1. Ormet Circuits, Inc. Technology Overview Presentation
Ormet Circuits Confidential

2. Mission
Ormet Circuits provides conductive pastes and inks that enable electrical interconnection and thermal management in electronic substrates, components and assemblies.

3. Opportunity
Industry currently uses 3 technologies to form electronic interconnections
Copper Plating
Printed circuit boards
Time consuming with poor yield for new designs
Solder
IC packaging for power devices
High temperature processes reduce reliability
Environmental concerns
Conductive Adhesives
Used as an alternate to solder in some applications
Limited electrical and thermal properties
There are three areas where the market is benefited Ormet’s materials. Is it our objective to work closely with customers to develop applications where these existing technologies have limitations, and a new interconnect material is desired.
Copper Plating
Copper plating is the standard technology for PCB manufacturing. In today’s designs, customers are looking to save space and increase interconnect density in their PCBs by removing through-holes. Ormet’s technology is used as an alternative to plating in micro-vias and through-holes to provide electrical interconnection and thermal management.
Solder Replacement
The transition from SnPb solder to Pb-free solder resulted in higher temperatures being used in electronics assembly. Still today, some power electronics applications use Pb-based solders due to problems with Pb-free materials. Ormet circuits is an alternative to solder paste in Pb-free applications where solders have temperature or processing related issues. Ormet has electrical and thermal properties of solder paste materials, but can be processed at lower temperatures than solder. Of course, Ormet’s products are green.
Conductive adhesives can sometimes be used as an alternative to solder paste. Unfortunately, adhesives are not as electrically stable over time as solders, and typically contain expensive silver filler. Ormet’s materials are electrically and thermally superior to silver filled paste adhesives with much more stable electrical resistance over time.
Overall, Ormet’s properties are like solder paste, with the processing benefits of conductive adhesives.

4. Ormet Circuits Technology
Ormet Circuits Confidential
Ormet Circuits Technology
The illustration depicts a Transient Liquid Phase Sintered Paste which is formulated with an fluxing epoxy resin system, a tin-bismuth
alloy and copper particles in the uncured paste.
During cure (When heated or reacted above 140C) the tin-bismuth alloy melts. The tin would rather form an intermetallic with the copper than remain with the bismuth. During the cure profile the tin forms an intermetallic network that sinters the copper powder into a solid network and sinters to any adjacent solder ready surface.
The colors in the picture are:
Black: Polymer network
light Gray: bismuth
Medium gray: tin-copper intermetallic
Dark gray: copper
Copper and alloy particles
in a liquid organic formulation
Sintered metal network
Proprietary Organics, Metal Powders and Alloys using
Transient Liquid Phase Sintering Process
(TLPS)

5. DSC Analysis of Ormet 700 Lead Free Composition
Ormet® materials do not remelt - Transient Liquid Phase Sintering (TLPS)
DSC Analysis of Ormet 700 Lead Free Composition
First thermal cycle
Ormet uses Differential Scanning Calorimetry (DSC analysis) in studying the reaction of our materials.
During the cure cycle, the first charted DSC scan points out the alloy melt (about 138ºC), followed by the intermetallic formation up to 190C. This indicates that the tin has left the bismuth and is sintering/fusing the copper particles. The epoxy cures simultaneous to the alloy melting, and has been specifically developed to aid the intermetallic formation above the alloy melt temperature.
The second scan demonstrates that the material will not re-melt when subjected to a second heat profiles. The first melt observed is that of bismuth at 267C, which is above the peak temperature of Pb-solder reflow profiles (260C)
A generic formulation for our products:
Uncured state: 6% epoxy, 4% solvent, 90% metal loaded
Cured State: 5-6% organic, 94% metal, no residual solvent
Second thermal cycle, no re-melt below 265ºc.
5/2/08
Ormet Circuits Confidential

6. Ormet Paste Before Cure
This slide shows the typical particle size of the SnBi allot and the copper powders. We typically formulate with alloy powders in the 5-15 micron size range, and copper particles of size in the 1 micron, 3 micron, and 8 micron ranges. We typically use combinations of these powders to meet the processing needs of our customers. We can tailor a formulation to the customer’s needs.
Point
Copper
Tin
Bismuth 1
98.48
1.52 2
100 3
Formulated with Copper and Tin/Bismuth powders

7. Ormet Technology After Cure
Point
Copper
Tin
Bismuth 1 52 47 2 70 29 3 54 45 4 71 28 5
100
After cure the SEM/EDX scan displays the intermetallic network and the typical copper-tin compositions. As is seen in the picture it is possible to see the core of some of the copper particles, but overall the alloy has melted, and the tin has formed a continuous structure that has sintered to customer’s copper pad.
Bismuth is only in the formulation as a means to create the liquid phase in order for sintering to occur.
Sintered Copper/Tin intermetallic network after cure

8. Ormet Materials Final Reactants
Bismuth
Melt 267° C
~16% of total matrix
Copper
Melt 1085° C
Cu3Sn intermetallic
Melt 640° C
Cu6Sn5 intermetallic
Melt 415° C
This graphic depicts the composition of the material after cure, specifically showing the melting points of the various metals.
Before cure the tin-bismuth alloy melted at 140C, now after cure the lowest melting point is 267C. This is the transient liquid phase sintering effect.
Direction of tin migration

