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班級:碩研機械一甲 姓名:田正雨 學號: M9810213 Micro-EDM of sintered diamond.

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Presentation on theme: "班級:碩研機械一甲 姓名:田正雨 學號: M9810213 Micro-EDM of sintered diamond."— Presentation transcript:

1 班級:碩研機械一甲 姓名:田正雨 學號: M9810213 Micro-EDM of sintered diamond

2 excellent hardness and very low frictional wear machine SD(Sintered diamond) with high precision by conventional methods such as cutting and grinding Introduction(1/2)

3 Since SD contains metal as binder, it is electrically conductive Micro-EDM, its ability to machine regardless of the hardness of the workpiece four types of SD, composed of 1, 3, 10 and 20 μm diamond particles Introduction(2/2)

4 Panasonic MG-ED72 micro-EDM machine, WEDG, 50μm-diameter cylindrical electrodes(tungsten) Binder (cobalt), approximately 5% Tungsten carbide alloy was also tested for comparison Experiments(1/3)

5 Hole machining : Discharge capacitance was 100 pF, and the open- circuit voltages were 100, 80, and 60 V measured the machining time, the electrode wear, and the side gap Experiments(2/3)

6 Trench machining : The size of the trenches : 50 μ m (width) × 4 mm (length) × 30 μm (depth) 100v, 3300 pF(rough), 100 pF(medium) and stray capacitance(10pF, finish machining) surface roughness at the bottom of the trenches Experiments(3/3)

7 Shape of machined holes : There is no significant difference of size and roundness among all holes This fact suggests that precision and micro EDM of SD is practical Results and discussion _ Hole machining(1) Ø 50μ m, 100 V and 100 pF

8 Machining speed : 20 μ m at 60 V and 80 V could not be machined : electrode wear was so large Machining speed, SD and tungsten carbide alloy : No significant difference Results and discussion _ Hole machining(2) Volmetric machining speed

9 Machining speed : 100V 、 80V, machining speed apparently decreases : debris The same phenomenon : 3 μ m, BUT, 10 μ m and 20 μ m appears to be constant Results and discussion _ Hole machining(3) diamond particle : Debris influence :

10 Electrode wear The wear ratio : tungsten carbide < SD Machining speed : Electrode wear : Results and discussion _ Hole machining(4)

11 Side gap There is no apparent correlation between diamond particle size and side gap Results and discussion _ Hole machining(5)

12 Surface roughness : discharge capacitance : the surface roughness : Results and discussion _ Trench machining(1)

13 Observation of machined surface(By SEM) Results and discussion _ Trench machining(2) Same craters diamond particles are small : can be removed diamond particles are large a part of particles

14 Round Ø 50 μ m micro holes were proved, 1–20 μ m Electrode wear ratio appeared to have a strong correlation with machining speed Side gap not have apparent correlation with diamond particle size. Conclusions(1/2)

15 There is no significant difference in machining speed between SD and tungsten carbide A surface roughness of approximately 0.13 μ m Ra was achieved for trench machining. Conclusions(2/2)


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