1. TI Information – Selective Disclosure 1 David Chin July-26-2013 Nano Module SMT Guideline

2. TI Information – Selective Disclosure Nano Modules SMT Guideline - Summary Nano Modules SMT Guideline - Summary 2 Nano 1Nano 1A Nano 2 (Non Molded) Nano 2 (Molded) Package Outline (mm)2.5 X 3.02.6 X 33.5 X 3.5 Dimension of area for pick up (mm)1.69 X 1.841.6 X 22 X 2.53.5 X 3.5 SMT Nozzle Size (Diameter in mm)<1 <1.3<2.5 Nozzle with Soft TipMandatoryPrefer Optional Placement by Force (N)<3 Placement by part thickness (mm)Actual +0.05 PCB Land Pattern and StencilRefer to individual Package Outline Drawing Suggested Reflow ProfileSimilar to QFN (See Back Up) Suggested Manual PlacementRefer to Nano 1 Datasheet Suggested Rework MethodRefer to Rework Procedure provided by Denislav Petkov

3. TI Information – Selective Disclosure 3 Nano Modules SMT Guideline – Lead Free No Clean Solder Paste Nano Modules SMT Guideline – Lead Free No Clean Solder Paste

4. TI Information – Selective Disclosure 4 Nano Modules SMT Guideline – Eutectic Solder Paste Nano Modules SMT Guideline – Eutectic Solder Paste

5. TI Information – Selective Disclosure 5 Nano Modules SMT Guideline – Water Soluble Solder Paste Nano Modules SMT Guideline – Water Soluble Solder Paste