at contact surface increases initially and decreases in the later period of ultrasonic bonding.  In the plastic region, three concentration areas occur at the contact surface, one in the central and other two at the two extremes of the sonotrode vibration.  The friction heat flux at contact surface increases initially and decreases in the later period of ultrasonic bonding.  In the plastic region, three concentration areas occur at the contact surface, one in the central and other two at the two extremes of the sonotrode vibration.

14. Welcome Questions and Comments !