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Research and Development for the HFT at STAR Leo Greiner BNL DAC 03/15/2006.

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Presentation on theme: "Research and Development for the HFT at STAR Leo Greiner BNL DAC 03/15/2006."— Presentation transcript:

1 Research and Development for the HFT at STAR Leo Greiner BNL DAC 03/15/2006

2 LG - BNL DAC - March 20062 STAR HFT Two layers –1.5 cm radius –4.5 cm radius 24 ladders –2 cm X 20 cm each –~ 100 Mega Pixels Purpose: Greatly improve charm hadron capability in STAR

3 LG - BNL DAC - March 20063 R&D for the HFT The mechanical aspects of this detector require significant R&D. This is also true for the electronics and readout. Phased approach => Development of mechanical structures and first generation prototype detectors and readout in R&D phase.

4 LG - BNL DAC - March 20064 Prototype HFT Readout Functional Goals Digitize every 20 ns. Triggered detector system fitting into existing STAR infrastructure. Deliver full frame events to STAR DAQ for event building at approximately the same rate as the TPC. Reduce the total data rate of the detector to a manageable level (< TPC rate) Reliable, robust, cost effective, etc.

5 LG - BNL DAC - March 20065 APS detectors in a wafer Serial raster readout 640 pixels in a row 320 column / sector 2 sectors / detector 4 ms readout time (50 MHz pixel read clock) MimoSTAR Detector Pixel Structure

6 LG - BNL DAC - March 20066 20 I => V converters / drivers per ladder Additional clock, control and JTAG connections. Power and ground Analog signals and clock/control is transferred to the motherboard via fine twisted pair cable. All ladders are the same Prototype HFT Ladder

7 LG - BNL DAC - March 20067 HFT Prototype System Functional Block Diagram The readout system is a large parallel system. The block diagram shown above is for one ladder of a 24 ladder system.

8 LG - BNL DAC - March 20068 ADC and CDS Block Diagram Synchronous Correlated Double Sampling and hot pixel removal. 8 bit data after CDS. SRAM contains a circular buffer that is an updating raster scan of 1 frame of sector readout. Perform read – subtract – write on each clock tick.

9 LG - BNL DAC - March 20069 320 pixels deep shift register (1 of 20 per ladder) To Event FIFO

10 LG - BNL DAC - March 200610 SECTOR EVENT FIFO Each Trigger enables an empty Event FIFO for 1 frame ( 204,800 clocks) with an offset to the enable that aligns the event start time with the location of the first pixel in the event. Each event FIFO is a separate trigger event stream and can be enabled independently. This allows events to be triggered at ~1 ms intervals with our 4 ms latency. Each sector event FIFO is emptied by the SIU at the end of it’s active frame.

11 LG - BNL DAC - March 200611 Implementation Diagram DAQ x5

12 LG - BNL DAC - March 200612 Data Rates 100 hits/cm 2 Inner Layer, 20 hits/cm 2 Outer Layer (L = 10 27 ) Average event size = 90 KB Event size = 90 MB/sec at 1KHz 24 fibers 12 RORC (4 readout PCs)

13 LG - BNL DAC - March 200613 Ultimate HFT Detector Readout Same physical size detector (640 x 640 pixels). Ultimate Detectors will have on-chip CDS and remotely configurable discriminators (2 bits / pixel) Integration (frame active) time is 200 microseconds but the readout time is 1 ms. 4 LVDS readout lines / detector

14 LG - BNL DAC - March 200614 Ultimate HFT Detector Readout

15 LG - BNL DAC - March 200615 HFT Prototype Testing Ladders – mechanical properties of prototypes and STAR environment. Readout cable. Preliminary air cooling tests. Preliminary electronics developments.

16 LG - BNL DAC - March 200616 Prototype Ladder 2 candidates Top layer = 50 µm CFC Middle layer = 3.2 mm RVC Bottom layer = 50 µm CFC Outer shell = 100 µm CFC Fill = RVC APS (50µm) X 0 = 0.05 % (thinning to 50µm is a standard industrial process) Cable X 0 = 0.09 % Carrier X 0 = 0.11 % Ladder Total (with adhesive) X 0 = 0.282 % Not to scale

17 LG - BNL DAC - March 200617 Prototype Carrier Plot shows fundamental resonance frequency measured with a capacitance probe. Measured = 139 Hz Calculated = 135 Hz

18 LG - BNL DAC - March 200618 Thermal Visual Images Airflow = 0 Heaters = off Airflow = 0.8 m/s Heaters = on Emissivity is OK Si temperature rise ~5-7 ° above ambient No hot spots, good uniformity in temperature. Upper test piece is 2 cm x 2 cm x 50 µm thick Si glued to Pt heater serpentine strip at 100mW/cm2 Lower test piece is 2 cm x 2 cm x 50 µm thick Si with Resistor heating at 164 mW along the upper edge and 90 mW distributed over the rest of the piece More information at http://www.lbnl.leog.org/ir_prelim_writeup.htm ~20° ~25° ~27°

19 LG - BNL DAC - March 200619 Vibration from Air Cooling and the STAR Environment Airflow at 10 deg. onto prototype carrier measured at unsupported end gives measured location distribution with SD ~ 1.6 µm at 1.0 m/s of airflow Sensitive accelerometer on FTPC support shows ~ 10 µm displacements at ~1 Hz on STAR detector.

20 LG - BNL DAC - March 200620 Prototype Cable ~ 100 traces (2 LVDS pairs / sensor, clk, power, gnd, cntl ) 4 layer design, 25 µm kapton, 20 µm Al conductor Impedance controlled signal / clock pairs with power and ground geometrically arranged as shielding. X 0 =0.090 % (for Al conductors) Prototype Cu conductor cable

21 LG - BNL DAC - March 200621 Prototype Readout Electronics Construction – bakelite carrier, cable, 1 x 50 µm MIMOSA5 detector, 1 detector (all 4 sectors) instrumented with amplifiers and differential drivers. Motherboard and daughter card. Daughter card has ADCs, FPGA, fast SRAM. Provides CDS and memory interface. Development platform for cluster finding algorithms MIMOSTAR5 ADC SRAM FPGA

22 LG - BNL DAC - March 200622 Summary Prototype RDO design gives 1 KHz event rate despite a 4 ms detector latency by the use of multiple parallel buffering of events. Design fits seamlessly into the existing STAR DAQ and Trigger infrastructure. Data from the HFT will be built into unified STAR events. Reconfigurable FGPA based cluster finding and readout logic. Cooling, vibration and radiation length challenges appear to be manageable. We are starting to implement the required functionality into our prototype readout electronics.


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