1. Defense and Aerospace Screening Flows Joe Fabula joef@xilinx.com

2. Mil/Aero LDL 2 A Little History The following slides show what military and aerospace flows were available from Xilinx for many years Feedback from the space industry and recent military satilitte failures indicated the need for more intensive screening for some applications Our currently proposed full-V flow will follow this brief history

3. Mil/Aero LDL 3 Manufacturing Flows: Serving the needs from “Space to Base” R, V, H, SMD C, I, N, M, SMD

4. Mil/Aero LDL 4 Rad Tolerant Most Select M&SMD Grade More Select N-Grade Select Products C&I-Grade All Xilinx Products Controlled environments Plastic packages Supporting the Aerospace and Defense Market Space environment Radiation hardened Harsh environments requiring hermeticity Ceramic packages Wider temperature range required Plastic packages (Mil Temp) (Mil Temp, SMDs) PLUS

5. Mil/Aero LDL 5 Manufacturing Flows “C and I” grade - Commercial or Industrial Temp, Plastic “M” grade - Military Temp, Ceramic “N” grade - Military Temp, Plastic “R” grade (for space) - Radiation tolerant, Military Temp, Plastic, Extended Flow “V” grade (for space) - Radiation tolerant, Military Temp, Ceramic, Similar to Class-V “H” grade (for space) - Radiation Tolerant, Military Temp, non-hermetic ceramic Standard Microcircuit Drawing (SMD) - Military and Radiation Tolerant, DSCC part number

6. Mil/Aero LDL 6 Extended Flows for Space Extended burn-in (up to 240 hours) XRAY DPA PIND for hermetic packages CSAM for plastic packages

7. Mil/Aero LDL 7 Product Grade Comparisons For Critical Supply Chain Issues Full documentation and controlled extended product life cycle

8. Mil/Aero LDL 8 Product Grade Summary

9. Mil/Aero LDL 9 Where we are going Many changes are coming from what I will call “acquisition reform II”. Xilinx response to customer needs was to work with industry and customer experts and with DSCC to define screening flows that will satisfy future customer needs in the space and military markets. BUT, an issue arose in that technology developed packages to which traditional full class-S/V flows did not seem to apply. The solution was to work with our partners to develop screening flows for these devices which would demonstrate and the ensure equivalent reliability as standard military screening flows provided.

10. Mil/Aero LDL 10 CG560 - Ceramic Column Array Package Attributes Cavity Down, 42.5mm x 42.5 mm Ceramic substrate Interconnect: 90/10 hard solder column, 0.2mm tall attached with 63/37 soft solder. Column Pitch = 1.27 mm Thermal Resistance: Theta JA = 14.3 C/Watt, Theta JC = 1.6 C/Watt Hermetic Product

11. Mil/Aero LDL 11 CG717-Ceramic Column Array In Process Configuration - LGA Post Group D & Burn-in Configuration Package Attributes Cavity Up, 35mm x 35mm, 1.27 mm pitch, Ceramic Substrate Interconnect: 90/10 hard solder column 0.2mm tall attached with 63/37 soft solder Pin Compatible with the Virtex-II BG728 Thermal Resistance: Theta JA = 12 deg C/Watt Hermetically sealed with Au-Sn Lid 60 microns Bonding Pad Pitch

12. Mil/Aero LDL 12 CG717 Package X-Section

13. Mil/Aero LDL 13 CG717 Package Qualification Data

14. Mil/Aero LDL 14 CF1144 - Ceramic Flip Chip Package Attributes 35mm x 35mm, 1.0 mm pitch, Multi Layer Ceramic Substrate 90Pb/10Sn flip chip solder 90Pb/10Sn hard solder column Thermal Resistance: Theta JA =10 deg C/Watt, Theta JC = 0.5 deg C/Watt MSL1 (Non-hermetic) – IBM technology with 30 years experience (Column) Lid strength = 1200psi

15. Mil/Aero LDL 15 CF1144 Outgassing Data Epoxy Components Underfill (0.56% of package weight) TML%: 0.13 CVCM %: 0.00 Lid attach material (0.31% of package weight) TML%: 0.28 CVCM %: 0.16 Total package weight: 19.3g Tested by NASA.

16. Mil/Aero LDL 16 CF1144 Package Qualification Data

17. Mil/Aero LDL 17 Xilinx/Aerospace full class V flow

18. Mil/Aero LDL 18

19. Mil/Aero LDL 19

20. Mil/Aero LDL 20

21. Mil/Aero LDL 21

22. Mil/Aero LDL 22

23. Mil/Aero LDL 23

24. Mil/Aero LDL 24

25. Mil/Aero LDL 25

26. Mil/Aero LDL 26