1. 1 Terminations Chris Allen (callen@eecs.ku.edu) Course website URL people.eecs.ku.edu/~callen/713/EECS713.htm

2. 2 Termination resistors Purpose Reduce transmission-line reflections Complete circuit for ECL and GaAs outputs Issues Reflection characteristics Current / power loading Component placement / routing issues Resistor type, packaging Options End termination (  L  0 ) Source termination (  S  0 ) Other termination schemes Differential line termination

3. 3 End termination ECL output driver can sink/source 50 mA GaAs (GigaBit Logic) can sink/source 60 mA both could drive two 50-  loads

4. 4 End termination Fanout – How many inputs can one driver support? not limited by the input current (  500  A ) per input  current available is 50 mA – 24 mA = 26 mA driver outputtermavailable based on this analysis ECL or GaAs could drive over 50 inputs 26 mA / 0.5 mA = 52 inputs instead fanout is limited by the capacitance ( 3 pF to 5 pF per input) maximum fanout is about 10 inputs capacitance slow the signal rise time (RC circuit) rise time of RC circuit is,

5. 5 End termination Daisy-chain layout – one termination (only) at the far end Issues – stub connections to inputs must be short (> l / 6) so that each gate input appears as an open circuit

6. 6 End termination Daisy-chain layout termination resistor should be at the far end of the transmission line to minimize reflections or

7. 7 End termination Alternative layout option with end termination The driver ‘sees’ a single 50-  transmission line that is properly terminated The challenge is fabricating 100-  lines For CMOS and TTL technology A 50-  termination may exceed the driver’s current capacity To accommodate CMOS and TTL, can increase Z o and R so that the current required is within the driver’s ability Also, can reduce power dissipation in termination resistor with AC coupling During transient ( T r ), capacitor looks like short circuit X c = T r /  C if X c << R T, then reflection is small

8. 8 End termination Similar approach could also be used with ECL / GaAs Reduce power dissipation in termination resistor with AC coupling For differential lines in CMOS and TTL technology The termination pair could be capacitively coupled, taking advantage of the inherent DC-balance R 1 = 50  R 1 + R 2 >> 50 

9. 9 Source termination Source (or series) termination (  S = 0 ) Another approach to reduce reflections is to focus on the source end Assumption – far end impedance, Z L >> Z o (~ open circuit)   L ~ 1 For R O + R S = Z o,  S = 0 R O is driver resistance Issues – Only valid for driving far-end load (intermediate positions do not see full transition in single step)  no daisy chaining

10. 10 Source termination What is the driver’s output impedance? (CMOS, TTL, ECL, GaAs) Digital circuit output stages have output resistances that depend on logic state Family R o (HI)R o (LO)R in C in Fanout CMOS 28  10  5 M  10 pF~ 5 TTL 50  8  10 k  5 pF20 to 30 ECL 6  8  50 k  3 pF to 5 pF ~ 10 GaAs8  to 12  200  10 k  1.5 pF to 5 pF ~ 10

11. 11 Source termination Why aren’t R o (LO) higher for ECL and GaAs? Output transistor is not biased to cutoff mode R o ~ 1/slope ~ 60  ~ 600 

12. 12 Source termination Equivalent circuit for analyzing output For R O(HI)  R O(LO) cannot find R S that Satisfy R O + R S = Z O for both HI and LO cases For Z o = 50 , CMOS R s ~ 30  ECL R s ~ 40  GaAs R s ~ 40  (but a big  S when LO) However to pull down the output for ECL and GaAs, a pull-down resistor is needed as well

13. 13 Source termination How to determine value for R pd ? First, find the current, I pd, required to pull the voltage level down on the transmission line when the output goes low  V ~ 1 V  1 V/(2  50  ) = 10 mA  I pd  10 mA Second, during HI to LO transition, think of the trace as a charged capacitor Enforce these two conditions for V OH = -0.8 V, V EE = -5 V R s = 40 , Z o = 50  2 Z o due to open transmission line (  L = +1 ) R pd  330 

