1. tbp’s early involvement Gerard Elema&Marcel Swinnen DfM expertDfT expert

2. 2 EMS, production of electronics for third parties (B2B) development, test engineering, assembly, testing and box building responsible for complete supply chain high-end, high mix the business of perfection

3. 3 turnover€ 30 million locations2 employees130 customers50+ floor space8.000m 2 ISO-9001:2008, AQAP-2120:2009 ISO-13485 (roadmap 2014) JTAG AAP (Approved Application Provider) the business of perfection

4. 4 our mission the tbp Way of Life is a process of cooperation with our customers to maximize the manufacturability and testability of a design resulting in higher quality and lower “hidden costs” for you as our customer

5. 5 customer concept of functionality customer concept of functionality tbp manufacturability advise testability advise tbp manufacturability advise testability advise customer concept of product/design customer concept of product/design tbp DfX analysis report tbp DfX analysis report customer final product/design data awareness “hidden cost” customer final product/design data awareness “hidden cost” tbp percentage slip-through lowest TCO tbp percentage slip-through lowest TCO customer design flow tbp early involvement process phase 0 phase 1 phase 2

6. 6 10 ± 3 DPMO 86,5 77,5 58,5 39 IPC7912 why DfX – Design for eXcellence

7. 7 customer design idea (in block diagram) batch size and year volume of product traceability customer design idea (in block diagram) batch size and year volume of product traceability tbp DfM rules data-exchange guidelines ABC component list tbp DfM rules data-exchange guidelines ABC component list customer full BOM CAD data, preferably in ODB++ (component and outer copper layers) customer full BOM CAD data, preferably in ODB++ (component and outer copper layers) tbp DfM report containing: component placement check footprint check tbp DfM report containing: component placement check footprint check customer full BOM CAD data, preferably in ODB++ (complete design ) customer full BOM CAD data, preferably in ODB++ (complete design ) tbp DfM report containing: analysis of makeability footprint check component placement check netlist analysis tbp DfM report containing: analysis of makeability footprint check component placement check netlist analysis design Design for Manufacturing (DfM) phase 0 phase 1 phase 2

8. 8 customer design idea (in block diagram) batch size and year volume of product traceability customer design idea (in block diagram) batch size and year volume of product traceability tbp DfT rules data exchange guidelines tbp DfT rules data exchange guidelines customer schematics in EDIF 2.0 or Cadence Allegro format schematics in searchable PDF full BOM if possible, BSDL files customer schematics in EDIF 2.0 or Cadence Allegro format schematics in searchable PDF full BOM if possible, BSDL files tbp DfT report containing: preliminary test coverage preliminary test strategy preliminary slip-through do-file tbp DfT report containing: preliminary test coverage preliminary test strategy preliminary slip-through do-file customer CAD data, preferably in ODB++ possibly new schematics possibly adjusted BOM customer CAD data, preferably in ODB++ possibly new schematics possibly adjusted BOM tbp DfT report containing: final test coverage final test strategy percentage slip-through tbp DfT report containing: final test coverage final test strategy percentage slip-through design Design for Test (DfT) phase 0 phase 1 phase 2

9. 9 production faults are unavoidable during assembly process (DPMO) a test coverage of 100% is unrealistic (technical) slip-through is the amount of boards which are passing the test strategy and still may contain production faults at customer side slip-through will be calculated in advance slip-through explained

10. 10 test methods X-ray AOI FPT ICT BST combination test FT IEEE 1149.1 & IEEE 1149.6

11. 11 DfT – way of working test strategy “as is”: AOI + FPT + BST test strategy “as advised”: AOI + FPT + EBS test quality x 4,7

12. 12 NIKHEF - HAM base promise 2 via structural tests the slip-through can be reduced to 0,08 % less functional test or no functional test at all at board level

13. 13 the most cost efficient structural test method which can also test components functionally what can be tested? pcba with mixed analogue and digital technology pcba with only analogue technology cost reduction versus functional testing automated testing minimum troubleshoot effort EBS test – Extended Boundary Scan test

14. 14 production customer MES logistics quality data reports BOM materials (jit)visual aids SPC Manufacturing Execution System

15. 15 “early involvement” “early involvement” generates “best buy” during product lifecycle conclusion

16. 16 questions ©tbp electronics bv

17. 17 EBS test – block diagram ©tbp electronics bv TAP1 TAP2 JTAG USB SPI ADC DAC MATRIX CNTRL TO UUT TAP TO UUT EXT 64 FLEX. I/O 64 I/O Plug-in module (ADC,DAC,CC,CV) Plug-in module (ADC,DAC,CC,CV) 16x SCOPE 8 SCOPE CH. USB HUB USB HUB 64 I/O 128 I/O 1 2 3

18. 18 EBS test – block diagram ©tbp electronics bv TAP1 TAP2 JTAG USB SPI ADC DAC MATRIX CNTRL TO UUT TAP TO UUT EXT 64 FLEX. I/O 64 I/O Plug-in module (ADC,DAC,CC,CV) Plug-in module (ADC,DAC,CC,CV) 16x SCOPE 8 SCOPE CH. USB HUB USB HUB 64 I/O 128 I/O 1 2 3

19. 19 dank u voor uw aandacht thank you for your attention