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High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Phase I Phase II ~1000km north of Shenzhen Sunshine. 3km to Long River New Factory in Jiujiang,

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Presentation on theme: "High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Phase I Phase II ~1000km north of Shenzhen Sunshine. 3km to Long River New Factory in Jiujiang,"— Presentation transcript:

1 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Phase I Phase II ~1000km north of Shenzhen Sunshine. 3km to Long River New Factory in Jiujiang, Jiangxi

2 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi Phase I Phase II Phase I (a): 1 st & 2 nd Floor direction is the same as the Shenzhen Sunshine Phase I (b): 3 rd Floor Rigid-Flex Production Phase II: Market-oriented (TBA) Each Floor has ~15,000m 2 Floor Area Phase I total floor area ~ 45,000m 2 Phase I (a): 1 st & 2 nd Floor direction is the same as the Shenzhen Sunshine Phase I (b): 3 rd Floor Rigid-Flex Production Phase II: Market-oriented (TBA) Each Floor has ~15,000m 2 Floor Area Phase I total floor area ~ 45,000m 2 Waste Water Treatment Facilities

3 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi R & D Center Phase I Multi-purpose Recreation Center (& Canteen)

4 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits New Factory in Jiujiang, Jiangxi Operators and Staff Dormitories Service Apartment for our VIP

5 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Jiujiang Factory Phase I Major Investment ProcessesMachinesInvestment (USD) Inner ImagingPretreatment to Etching2,283,000 Inner CheckingAOI1,600,000 Inner PressingBrown Oxide to Pressing2,645,000 Drilling 5,600,000 1st Copper PlatingPTH + Panel Plating3,070,000 2nd Copper PlatingPattern Plating4,000,000 Outer ImagingPretreatment to Etching1,100,000 Solder ResistSolder Mask + Legend1,550,000 Surface FinishENIG+HASL1,000,000 ProfileRouting+V-score1,860,000 Final CheckingE-testing1,450,000 Major Investment Total26,158,000 Total Equipment Investment30,234,600

6 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Conventional Rigid PCB BackplaneMetal CoreRigid/Flex High performance material Sequential Lamination HDI Heavy Base Copper Rogers Teflon N+N design with blind/buried via D/S – 22/L PCB 6oz inner & 5oz outer 4-level any layer, stacked via Aluminum Core Rigid/Flex with HDI or without HDI 5mm board thickness Product Mix – PCB Technology

7 High Mix Low Volume High Tech. Shenzhen Sunshine Circuits Jiujiang Sunshine Technology Roadmap


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