1. US Tracker Project – CERN - July 17, 2003 - Incandela 1 US Production Readiness CMS Tracker Week 17/06/03 CERN J. Incandela University of California Santa Barbara

2. US Tracker Project – CERN - July 17, 2003 - Incandela 2 Fermilab (FNAL) L. Spiegel, S. Tkaczyk +4 technicians+guest scientist Kansas State University (KSU) T.Bolton, W.Kahl, R.Sidwell, N.Stanton, E.V.Toerne+grad student University of California, Riverside (UCR) Gail Hanson, Gabriella Pasztor, Patrick Gartung, + post-doc University of California, Santa Barbara (UCSB) A. Affolder, S. Burke, C.Campagnari, A. Gupta, D. Hale, C. Hill, J.Incandela, S. Kyre, J. Lamb, S. Levy, C. Mills, B.Patterson, S.Stromberg, R.Taylor, D. White +3 technicians + 3 undergrads University of Illinois, Chicago (UIC) E. Chabalina, C. Gerber, T.Ten University of Kansas (KU) P. Baringer, A. Bean, L. Christofek, D.Coppage, X. Zhao University of Rochester (UR) R. Demina, R. Eusebi, E. Halkiadakis, A. Hocker, S. Korjenevski, P. Tipton Active Group

3. US Tracker Project – CERN - July 17, 2003 - Incandela 3 Manpower (Non-faculty)

4. US Tracker Project – CERN - July 17, 2003 - Incandela 4 Outline Production model and parts flow Status of each production stage  Gantries and curing stations  Wire bonding  Module test stands  Database  Rod burn-in with interlocks  Rod shipment Current Capacity Parts inventory Problems and concerns

5. US Tracker Project – CERN - July 17, 2003 - Incandela 5 Overview FNAL and UCSB will have equal capabilities and capacities  FNAL production line Gantry operational – made ~24 operational TOB modules. 1 of 4 DAQ and 4 of 4 ARCS  UCSB Production line Gantry operational –made ~19+8 operational TOB modules 2 of 3 DAQ and 5 of 5 ARCS  UCR module diagnostics and repair 0 of 1 DAQ and 0 of 1 ARC TOB Module Summary Table

6. US Tracker Project – CERN - July 17, 2003 - Incandela 6 Module Production Plan Hybrids  New UCSB Task: Wirebond &Test: Quick Test then Wirebond pa’s Thermal cycle with continuous ARC test and pitch adapter pulsing Adds 3.3 Million bond wires  Ship half to FNAL Frames and sensors  Received by FNAL  Sample checks at Rochester  Ship half to UCSB Module production: FNAL & UCSB  Gantry fabrication of 12+ modules per day per site (average=9 at peak) Overnight cure Cross-check on OGP  Wirebond 12+ modules/day/site Recent significant improvements  Fast test with ARC/LED Simple repairs  Overnight temp cycling with readout in “Vienna box”  Full characterization with ARC/LED  Store for installation in rods Have storage for 1400 modules! Diagnostics and Repairs Extremely Pathological modules will be pulled out of production and sent to UC Riverside.

7. US Tracker Project – CERN - July 17, 2003 - Incandela 7 Rod Production Rods with optohybrids  Ship to both FNAL and UCSB Rods at US Sites  Modules mounted  Capacity: 2-3 SS6 rods/day per site  Long Term Testing 8 rods simultaneously per site for 72 hours with 3 thermal cycles per day with data taking  Final test at US site Rods shipped to CERN Currently  Received first rod with prototype optohybrids at UCSB  All tooling for handling the rods Rotation and handling fixtures, Module handling fixture, Torque wrench and insertion tool (no extraction) Cable forming tools, and other specialized tools  UCSB redesigned module insertion tools to use vacuum pickups.  Expect low voltage power supplies and cables in early August.  Plan to build and test first rod in September.  1 st Rod burn-in stand ready at FNAL in October

