1. ECE 477 Design Review Team 13  Spring 2008 Paste a photo of team members here, annotated with names of team members. Srichand Varun Madhu Anvesh

2. Outline Project overviewProject overview Project-specific success criteriaProject-specific success criteria Block diagramBlock diagram Component selection rationaleComponent selection rationale Packaging designPackaging design Schematic and theory of operationSchematic and theory of operation PCB layoutPCB layout Software design/development statusSoftware design/development status Project completion timelineProject completion timeline Questions / discussionQuestions / discussion

3. Project Overview An ordering system will be created where the user will be able to order and pay for the food from the comfort of the tableAn ordering system will be created where the user will be able to order and pay for the food from the comfort of the table Consists of a touch screen monitor which displays the restaurant menu and allows the user to select the itemsConsists of a touch screen monitor which displays the restaurant menu and allows the user to select the items The order is sent through a wireless interface which is received by the receiverThe order is sent through a wireless interface which is received by the receiver The bill can be paid at the table using a RFID gift card after it is validatedThe bill can be paid at the table using a RFID gift card after it is validated

4. Project-Specific Success Criteria An ability to display information (menus, items ordered, etc.) on an LCD.An ability to display information (menus, items ordered, etc.) on an LCD. An ability to enter choices and select functions via touch screen entry.An ability to enter choices and select functions via touch screen entry. An ability to read an RFID card and use decoded user ID to look up personal account information.An ability to read an RFID card and use decoded user ID to look up personal account information. An ability to transmit menu choices over a wireless interface (e.g., 802.15.4)An ability to transmit menu choices over a wireless interface (e.g., 802.15.4) An ability to customize the menu by getting data from database.An ability to customize the menu by getting data from database.

5. Block Diagram 1 SCI 42 2 SCI 2 GPIO 2 SCI 3 GPIO Microcontroller (Freescale MC9S12C128) 12 VDC Supply Voltage Regulator and DC-DC Converters (5V to 3.3V) ZigBee Transceiver (Maxstream XBee Pro) Graphics Controller (Reach Technologies 42-0105-01) Touch Screen Panel LCD Screen (NEC 8.4”) RFID Reader (Spark Fun ID – 12)

6. Component Selection Rationale Wireless Transceiver Chosen component : Max stream XBee ProChosen component : Max stream XBee Pro -1 SCI interface -Medium Range (300m Indoor) -Low power dissipation -Built in Antenna Competing Alternative : Atmel ATmega64RZAPVCompeting Alternative : Atmel ATmega64RZAPV

7. Component Selection Rationale RFID Reader Chosen component : Spark Fun ID-12 RFID ReaderChosen component : Spark Fun ID-12 RFID Reader -1 SCI Interface -Short Range (12 cm) -Low Cost -Built in Antenna Competing Alternative : Texas Instruments RI-STU- MRD1Competing Alternative : Texas Instruments RI-STU- MRD1

8. Component Selection Rationale LCD and Touch Screen Chosen component : Reach Technologies 42-0105- 01 LCD Touch Screen KitChosen component : Reach Technologies 42-0105- 01 LCD Touch Screen Kit -Medium size (8.4” diagonally) -External SD memory -SCI Interface Competing Alternative : Apollo Display Technologies T-51638D084J-FW-A-AB-V399B Touch screen LCDCompeting Alternative : Apollo Display Technologies T-51638D084J-FW-A-AB-V399B Touch screen LCD

9. Component Selection Rationale Microcontroller Chosen component : MC9S12E128Chosen component : MC9S12E128 -3 SCI Ports -80 pin packaging -25 MHz clock -Previously known microcontroller family and development environment Competing Alternative : PIC dsPIC33FJ128MC706Competing Alternative : PIC dsPIC33FJ128MC706

10. Packaging Design ConstraintsConstraints -Size and Durability -Portability -Heat Dissipation -Cost

11. Packaging Design DimensionsDimensions -226mm x 157mm x 47mm Material Material - Non conducting material Screen Size Screen Size - 8.4 inch diagonally