9. Value Proposition of Ormet Technology
Low temperature metallic joining
Processing temperatures between C
Compatible with Pb-free solder reflow profiles
Thermally stable up to 265C
Superior shear strength versus conductive adhesives
Metallic joining 25% higher strength versus adhesives
The value as seen through the eyes of our customers is its ability to offer a low metal joining temperature, lead free, faster curing as compared to conductive adhesives, higher shear strength and its ability to be lower cost in volume as compared to Ag conductive pastes relative to raw material costs.
Ormet Circuits Confidential

10. Properties Comparison
12-16 (x,y)
72-85 (z)
FR4 1
=46 : 2
240
100
Epoxy / Silver 20
25-58
20-40
Ormet 22 35 25
Solder 16
400
Copper
Coefficient of
Thermal Expansion
(ppm/ C )
Thermal
Conductivity
(w/mK)
Electrical Resistivity
(micro ohm cm)
Material
Everybody asks, “What is Ormet? What can you compare it to?”
Ormet offers a simple chart with known metals, alloys and conductive adhesives. (Silver Epoxy)
While Ormet most closely matches solder in its physical attributes, it stands apart versus a silver epoxy.
Thermal data is on the next slide.
Ormet Circuits Confidential

11. Thermal Properties
CMC data to explore range of thermal properties in commercial products
Measured by laser flash in free standing film and 3- layer structures
Ormet has products ranging from 25 W/mK to 58 W/mK
Unovis Data to explore thermal conductivity vs sintering temperature in Ormet 700
Ormet’s thermal conductivity is a compelling part of the reason to choose Ormet for die attach.
Ormet has had thermal conductivity tested by 2 outside laboratories, and shown a consistent:
58 W/mk for Ormet 802
25 W/mK for Ormet 700
25 W/mK for Ormet 260C
The data is robust versus curing condition. Ormet is continuing to test the properties of our material over time at 150C.

12. Commercial Applications
Current product line used in fabrication of high complexity PCBs for server, mainframe and defense applications
Core via-fill & z-axis interconnection
Yield, reliability and performance drivers
Ormet is being used in the commercial and military markets today making interconnections between layers of PCBs.
By using Ormet in this way the has improved product yield, with better reliability through the reduced use of plated-through holes.
Ormet allows the customer to place microvias only where they are needed in the board. This approach can reduce the number of layers required in the board, resulting in a board with improved electrical signal performance, and greater potential for thermal management solutions
Ormet Circuits Confidential

13. Ormet Interconnects in PCB Applications
Filled Via
Ormet® Interconnect
Copper Plated Via
Pyralux Adhesive
Layer
The picture displays a high density built up Cu layer being attached to a multilayer sub assembly core.
The b-staged Adhesive layer is applied to the sub-assembly core with a polyester coverlay sheet, and laser drilled. The coverlay sheet acts as a stencil, and the Ormet paste is printed into the holes. The coverlay sheet is then removed and the HDI layer is laminated to the core.
The Ormet paste sinters to the copper pads of both layers, thus providing improved electrical/thermal resistance versus other paste solutions.
Source: Endicott Interconnect Technologies
Ormet Circuits Confidential

14. X-Sections of Filled Vias
8 mil diameter
93 mil depth
50µm Diameter
400µm Depth
Ormet has the ability to metallize holes where plating is becoming process challenged and expensive.
Industry standard fill equipment is able to fill Ormet materials in a wide range of applications. These images show large via structures found in large back plane PCBs and small but high aspect ratio vias used in microelectronic substrates as an alternative to copper plating.
Ormet Circuits Confidential

15. Die Attach Development
7/23/08

16. Objective Assess new products for die attach application
Confidential
Objective
Assess new products for die attach application
Target is to provide alternative to high Lead solders
Approach
Investigate patented Liquid Phase Sintering Technology
Investigate alternative cure profiles

17. Test conditions Confidential Room temperature die shear (post-cure)
260C die shear (post-cure)
260C die shear (post 85/85 for 24hrs)
Room temperature die shear (post 85/85 for 24hrs C solder reflow profiles)
Test Vehicle
4x4mm copper die on Ag plated copper leadframe
Bondline thickness microns

18. Cure Conditions Condition 1: Condition 2: Condition 3: Condition 4:
Confidential
Cure Conditions
Condition 1:
30 min ramp to 170C C
Condition 2:
30 min ramp to 170C C
Condition 3:
30 min ramp to 190C C
Condition 4:
30 min ramp to 205C C
Condition 5:
30 min ramp to 205C C

19. Test Results: Room Temperature DSS
Confidential
Test Results: Room Temperature DSS
Post Cure
Post 85/ C

20. Test Results: 260C Die Shear
Confidential
Test Results: 260C Die Shear
Post Cure
Post 85/85

21. Die Shear Observations
Confidential
Die Shear Observations
Failure mode was 100% cohesive
Small voiding observed
Strong effect of high cure temperature
Compare condition #1 vs condition #4
Compare condition #2 vs condition #5
Longer cure time also will increase adhesion
Compare condition #1 vs condition #2
Compare condition #4 vs condition #5
554 performance was improved through cure profile optimization
Compare condition #3 vs #’s 4 & 5
RD256 has notably better results than other formulations
Being sampled to beta sites as Ormet 555
Silver version being sampled as Ormet 580

