1. GTK Cooling Summary of frame and cooling plate Shear tests Alessandro Mapelli Michel Morel Jerome Noel Georg Nüßle Paolo Petagna Giulia Romagnoli GigaTracKer Working Group Meeting October 9 th, CERN

2. Pictures taken in ambient environment between 24°C and 28°C Baseline Frame Silicon Heater – Painted Black

3. Pictures taken in ambient environment between 24°C and 28°C Baseline Frame Silicon Heater – Painted Black

4. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C Silicon Heater – No Power

5. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C Silicon Heater – No Power

6. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C Silicon Heater – Nominal Power ~ 25 °C

7. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C Silicon Heater – Nominal Power

8. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C Silicon Heater – Full Power

9. Baseline Frame Mass flow 10 g/s Mass flow 8 g/s 40°C 15°C

10. (b) R/O chips Sensitive Area Silicon R/O chips DT with respect to INLET temperature BANANAFRAME

11. BANANA: + Better thermal performance: Central sensor area has lowest temperature All sensor area @ T in < 0 °C already at T in = -15 °C (worst case scenario) + Can stand much higher “analog power” if needed o Works well with 100  m thick chip (total Si in sensitive area = 430  m ) - Higher cost -More difficult construction -More difficult integration with “Sensor Assembly” (chip/sensor planarity issues) -Higher hydraulic pressure (factor ~ 2) FRAME: - Poorer thermal performance: Central sensor area has highest temperature Requires T in < -25 °C to keep sensor @ T< 0 °C (worst case scenario) - Cannot stand higher “analog power” if needed o Works with 200  m thick chip (total Si in sensitive area = 400  m ) + Lower cost + Easier construction + Easier integration with “Sensor Assembly” (chip/sensor planarity issues much less relevant) + Lower hydraulic pressure (factor ~ 2) Frame and Banana - Pros and Cons

12. PT100 sensors Mass flow 7 g/s Nominal power Mass flow 7 g/s Nominal power Baseline – Long Run ~ 7 hours

13. Shear test with irradiated samples NA62 - DIPTEM Genova – UCL 5-09-2012

14. Shear tests with four different adhesive types: Adhesive tape NITTO DENKO 30 µm thick Adhesive tape NITTO DENKO 30 µm thick Adhesive tape 3M 9461P – 30 µm thick Adhesive tape 3M 9461P – 30 µm thick Liquid glue Araldite 2020 Liquid glue Araldite 2020 Adhesive film FastelFilm 30 µm thick Adhesive film FastelFilm 30 µm thick Polyester film double coated by acrylic adhesive Polyester = 0.13-0.15 W/m K Acrilyc = 0.2 W/m K 3M Adhesive 100 (Acrylic adhesive) 3M Adhesive 100 = 0.178 W/m K Two components epoxy liquid glue Epoxy = 0.188 W/m K EVA (Ethylene - vinyl Acetate) adhesive film EVA = 0.34 W/m K ⁻Surface cleaning with acetone ⁻1 Kg for 65 hours -Surface cleaning with acetone -1 Kg for 3 minutes -80 °C in the oven (weight and plate already hot) ⁻Surface cleaning with acetone ⁻Vacuum outgassing after mixing the component ⁻Dispensing with a slice ⁻Surface cleaning with acetone ⁻1 Kg for 65 hours Silicon samples Silicon samples 10 x 10 mm with wafers 525 µm thick Silicon glue Silicon

15. Araldite: 25 samples FastelFilm: 25 samples NittoDenko: 25 samples 3M: 25 samples Irradiation Irradiation levels (1 MeV eq. neutron/cm^2): -No irradiation -3 x 10 13 : 27 seconds -1 x 10 14  nominal : 91 seconds -1 x 10 15 : 910 seconds Heated a few degrees but no temperature mesurement! Stainless steel tool to performe the shear force on the samples Working set up The tool has been inserted between the two plates of the machine

16. NittoDenko

17. 3M

18. Fastelfilm

19. Araldite New scale for the graphs! Values higher than for the other adhesives!!! Always tested the silicon!!!!

20. Results: -Nitto Denko  OUT (no resistence at the highest radiation) -FasterlFilm  OUT (melts at the highest radiation) -Araldite  IN (it’s the best solution) -3M  IN (back-up in case Araldite will be too rigid) Future tests: - Thermal tests with temperature cycles to see the stresses in the glues (Araldite and 3M)

21. Coming up… -Long run test (cycled) for Banana e Frame -Thermal test with separated chip mock-ups for Frame (irrelevant for Banana) 200 micron thick -Thermal test with separated chip mock-ups for Frame 150 micron thick [is 150 micron enough for Frame in NOMINAL condition (NOT max power)?] -Launch wirebond tests (check of Jig1, production of Jig2 and Jig3: pending technical help to replace Jerome. Discussion ongoing inside PH/DT) -Request: obtain from IZM prototype assemblies with correct thickness (chip and sensor) in order to work “hands-on” on cold assembly integration!

22. Supply of silicon micro-fluidic devices Price Enquiry DO-27627/PH was sent out on July 26 th and closed on August 22 nd IceMOS was selected on September 2 nd On September 17 th, IceMOS went from 5 th to 2 nd in terms of price due to an internal error. The cost dropped from $54’125 to $43’575. Purchase order CA5067134 was sent on October 2 nd We are now defining the layout and fabrication process with Adele Gilliland, who is the Applications Engineering Manager. She will be leading the engineering work on the NA62 project at IceMOS.