1. SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002

2. 8/10/2002Michel Morel EP/ED2 1.PIXEL BUS AND PILOT MCM CONNECTIONS 2.PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS 3.PIXEL BUS PROTOTYPE PRODUCTION 4.BONDING WIRE TESTS 5.STATUS OF PCB 6.CONCLUSION

3. 8/10/2002Michel Morel EP/ED3 PIXEL BUS AND PILOT MCM CONNECTIONS

4. 8/10/2002Michel Morel EP/ED4 400µ 240µ 500µ DETECTOR PIXEL CHIP SMD COMPONENTS 0402 MCM SMD COMPONENTS 0402 Digital pilot LASER DIODE PIXEL CARRIER EXTENDER 1 EXTENDER 2 GLOB TOP COOLING TUBE 100µ 1.2mm 350µ LASER DIODE 500 PIXEL BUS AND PILOT MCM CONNECTIONS

5. 8/10/2002Michel Morel EP/ED5

6. 8/10/2002Michel Morel EP/ED6 PIXEL BUS AND PILOT MCM CONNECTIONS Top view

7. 8/10/2002Michel Morel EP/ED7 PIXEL BUS, PILOT MCM and EXTENDERS CONNECTIONS Sense + Sense - MCM 2.5V Sense + Sense - Pixel chips 1.8V Laser diode

8. 8/10/2002Michel Morel EP/ED8 VDD Copper Kapton1(top) PIXEL__EXTENDERS if VDD=VDDA=VTT=VTTA=1.8V Cross section Cover-lay 50µm 100µm ~50µm Top view Kapton2 (bottom) GND Pixel_carrier Sense+ VDD 12mm Sense- GND I=7A DDP=102mV P(half stave) = 715mW P(half detector) = 42.9W GND VDD=1.8V

9. 8/10/2002Michel Morel EP/ED9 EXTENDERS WITH CABLES 1m Cable AWG 10: diameter 2.79mm area 4.6mm² weight 41.49 g/m Rmax 0.4  /100m Ddp at 7A = 56mV P(half stave) = 392mW P(half detector) = 24W

10. 8/10/2002Michel Morel EP/ED10 Pixel_bus prototype production Epoxy Al Cu (base) LASER DIODE 500

11. 8/10/2002Michel Morel EP/ED11 Epoxy Al Cu (base) 300µm Pixel_bus prototype production

12. 8/10/2002Michel Morel EP/ED12 Epoxy (5  ) Al Cu (base) ! Pixel_bus prototype production

13. 8/10/2002Michel Morel EP/ED13 Epoxy Al Cu (base) Kapton Pixel_bus prototype production

14. 8/10/2002Michel Morel EP/ED14 Epoxy Al Cu (base) 300µm Kapton 300µm Pixel_bus prototype production

15. 8/10/2002Michel Morel EP/ED15 Epoxy Al Cu (base) 300µm Kapton ! Cu x Cu y Pixel_bus prototype production

16. 8/10/2002Michel Morel EP/ED16 PIXEL BUS CROSS SECTION Glue 5µ Kapton 8µ Liquid Polyimide 8µm 280µm Cu 5µ +Ni/Au (1µm) Cu 10µ + Ni/Au (1µm) 1) AGND 50µm 2) VDDA 30µm 3) Horizontal lines 4) vertical lines 5) VDD 15µm 6) GND 50µm 7) Resistors + capacitors pads+ Fastor Aluminium

17. 8/10/2002Michel Morel EP/ED17 Cu (base) BONDING WIRE TESTS

18. 8/10/2002Michel Morel EP/ED18 Cu (base) 9~10g BONDING WIRE TESTS

19. 8/10/2002Michel Morel EP/ED19 Cu (base) Al BONDING WIRE TESTS Al (99%) + Si (1%) 1g!

20. 8/10/2002Michel Morel EP/ED20 Status of PCB Pixel_carrier_B. Pixel carrier interface. Pilot MCM. Pilot MCM daughter card.

21. 8/10/2002Michel Morel EP/ED21 Pilot MCM daughter card

22. 8/10/2002Michel Morel EP/ED22 CONCLUSION Power supplies modifications should be finalized ASAP. PIXEL BUS in production: 10 normal, 10 mirror. First mirror bus mounted on PIXEL interface end of October PILOT MCM will be assembled this month (October 2002) and mounted on the daughter card interface.