1. 3/5/2007(c) 2007 UEI Inc.1 Design Review United Electronic Industries DNR-12 -3U 12 DNA Rack With CPU/NIC Enclosure

2. 3/5/2007(c) 2007 UEI Inc.2 Enclosure Requirements Enclosure to be 19” rack mountable, wall mountable and table top capable Aluminum sheet metal construction, painted black Max size: 5.25”H x 17.5”W x 5.5”D Custom backplane for plug-in modules Accept 15 Custom Designed Plug-in Modules: –12 I/O Modules (Plus 1 Extension Bay) –CPU/NIC Module –DC Input Module –Buffer Module Forced air cooling via 3 or 4 axial fans –System to be pressurized to minimize dust infiltration Removable air filter (s)

3. 3/5/2007(c) 2007 UEI Inc.3 Layout Drawing

4. 3/5/2007(c) 2007 UEI Inc.4 Enclosure Isometric View

5. 3/5/2007(c) 2007 UEI Inc.5 Enclosure Front View

6. 3/5/2007(c) 2007 UEI Inc.6 Air Flow Cross Section

7. 3/5/2007(c) 2007 UEI Inc.7 Enclosure W-Modules DC Input I/O Module CPU/NIC Chassis I/O Expansion Buffer

8. 3/5/2007(c) 2007 UEI Inc.8 Enclosure Empty

9. 3/5/2007(c) 2007 UEI Inc.9 Enclosure Exploded ISO Front Mounting Brackets Removable Rear Fan Panel 60x10mm Fans

10. 3/5/2007(c) 2007 UEI Inc.10 Enclosure Exploded ISO Rear Air Filter Backplane Removable Rear Fan Panel

11. 3/5/2007(c) 2007 UEI Inc.11 Chassis EMI Gasket

12. 3/5/2007(c) 2007 UEI Inc.12 Chassis Exploded View Card Cage Left Side Panel Right Side Panel Base Plate Rivets

13. 3/5/2007(c) 2007 UEI Inc.13 Backplane

14. 3/5/2007(c) 2007 UEI Inc.14 Module Requirements I/O and CPU/NIC modules to utilize existing PCB Front Panel captive fastener Inserter/extractor Plug into custom backplane Ability to get DC power from backplane EMI shielding gaskets between modules New DC Input and Buffer modules Blank filler module required to cover unused bays

15. 3/5/2007(c) 2007 UEI Inc.15 CPU/NIC Module

16. 3/5/2007(c) 2007 UEI Inc.16 I/O Module

17. 3/5/2007(c) 2007 UEI Inc.17 Buffer Module

18. 3/5/2007(c) 2007 UEI Inc.18 DC Input Module