1. PCB design and fabrication Lin Zhong ELEC424, Fall 2010

2. Alternatives to PCB Breadboard 2 Breadboard prototype of the first IBM PC motherboard (1981) http://www.yourdictionary.com/computer/breadboard

3. Alternative to PCB (Contd.) Prefabricated PCB 3 Digikey.com

4. Outline Basic concepts Introduction to EAGLE A small design project 4

5. PCB design concepts 5 Function DesignSchematic Layout Routing Form factor constraints Production Assembly Component library Design tools PCBexpress.com Any local workshops Design rules

6. Schematic Capture 6

7. Layout and Routing 7

8. Layout and Routing (Contd.) 8

9. Component Library Component packaging – Surface mount technology (SMT) – Through-hole packaging 9

10. Chip packaging Through-hole – Dual in-line(DIP) – Pin grid array (PGA) Surface mount – Quad flat (QFP) – Ball grid array (BGA) Socket-based – Land grid array (LGA) 10 Core 2 Duo E6700 XC68020

11. PCB design concepts 11 Function DesignSchematic Layout Routing Form factor constraints Production Assembly Component library PCB design tool PCBexpress.com Any local workshops Design rules

12. Production Patterning (etching) – Subtractive process to remove copper cover from a preimpregnated substrate – Silk-screen printing of etch-resistant inks Lamination – Multilayer PCBs Drilling (vias and holes) Coating ( Solder and Solder mask /resist) Printing text and symbols 12 http://www.unitechelectronics.com

13. Assembly Pick & place machine 13 http://www.europlacer.com

14. Assembly (Contd.) 14

15. Assembly (Contd.) Soldering – Wave soldering – Reflow oven 15

16. Wave soldering Waves of liquid solder Board passes the waves Large devices, high pin count, through-hole 16

17. Reflow Oven Heat the board up (infrared) Small, surface mounted components 17

18. Further Reading How motherboards are made – http://www.pcstats.com/articleview.cfm?articleid=1722 http://www.pcstats.com/articleview.cfm?articleid=1722 18

19. Caveats Locations of components Orientation of components Height of components Polarity of components SMT vs. Through-hole components 19

20. PCB vs. IC 20 Function DesignSchematic Layout Routing Form factor constraints Production Assembly Component library Design rules Synthesis Integrated

21. PCB vs. IC production Polymer composite board Silkscreen printing, photoengraving – Etch away copper Copper wires Place components on top of board Soldering Silicon wafer Photolithography Metallic (copper) wires Make devices such as transistors on the wafer Modification – Ion implantation, furnace anneal Deposition – Physical vapor deposition (PVD) – Chemical vapor deposition (CVD) 21 Small scale and large # of devices