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1 UCSB Module Assembly Week of 4/25 – 4/29. 2 UCSB Parts Inventory 5/2/05 Hybrids Sensors Frames STHPKITSTHPKIT L12pu85176067222141ST193 L12pd00067222141ST193.

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Presentation on theme: "1 UCSB Module Assembly Week of 4/25 – 4/29. 2 UCSB Parts Inventory 5/2/05 Hybrids Sensors Frames STHPKITSTHPKIT L12pu85176067222141ST193 L12pd00067222141ST193."— Presentation transcript:

1 1 UCSB Module Assembly Week of 4/25 – 4/29

2 2 UCSB Parts Inventory 5/2/05 Hybrids Sensors Frames STHPKITSTHPKIT L12pu85176067222141ST193 L12pd00067222141ST193 L12su00067222141ST76 L12sd00067222141ST76 L34pu85176067222141ST~1100 L56p0127791393490~1100 R5N1629118pr236 pr038 R5S944018pr236 pr041 R615800118pr0174 R7000072pr0198

3 3 UCSB Module Assembly – Mech. Specs. Weekly Cumulative ABFABF% A or B L12pu0000000.00% L12pd0000000.00% L12su0000000.00% L12sd0000000.00% L34p00010820100.00% L56p38102845199.7% R5N0004020100.00% R5S000311197.0% R63940728198.8% R70000000.00% Total775053618399.5%

4 4 UCSB Module Assembly Problems Past Week –Sensor came down on TEC R6 frame clamp. Machined flat on all R6 frame clamps to give more clearance to the sensor. Machined flat on all TOB R-phi frame clamps since they had similar clearance. –Recessed all the PA alignment pins since we had a couple more large PA chips. –Starting to build modules with some of the sensors that we had set aside for scratches, tool marks, residue, etc. Some of these had be tested at the probing centers and were within spec. There are a few sensors that have major scratches or marks. These should probably be re-probed before using.

5 5 Wirebonding This Week –Hybrids Bonded: 42 TOB 4 chip 34 TOB 6 chip –Modules Bonded: 39 TOB 6 chip 43 TEC R6


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