8. US Tracker Project – CERN - July 17, 2003 - Incandela 8 Gantries FNAL and UCSB Production to date  FNAL+UCSB 24+27=51 functional modules Many have been used in test beam Currently can handle1 tray of 3 modules per day Peak rate per location  Up to 4 trays per day (12 modules). Some inspected on OGP Identical OGP AVANT optical inspection machines at FNAL and UCSB

9. US Tracker Project – CERN - July 17, 2003 - Incandela 9 FNAL Status Recently commissioned 3 of 6 new assembly plates Corrections vary plate to plate Overall sensor placements are all well within specs. 5  m is not always met. 10  m spec is not a problem. Final rotations are all under 6 mdeg

10. US Tracker Project – CERN - July 17, 2003 - Incandela 10 UCSB Gantry in New Clean Room ~30 minutes to run assembly program for 3 modules  Including preparation (glue, parts, DB), <1 hour to produce 3 modules

11. US Tracker Project – CERN - July 17, 2003 - Incandela 11 UCSB Data on Modules 10+6 more modules built in last month (19+8 in total now)

12. US Tracker Project – CERN - July 17, 2003 - Incandela 12 Data on Modules (3) Completion of 3 new assembly plates imminent Stereo assembly plate under design –to be ready in September FNAL and UCSB need low grade parts for dummy modules – sensors & frames – to qualify new plates, and to recover from down periods as they occur in production. Silicon to frame angles all under 11 mdeg

13. US Tracker Project – CERN - July 17, 2003 - Incandela 13 Wirebonding Installed 3 rd K&S 8090 at FNAL  Now operational and will be used for subsequent FNAL modules. UCSB wirebonder  bond head problem fixed.  Meanwhile learned to fully automate bonding of entire TOB module using K&S pattern recognition: Approaching 20’ per module including setup time. UCSB considering K&S 8060  Adequate for hybrids  Many used ones available: 20k$ to 50k$.

14. US Tracker Project – CERN - July 17, 2003 - Incandela 14 The TOB Electronic Testing Cycle Quick test hybrids on ARCGantry makes modules. Modules test on ARC Assemble rods from modules Rod burn-in Rods shipped to CERN Thermal cycled module Wire bond Final pinhole test on ARC Wire bond Thermal cycle hybrids

15. US Tracker Project – CERN - July 17, 2003 - Incandela 15 Majority of preparations complete Many added preparations to smooth production have been completed  Test stand clam shell boxes with LED arrays  Module carrier plates  Test pigtails  Vienna boxes  Storage racks  HV crowbar for test stands 4 hybrid thermal cycling/test box almost complete. Expected to be ready for use in August.  Currently plan to ramp up hybrid completion task in September, taking over for CERN.

16. US Tracker Project – CERN - July 17, 2003 - Incandela 16 Rod LT Test Facility (RU Group) Peak production < 10 rods per week per site.  Schedule ~ 25/month/site. Capacity ~ 45.  72 hour “burn-in” with slow thermal-cycling Each site will have capacity of 8 SS rods. Hardware all specified and in process  Chest freezer, plumbing, flow meters, valves are almost all in hand.  All machined parts complete  Low temp chiller and C 6 F 14 are at FNAL – ready. Interfaces nicely with control PC +20 C to –25 C in 1.5 h  Chiller DAQ system Programming mostly complete Interlock software ready First system to be shipped to FNAL in August and fully operational by October.

17. US Tracker Project – CERN - July 17, 2003 - Incandela 17 Transport Crate Al Rod boxes in a larger crate.  Rochester group has studied this in detail. Designed for cushioning >10g internally  Commercial ABS plastic cases 4 rods/layer in ~10 layers with interleaved foam Rod boxes sealed in N 2 filled anti-static sleeve.  Container ~ 80 kg and each rod box is 3 kg. Total weight per full shipment will exceed 220 kg Rochester to Helsinki with shock logger. No problem!