14. 14 Source termination Disadvantages of source termination The source termination scheme produces the desired output voltage only at the far end of the transmission line Therefore daisy-chaining is not permitted since gates attached midline will see irregular waveforms Therefore all receiving gates must be clustered at the end of the line

15. 15 Source termination Can drive more than one series terminated line, however must not exceed the max output current limit Driving two or more lines required a lower pull-down resistor value Drawing more quiescent current through the termination ( I OH ) reduces V OH (due to the gate’s internal resistance) resulting in a decreased noise margin

16. 16 Source termination Alternatively could use a circuit with multiple outputs, e.g., a fanout buffer, to drive more than one series terminated line Each output treated individually Load distribution Line impedance Pull-down resistor value

17. 17 Other termination challenges When there are several signal drivers on a given transmission line and they are not located together, where should the termination be located ? Example, TTL or CMOS tri-state outputs on bus, or ECL (or GaAs) gates connected in Wired-OR configuration on a transmission line Possible solutions include: 1.Adding a source termination to each driver 2.Adding an end termination to each receiver 3.Adding a series resistance between every junction of branches 4.Adding a shunt termination in the middle of the network Issues Option 1 well defined, requires little power, provides damping, reduces settling time Option 2 requires a lot of drive power but works in star configuration Options 1 and 2 provides a perfect solution except it wastes power and attenuates the signal Option 3 attenuates the signal at each junction  Option 4 is the middle termination

18. 18 Other termination challenges Driving multiple lines with single source, single termination Can drive a mix of terminated and unterminated lines Distorted waveforms result as the unterminated stub length increases The ripple following the LO  HI transition is a result of inadequate quiescent I OH level to cause a full signal level on all lines

19. 19 Other termination challenges Data busing involves connecting two or more outputs and one or more inputs to the same signal line Any driver can be enabled to apply data to the line Termination resistors matching the line impedance connected to both ends to prevent reflections In analyzing such a configuration, the capacitance of a disabled (unactive) driver should be taken as 2 pF for ECL

20. 20 Other termination challenges Examples of how to terminate twisted pair cables

21. 21 Other termination challenges Examples of how to terminate coaxial cables

22. 22 Termination resistor specifications Accuracy R = R nom   R (%),  R is the tolerance Impacts the reflection coefficient, Variations in R and Z o affect  Ideally  R = 0 Typical choices are 10%, 5%, 1% Recall   noise margin for ECL, NM ~ 15% for R  10%  Z o +22% or -19% for R  5%  Z o +28% or -22% for R  1%  Z o +34% or -25% for R  0%  Z o +35% or -26%  Z o impacts board manufacturing tolerances

23. 23 Termination resistor specifications Power rating Found using worst case condition (steady state) for ECL or GaAs, V HI ~ -0.8 V, V TT = -2 V, R T = 50   P = 29 mW  1/8-W resistors appropriate Resistor composition & package options Ideally the resistor should be purely resistive Z R = R + jX R, X R  0 However real resistors have reactance

24. 24 Termination resistor specifications Resistor composition & package options High-frequency circuit model for resistor Wire-wound resistors have a large inductive compontent Carbon-film or printed resistors have lower inductance Leaded resistors have lead inductance Surface-mount (leadless) resistors have much less inductance For high-frequency applications (low T r ) systems inductance is a significant issue  Use leadless, chip resistors Added benefit, doesn’t require vias for mounting vias cost money and restrict routing areas Printed resistors Laser trimmed to obtain precise resistance values

25. 25 Termination resistor specifications Resistor composition & package options Surface-mounted chip resistors also have less inductive crosstalk than leaded parts when placed close together Multi-resistor packs (packages containing multiple resistors, often in a single in-line package – SIP or dual in-line package – DIP) have unacceptable crosstalk due to proximity and due to a common current path DO NOT USE THESE IN HIGH SPEED DESIGNS