12. Packaging Design

13. Chosen Enclosure : PACTEC PT-10 External Dimensions: 7.9 x 11 x 3 in

14. Schematic (Microcontroller)

15. Schematic (Clock Generator) Colpitts Oscillator settingColpitts Oscillator setting Manufacturer’s specifications for capacitor and resistor valuesManufacturer’s specifications for capacitor and resistor values 8 MHz Crystal8 MHz Crystal

16. Schematic (ZigBee Wireless) DIN and DOUT are connected to the SCIDIN and DOUT are connected to the SCI RTS, CTS, Sleep and Reset are connected to the GPIOsRTS, CTS, Sleep and Reset are connected to the GPIOs

17. Schematic (Power Circuit) Non-synchronous step down voltage regulatorNon-synchronous step down voltage regulator For both 3.3 V and 5 VFor both 3.3 V and 5 V Very high efficiencyVery high efficiency (up to 87%)

18. Schematic (Headers) Headers for RFID and Graphic ControllerHeaders for RFID and Graphic Controller Pull-up resistors for RTS and TX of Graphic ControllerPull-up resistors for RTS and TX of Graphic Controller By-pass capacitor for the RFID headerBy-pass capacitor for the RFID header

19. PCB Layout Maximum Dimensions: 7.4 x 10.5 x 3 inMaximum Dimensions: 7.4 x 10.5 x 3 in 0807 SMD resistors and capacitors0807 SMD resistors and capacitors 2 Power supplies: 3.3 V and 5 V2 Power supplies: 3.3 V and 5 V Maximum Current Draw: 300 mAMaximum Current Draw: 300 mA Nets routed by priorityNets routed by priority Status: All components placedStatus: All components placed 90 % routed 90 % routed

20. PCB Layout Top Layer 12 V – 60 mils12 V – 60 mils 5 V – 60 mils5 V – 60 mils 3.3 V – 30 mils3.3 V – 30 mils Others – 12 milsOthers – 12 mils

21. PCB Layout Bottom Layer GND – 60 milsGND – 60 mils Others – 12 milsOthers – 12 mils

22. PCB Layout Microcontroller

23. Wireless Transceiver

24. PCB Layout Power Supply Top All power supply kept togetherAll power supply kept together 12 V input header placed between the two circuits12 V input header placed between the two circuits

25. PCB Layout Power Supply Bottom GND header placed between the two circuitsGND header placed between the two circuits

26. PCB Layout Oscillator Circuit Top Colpitts Oscillator circuitColpitts Oscillator circuit 8 MHz crystal oscillator8 MHz crystal oscillator

27. PCB Layout Oscillator Circuit Bottom

28. PCB Layout RFID Header RX SCI pinRX SCI pin 5 V and GND5 V and GND RESET tied to +5 VRESET tied to +5 V

29. PCB Layout Graphic Controller Header GPIOs for RTS, Reset and GND using 10k pull upGPIOs for RTS, Reset and GND using 10k pull up TX using 10k pull upTX using 10k pull up GNDGND

30. Software Design Software is written in C using code warriorSoftware is written in C using code warrior Timer interrupt used to create system clockTimer interrupt used to create system clock All operations are contained in main loopAll operations are contained in main loop RFID and Touch screen works on interrupt modeRFID and Touch screen works on interrupt mode

31. Software Design Sequence of OperationSequence of Operation -Sleep mode -Interrupt on touch screen/RFID -Display Menu -Send order -Confirmation -Pay Bill -Sleep mode

32. Software Design Completed Interfaces :Completed Interfaces : -Tested RFID interface with 9S12C32 -System Clock Tasks to complete next :Tasks to complete next : -XBee Interface -Graphical Interface -Software code for customizing and Displaying menu

33. Project Completion Timeline Week2/24-3/13/2-3/83/9-3/153/16-3/223/23-3/293/30-4/54/6-4/124/13-4/194/20-4/264/27-5/3 Finalize PCB Populate PCB Interfacing Software Design Packaging Testing Documentation

34. Questions / Discussion