2. How engineers in 1954 expected a computer to look like in 2004

3. Early electronic device - the vacuum tube Similar to a incandescent light bulb Glass bulb under vacuum with a heated filament and collector grid Operates at high temperature, takes up a lot of space, fails quickly, expensive to manufacturer

4. The vacuum tube evolved into the solid state microelectronics devices of today Solid state refers to the fact that the devices are created in semiconductor materials rather than assembled from various components Solid state devices: operate much cooler than a vacuum tube, size can be reduced significantly, can last indefinitely, can be manufactured cheaply

5. Vacuum tube to microelectronics The first solid state devices were individual components, diodes and transistors Multiple components were connected on the same semiconductor material to form simple integrated circuits Microelectronics was created when these circuit components became microscopic and a high density of components was fabricated on each circuit

6. What is microelectronics? Microelectronics is a general term used to identify miniaturized electronic devices and circuits Other terms used in conjunction with microelectronics devices are solid state devices, semiconductor devices, computer chips, etc. Early microelectronic devices started as diodes and transistors Several transistors and passive components were combined into the first integrated circuits or ICs Many integrated circuit functions were combined into the first computer processors Processors evolved with more capability, faster calculations, integrated drivers and additional functions on a single processor Today’s computer microprocessors can contain several million transistors on an area about the size of one’s thumbnail

7. Microelectronics Electronic material, usually silicon, is processed in a “clean room” and miniature circuits are created These circuits are the brains of electronic devices today Processing capabilities are advancing rapidly, allowing more and more circuitry in smaller and smaller areas Thus, smaller, cheaper, more capable electronic devices are introduced continually

8. Silicon wafers used in microelectronics

9. Through a series of high precision processing steps in a clean room, circuits are created on/in the silicon wafer

10. Once the processing is complete, the individual circuits are cut from the host wafer and mounted into an electronic package. 40 pin Dual Inline plastic (DIP) package Silicon chip (circuit) Tiny wires connect the circuit to the pins on the package

11. Complex wire bonding to multiple chips

12. Microprocessor Chip Todays microprocessor chips do not use wires but microscopic solder bumps to connect to the package. This allows for faster cheaper manufacturing and faster processing speeds since the wires cause delays in the signal

13. Computer Motherboard

14. Micro-photo of an older era IC (integrated circuit) showing a small portion of the circuit magnified many times

15. Simple wire bonds to an LED (Light Emitting Diode)

16. The EE project will be fabricated in the Cameron Microelectronics clean room

18. What is a “clean room” A better name for a “clean room’ would be a “contamination control” room The goal of a clean room is to minimize the contamination that might effect a product and to provide a “clean” manufacturing environment for the fabrication of products Clean rooms were originally exclusive to microelectronics manufacturing

19. What is a “clean room” Today clean rooms are used in many industries and applications 1.Microelectronics 2.Optoelectronics 3.Pharmaceuticals 4.Certain food packaging 5.CD and DVD manufacturing 6.Satellite assembly 7.Many other industries Intel microprocessors have design rules that space components 25 nm apart (.025 micron spacing) Microprocessor chip can have 12 million transistors An Intel advanced microprocessor is about the size of a thumb nail and many hundreds are produced simultaneously on 12” (304mm) silicon wafers

20. In microelectronics size matters The common unit of measurement in a clean room is the micron or micrometer

26. Simple Clean Room work area

27. ECE Clean Room in CAMERON uses a membrane diffusion ceiling with HEPA filters and through the wall returns

29. Gowning required to work in the ECE Clean Room Hood Coverall Boots Face mask Gloves- latex. If you are allergic to latex, alternatives are available

31. Next homework assignment HW 4 from the web site Write a one page report on “Bluetooth” and “Wi-Fi” technology Be sure to include the frequency of operation of “Bluetooth” and “Wi-Fi” Include the origins of “Bluetooth” Include at least two references Due next class meeting