1. Tom McMullen Week 9 1/4/2013 – 5/4/2013

2. LETI wafer thinning project flow Phase 1 IDProject NameOwnerDaysStartEnd 3-Feb10-Feb17-Feb24-Feb3-Mar10-Mar17-Mar24-Mar31-Mar5-Apr12-Apr19-Apr26-Apr 1.0Thin Wafer AssembliesT. McMullen01-Feb30-Sep Week 0Week 1Week 2Week 3Week 4Week 5Week 6Week 7Week 8 week 9 1.1 PHASE 1 - Layout and mask production, first 2 wafers with microbumps delivered to AdvacamLETI - 3D101-Feb29-Mar LETI accpets CERN proposal 1.1.1Send gds to LETIT. McMullen51-Feb8-Feb 1.1.2 Send 2 FEI4b wafers to LETIR. Bates51-Feb6-Feb 1.1.3 Confirm step size on wafer and centre ofset variation on waferLETI51-Feb6-Feb 1.1.4 Layout and mask productionLETI101-Feb11-Feb Deliverable 1: Microbumb gds files 1.1.4 First 2 wafers with micro bumps delivered to AdvacamLETI4912-Feb2-Apr Deliverable 2: First 2 wafers with micro bumps delivered to Advacam Current Deliverable Target not met

3. Action List Phase 1 and 2 ActionWhatWhoWhenComment 7Bow measurement set-upTMcM31/2/2013visit SMC and set up program for bow measurement 9Assembly probe test solutionTMcM19/3/2013Pobe test solution for flip-chipped assemblies - yield maps 10FEI4B probe card and probe set-upRbates/TMcM19/3/2013FEI4B test solution for assembly testing yeild maps 11Experience with FEI4A probe card set-upRbates/TMcM19/3/2013 FEI4A probe card set-up and testing of assemblies on Wentworth 12 Source other suppliers of wafer bow measurementsTMcM29/3/2013Ongoing. Requested update from SMC on FSM coming online

4. Highlights and issues  First instalment of 36,000 euro was confirmed to be released to LETI after completion of the mask design, layout and delivery of the mask. (see attached purchasing agreement with email for conditions)  LETI have an issue processing wafers at the moment as their Argon sputter clean is down in copper PVD tool and will delay the shipment of technology run 1 till the 15 th of April It is essential we run with a sputter etch prior to copper deposition as without it would most likely result in poor electrical contact New estimated completion time 26 th April Bump mask is out of alignment by 20um in both x and y-directions ○ This could be the result of the stepper off-set in IBM that we were informed about but no figure was supplied ○ LETI will align to the pads and don’t foresee any down-line issues for flip-chip alignment ○ LETI will supply alignment measurements post exposure to confirm this ○ There maybe a few more days delay due to this.  Meeting required to discuss sensor availability for the flip-chip process Amount of sensors for flip-chipping – good statistical analysis required for micro-bump yield – Richard and I have begun discussions on this. ○ List has been made by Richard just awaiting the file FEI4b Assembly testing ○ FEI4b probe card required ○ Test equipment/apparatus required ○ Semi-auto testing solution required for assemblies

5. Highlights and issues (Cont’d)  SMC FSM thermal cycling tool is out of use at the moment. I have given them dates for when the tool is needed and asked for assurance that the tool will be ready by this time. Feedback from SMC is that they hope to have the tool running for when we require it, but have given no guarantees as yet. ○ I have asked SMC to keep me updated on the progress of this Sourcing alternatives ○ Southampton only have this ability to 150mm ○ JEMFIRE is another possibility

6. Wafer Inventory Wafer #Wafer IDYield (60 chips max)PurposeComment 1VMB8WDHG= 34, y=17, R=8, B=1Full thickness micro-bump testDelivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies 2V6B8WUHG= 43, y=13, R=4, B=0Full thickness micro-bump testDelivered to LETI. High-yielding die. Micro-bump yeild testing on assemblies 3VUAYCRH First technology run. Run 2 Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at SMC. Ship to LETI. Shipped to LETI 4ABPJXGHG=28, Y=24, R=8 First technology run. Run 2 Received at Glasgow Wafer thinning to 100microns. Used for thermal cycling bow measurements at SMC. Ship to LETI. Shipped to LETI 5 Second technology run. Run 3Wafer identified and will be shipped from CERN to LETI. Awaiting wafer ID and yield 6 Second technology run. Run 3Wafer identified and will be shipped from CERN to LETI. Awaiting wafer ID and yield 7 Third technology run. Run 4Wafer to be identified and delivered to glasgow 8 Third technology run. Run 4Wafer to be identified and delivered to glasgow 9 Forth technology run. Run 5Wafer to be identified and delivered to glasgow 10 Forth technology run. Run 5Wafer to be identified and delivered to glasgow

7. LETI wafer thinning project flow Phase 2