1. Digital Integrated Circuits© Prentice Hall 1995 Introduction VLSI DESIGN DOMAIN l Practical application of VLSI Design?

2. Digital Integrated Circuits© Prentice Hall 1995 Introduction INTRODUCTION l Systems based on Magnetically controlled switches l Vacuum Tubes »Analog »Digital

3. Digital Integrated Circuits© Prentice Hall 1995 Introduction HISTORICAL PERSPECTIVE  1930 - O.Heil and Lilienfeld – FET  1947 – Bardeen, Brattain and Shockley, AT & T Bell Labs, - BJT  1958 – Jack Kilby, Texas Instruments, Hybrid IC  Jack Kilby was awarded the year 2000 Nobel prize

4. Digital Integrated Circuits© Prentice Hall 1995 Introduction LEVEL OF INTEGRATION Level of Number Typical Integration of Gates Applications SSI 1-10 Basic Gates MSI 10-100 Counters,Decoder, Encoder LSI 100-1000 Memories, ADC/DAC VLSI 1000-10,000 MPU’s ULSI 10,000-100,000 DSP, DEC ALPHA

5. Digital Integrated Circuits© Prentice Hall 1995 Introduction Evolution in Complexity

6. Digital Integrated Circuits© Prentice Hall 1995 Introduction Evolution in Speed/Performance

7. Digital Integrated Circuits© Prentice Hall 1995 Introduction TRANSISTOR FEATURE SIZE

8. Digital Integrated Circuits© Prentice Hall 1995 Introduction Silicon in 2010 Die Area:2.5x2.5 cm Voltage:0.6 V Technology:0.07  m

9. Digital Integrated Circuits© Prentice Hall 1995 Introduction TERMINOLOGY  Manufacturing Lead Time(Turnaround Time) – The time it takes to make an IC excluding the design time.  Integrated Circuit – Combination of circuit elements inseparably associated on or within a substrate.  Substrate – Supporting material.  Monolithic IC – An IC whose elements are formed on or within a substrate.  Hybrid IC – Consists of a combination of two or more ICs or an IC with some discrete components.

10. Digital Integrated Circuits© Prentice Hall 1995 Introduction TERMINOLOGY  Wafer(Slice) – Contains many ICs. Circular in nature. Diameter – 4, 5, or 6 inches.  Chip(die or bar) – Repeated ICs on a wafer.  Test Plug(Process Control Bar Process Control Monitor) - Special Chip Used to monitor the process parameters of the technology.Used to derive the timing models-Wafer can be discarded.

11. Digital Integrated Circuits© Prentice Hall 1995 Introduction

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13. Digital Integrated Circuits© Prentice Hall 1995 Introduction

14. Digital Integrated Circuits© Prentice Hall 1995 Introduction

15. Digital Integrated Circuits© Prentice Hall 1995 Introduction

16. Digital Integrated Circuits© Prentice Hall 1995 Introduction

17. Digital Integrated Circuits© Prentice Hall 1995 Introduction

18. Digital Integrated Circuits© Prentice Hall 1995 Introduction  Defect Density - Lethal defects per cm 2  Yield - Yield = No. of Good Chips on a Wafer/Total Number of Chips  Utilization Factor - Utilization Factor = Used Chip Area/Total Chip Area  SOC- System On Chip TERMINOLOGY

19. Digital Integrated Circuits© Prentice Hall 1995 Introduction PERIODIC SYSTEM

20. Digital Integrated Circuits© Prentice Hall 1995 Introduction SEMICONDUCTOR PHYSICS l Intrinsic Si l Ideal crystal structure l Valance 4 l Almost no free carriers l Almost no conduction

21. Digital Integrated Circuits© Prentice Hall 1995 Introduction SEMICONDUCTOR PHYSICS l Doping with valance 5 atoms (Phosphor, Arsenic) introduces “Loose electrons” l Electron donor l Conductivity depends on doping level

22. Digital Integrated Circuits© Prentice Hall 1995 Introduction SEMICONDUCTOR PHYSICS l Doping with valance 3 atoms (Boron) introduces “Loose Holes” l Electron acceptors l Hole conductivity lower than electron conductivity