1. Diode Packages Strip line & Micro strip line mounting HMICs mounting
Cylindrical stud package
Pill or micropill
HMICs mounting
Passivated chips
Beam lead devices
LID’s (Leadless inverted device package)

2. Cylindrical stud packages
Ceramic tube separating two studs, cathode and anode.
Fine wire connecting studs and diode chip.
Not suitable for microstrip line.
Shunt mounted on strip line circuits.

3. Pill or Micro pill
Shunt mounting in microstrip circuits on Alumina substrate.
Requires a hole to be drilled in alumina substrate.
Ultrasonic grinder is used for drilling.

4. Passivated Chips
Available with moly-gold contact for cathode & anode ends.
Eliminates parasitic reactances associated with package
Less cost
Dimensions:
C:15, G: 3, B:5

5. Beam lead devices: Leads are electro-deposited (gold, 0.6 mil thick)
Easily bonded to microstip conductor
Ti-Au or Mo-Au is evaporated before Au beams are deposited.
Mo or Ti – adherent layer for Au on SiO2 ; Diffusion barrier between Au and Al (Metallisation on Si)
Heat dissipated through the leads and increases impedance.

6. Beam Lead Schottky diode

7. LID Package (or) Ceramic Carrier Package
Mounted or die-attached on a metallised surface of the ceramic.
A lead is bonded from the top terminal to other side.
Shaded portions are metallised and make contact with microstrip conductor during mounting.

8. LID Package Easy to handle Ideal for high volume applications
Metallisation on feet allows single solder attachment
Offers parasitic reactances in a rugged structure.
Higher yields & lower assembly cost.

9. Mounting Die bonding Connecting Leads Heated Substrate mthod
Parallel gap welder method
Connecting Leads
Thermocompression bonding
Ultrasonic bonding
Parallel gap or step welding

10. Thermocompression bonding

11. Heated Capillary Method