1. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 1 MEMS CLEAN ROOM 1500 m 2, class 10 150 mm (6”) Wafer line 3 shift preparation for R&D and pilot fabrication (24x5) Access to external services Technological parameter supervising system MES / PPS based planning and documentation ISO 9001 certification

2. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 2 MEMS Clean Room Layout Aktuelle Clusterung HIGH TEMPERATURE LITHOGRAPHY WET ETCH / CLEANING DRY ETCH / PVD BACK END CVD INLINE METROLOGY CHARACTERIZATION & TEST LAB CMP EXTERNAL PARTNERS SEM LOGISTICS GOWNING AREA

3. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 3 MEMS Clean Room: Characterization & Test

4. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 4 MEMS Clean Room: Lithography

5. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 5 MEMS Clean Room: Wet Etch / Cleaning

6. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 6 MEMS Clean Room: Wet Etch / Cleaning

7. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 7 MEMS Clean Room: Dry Etch / Strip Resist

8. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 8 MEMS Clean Room: Backend (Bonding, Dispense)

9. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 9 MEMS Clean Room: Inline Metrology

10. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 10 MEMS Clean Room: Inline Metrology

11. © Fraunhofer IPMS T. Zarbock I 05.04.2013 I slide 11 MEMS Clean Room: SEM