1. NUMERICAL ANALYSIS OF UNIFORM SEMI-POROUS HEAT SINK FOR CHIP THERMAL MANAGEMENT Eric Savery

2. Problem Description Engineers have struggled to design CPUs that run much faster than about 3.5 GHz due to thermodynamic limits in current semiconductor. Per Moore’s Law power consumption of transistors doubles every 18 months if thermal resistance. For every 10ºc that you are able to reduce a transistors temperature the failure of the electronic component is halved.

3. Concept Using the fundamentals of thermodynamic this project analyzes how the use of semi- porous material affects amount of heat energy that is able to be transfers from a transistor (CPU) to the surrounding atmosphere.

4. Theory A heat sink’s ability to dissipate the heat energy is a function of the material properties, geometry and the environmental conditions. Heat sink surface area Material copper vs aluminum Atmophere temperature For this project the use of a semi-porous material effects the geometry of the heat sink.

5. Expected Results A heat sink that is made from a porous material should theoretically have a surface area exponentially larger than that of a conventional heat sink (ie. Fin). Increasing surface area should therefore increase in the amount of thermal energy to be transferred.

6. Milestone