18. US Tracker Project – CERN - July 17, 2003 - Incandela 18 Other Items Stereo module production readiness  Stereo wirebond fixture parts are now being machined  Stereo gantry plates now being designed  Expect to be ready to make stereo modules at UCSB in mid- September

19. US Tracker Project – CERN - July 17, 2003 - Incandela 19 Broken Bonds in Transport Four shipments of modules from the USA to CERN by 3 different methods of transport:  All were damaged in similar manner.  Many broken bonds – particularly between sensor and pitch adaptor. At UCSB we performed extreme drop tests that also resulted in sensor to sensor bonds being broken as shown above.

20. US Tracker Project – CERN - July 17, 2003 - Incandela 20 Reinforcement with Sylgard Sylgard is a silicon based encapsulant  Used to encapsulate ALL wirebonds on innermost layer of CDF  Working temperatures –50C to 200C  Radiation hard  Low thermal conductivity Applied long or short beads of this material to back sides of modules at sensor-pa joint and sensor-sensor joint

21. US Tracker Project – CERN - July 17, 2003 - Incandela 21 Drop Test Results With minimal packaging we dropped the reinforced sensors 1 meter!  Almost all bonds broke on the control module (with no reinforcement)  No obvious deterioration of bond pull strengths for reinforced modules

22. US Tracker Project – CERN - July 17, 2003 - Incandela 22 Effect on Cooling:Test Setup Used two modules  One with full glue bead between carbon fiber and sensor  One unmodified Measured temperature of carbon fiber (hybrid location) and sensor (near hybrid)  Temperature measurement good to  0.03 C Temperature Sensor Locations

23. US Tracker Project – CERN - July 17, 2003 - Incandela 23 Thermal Cycle (Control Module) Thermal cycle without any modifications  Ran until temperature stabilized  Began cooling  Once at low temperature, began running chip until temperature stabilized  Began warm-up Cooling plate and sensor temperature matched well  T=2.3 C between carbon fiber and sensor  CERN cooling mock-up using final carbon fiber and heater saw  T=2.7 C

24. US Tracker Project – CERN - July 17, 2003 - Incandela 24 Thermal Cycle (Glue Module) Thermal cycled module with full glue bead  Same Thermal Cycle  T=2.0 C between carbon fiber and sensor

25. US Tracker Project – CERN - July 17, 2003 - Incandela 25  T between Carbon Fiber and Sensor Adding full bead of glue increases sensor temperature by 0.3 C

26. US Tracker Project – CERN - July 17, 2003 - Incandela 26 Additional Concern 39 modules tested  28 of which have been tested at both 250 & 550 V Of those 28 modules, 10 modules have entire chips with >2x regular noise  All have a larger bias current than expected from sensor probing  Four of these 10 modules have been visually scanned and we find no obvious sensor damage. 9-15 wire bonds have to be removed to reduce the noise of chip to normal values, 666

27. US Tracker Project – CERN - July 17, 2003 - Incandela 27 Module 869 Modules with as little as 2  A extra bias current relative to sensor probing data have exhibited extremely large noise. Module 869 shows increased noise on first chip at ~425 V. Other chips have had increasing noise starting at 100-450 V. Module 869

28. US Tracker Project – CERN - July 17, 2003 - Incandela 28 Noise Vs. Voltage ~1-2 channels per module have increasing noise with bias voltage  In most cases, sensor flaws can be seen optically We are concerned that these channels may be less extreme examples of same problem  It is NOT clear how these modules will change with time, radiation damage, and temperature. Further testing, particularly radiation and long term operation, is necessary  In CDF SVX’ we pulled bonds on ALL such channels and tied those strips to ground through a capacitor.

29. US Tracker Project – CERN - July 17, 2003 - Incandela 29 Summary & Concerns Now able to fabricate and fully test&burn-in 35 single sided modules per week.  Could build and wirebond 3 times this number but we do not have adequate burn-in capability yet. Rod assembly preparations well underway.  First rod is to be built and tested this September.  First LT Rod test stand to be ready by September Transportation of rods is under control.  Indications are clear that breakage of bonds during transport can be avoided. We need to agree on exact solution to start production. Only real concern is the problem of APV instability for noisy strip inputs.  We will make ~35 more modules in US in next few weeks and conduct extensive studies in collaboration with Karlsruhe.