1. Automatic Test Equipment HIOKI E.E. CORPORATION

2. 198519901995 2000 1101 111011021111/12 1105 1300 1114 1115 1116 1117 PCB PACKAGE BOARD ASSEMBLY X-Y HiTESTER UNIT HiTESTER PRESS-TYPE HiTESTER X-Y HiTESTER 11071108 Road Map for ATE (Automated Test Equipment)

3. High-speed inspection Capability of lifted IC lead detection High-stability measurement Reversely mounted capacitor detection 1105 IN-CIRCUIT HiTESTER

4. Reduces running costs Flexibility Unmanned visual inspection. Unmanned operation. 1114 X-Y IN-CIRCUIT HiTESTER

5. Ultra high speed High-precision probing Scratch-less High accuracy Gerber data utilization Unmanned Operation 1115 X-Y C HiTESTER

6. Ultra high-speed inspection (4 arms) High-precision probing Scratch-less High accuracy (resolution of 5aF) Gerber data utilization Unmanned Operation 1116 X-Y C HiTESTER

7. High-speed inspection of IC packages, MCM High-speed measurement High positioning accuracy: repeatability within +/-3um Dedicated fixture of minimum 150um pitch User-replaceable probe 1107 UNIT HiTESTER

8. 1.High accuracy Position repeatability : Within ±3μm 2.High-speed measurement Inspection time : 0.3sec/1024points 3.Fine-pitch probe Minimum pitch : 150μm 4.Component test L, C, R and Diode measurement 5.Insulation test Applied voltage: 1V-step adjustable 1107 UNIT HiTESTER Details

9. 1107 UNIT HiTESTER Two Inspection Stages

10. High-speed testing for IC packages, such as MCM, BGA, FC-PGA, FC-BGA, CSP and high-density boards 1108 UNIT HiTESTER

11. Probe Pattern Inspection stage Sensor board Insulating film Bare board under test Capacitance measurement circuit Each pattern has the capacitance that is proportional to its area between probe and electrically isolated inspecting electrode (sensor board). In Actual Bare Board Inspection …

12. L: Length A: Area ε: Dielectric Constant Capacitance C= εA L The capacitance between parallel lines is proportional factor to its area. Therefore, capacitance measurement enables to measure its area. Short-Circuit/Disconnected Pattern Inspection with Area (Capacitance) Measurement

13. A Flying probe contacts flip-chip side and four- terminal probes contact PGA side with a fixture to measure resistance Four-terminal probe ﾞ Pattern Resistance measurement Circuit Jig for inspection Bare board under test In Actual Inspection …

14. Four-terminal measurement method With four-terminal measurement method, accurate resistance value can be measured by getting rid of wiring and contact resistance Minute electrical path resistance can be measured with four-terminal method Resistance measurement circuit Constant current source Voltmeter E0E0 r4r4 r3r3 r1r1 r2r2 E I r1～r4：r1～r4： How To Measure Electrical Path Resistance Resistance: R 0 Wiring and contact resistance

15. 1172-67 Double-Link Probe

16. 1172-41 Ｆ our-Terminal Probe

17. Probe for reversely mounted capacitor detection contacts here Probe for reversely mounted capacitor detection A probe for reversely mounted capacitor detection contacts the case of a electrolytic capacitor and the probes of a jig contacts the terminals In Actual testing …

18. Electrolytic capacitor Probe for reversely mounted capacitor detection Voltage measurement circuit PCB How To Detect Reversely Mounted Capacitors The voltage drop between the case and the terminals of a electrolytic capacitor is measured to detect its polarity

19. Packaging StructurePGA QFP TCP MCM BGA CSP Flip Chip (BGA, LGA, SO, etc.) FBGA/LGA Thick film circuit, LCD Display, Build-up structure board In-circuit modules COC Light interconnection 3-D structure packaging WOW Inspection Object Line/Space(μm) Pad size(μm) Dielectric constant Thickness of insulator Thickness of conductor 50/50 100 4.4 ～ 4.7 40 ～ 80 20 30/30 60 3.8 ～ 4.0 20 ～ 40 15 20/20 40 3.5 ～ 3.8 15 ～ 20 10 10/10 18 3.0 ～ 3.5 10 ～ 15 5 1995 2000 2005 2010 Road Map Appearance and Internal Inspection