22. Cross Section Analysis: RD256
Confidential
Cross Section Analysis: RD256
Post Cure
Post 85/ C
Excellent metallic bonding to surfaces and throughout material.
No signs of delamination after reliability testing

23. Confidential
Void Free Attach
61m
25m

24. Beta Site Testing Test Vehicle: Output Reliability Testing
Confidential
Beta Site Testing
Test Vehicle:
3x3mm Si die with Ag back-side plating
Ag-plated lead frame
Output
Electrical resistance (RDSON)
Thermal resistance (dVSD)
Reliability Testing
0hr
After MSL1
after MSL1 + UHST (96hr, 121C, 100% RH)
after MSL1 and TMCL (500cycles, -65C/+150C)

25. New Trials: Power & RF Modules
Provide 1 material solution
Replace solders for passives
Replace conductive adhesives for metal-backed IC’s, copper clips
Initial Beta Site Sampling

26. Die Attach Summary Confidential
Ormet is in beta site evaluation with new formulations for die attach
Focus is for High –Pb solder replacement
Die size target is <1x1mm to 4x4mm
Viscosity is well suited to screen printing
Low viscosity in development (RP-016)
Very high 260C adhesion after moisture exposure to bare copper
Customer reliability results look very promising
Advance applications in development
B-stage paste

27. Confidential
Wirebond Replacement

28. Wire-bond Replacement Application Detail
Confidential
Wire-bond Replacement Application Detail
Mold Compound
Ormet
Memory Chips
IC Substrate
Photos courtesy of VCI
Ormet’s technology is superior in T-cycling to conductive adhesive materials due to sintering to the bond pad and within the paste.

29. 16 Flash Memory Die Stack
Innovative solution to advanced die stacking applications
100 micron lines
250 micron pitch
Smaller form factor with lower assembly cost
High electrical performance
In collaboration with Asymtek and Vertical Circuits, Inc.

30. Excellent Reliability Results
Confidential
Excellent Reliability Results
Proven Reliability at 2 major Flash Memory OEMs
PRETEST
60'C 90'C RH THB
CTH -A
TCB
HAST -
HTS 150’C
Source Lot#
Live Die
after reflow
504hr
1008hr
72hr
250Cyc
500Cyc
750Cyc
1000Cyc
96hr
BD4S2YG.11 2
0/320
0/34
0/30
0/67
0/62
0/138
0/71
BDZS2YG.11 4
0/160
0/33
0/35
0/31
0/22
BD2PMWG.11
0/143
0/20
0/32 NA
Data courtesy of VCI
8 die stack flash memory CSP

31. Confidential
Staggered Die Stack 1 2 3 4 5 6 7 8
Staggered die stack in development with Vertical Circuits

32. Ormet Circuits Product Line Overview
Application
Product
Lead Free
Process
Viscosity
Thermal Conductivity
Cure
Via Fill & Z-axis Interconnection
Ormet 701 A copper-based conductive paste used to form Z-axis interconnects by filling microvias in multilayer boards and substrates
Yes
Screen Print / Dispense
KCPS
25 W/mK
Lamination Press Autoclave Vacuum Bag
Ormet 701AG A silver-based conductive paste used to form Z-axis interconnects by filling microvias in multilayer boards and substrates
Ormet A lead- based conductive paste used to form Z-axis interconnects by filling microvias in multilayer boards and substrates No
Die Attach
Ormet 555: A copper-based dispensable, or screen printable, electrically and thermally conductive paste for discrete, IC, and LED die attach applications.
KCPS
Box Oven with Nitrogen Atmosphere
Ormet 580
A silver-based dispensable, or screen printable, electrically and thermally conductive paste for discrete, IC, and LED die attach applications.
Conductive
lines and traces
Ormet 260 A screen printable, electrically conductive paste used for signal circuit creation and jumper wire repair.
KCPS
Reflow or Box Oven with Nitrogen Atmosphere
Ormet 260C A dispensable or screen printable, non slumping, electrically conductive paste used for creating conductive lines down to 80 microns.
Ormet 2600 A lead based screen printable, electrically conductive paste used for signal circuit creation and jumper wire repair.
Solder Replacement
Ormet 400 A screen printable conductive paste used as an alternative to solder paste.
PTH fill
Ormet 802 A conductive paste used for plugging thermal vias and copper through holes.
Pneumatic Pressure Fill
KCPS
58 W/mK

33. Summary
Ormet’s TLPS is in HVM to form high performance PCB interconnections
Provides Pb-free compatibility with low temperature assembly
Ongoing work to assess technology for electronics assembly applications
We are continuing to develop our TLPS technology, and willing to collaborate with customers, universities and other external groups.
Our current development efforts are focused on IC packaging, solar cell assembly, and PCB fabrication.
Ormet Circuits Confidential