1. Electronic Pack….. Chapter 7 Production of PCBs. Slide 1 Chapter 7: Production of Printed Circuit Boards Focus on automated production of printed circuits by Surface Mounting Technology (SMT) and Hole Mounting Technology (HMT).

2. Electronic Pack….. Chapter 7 Production of PCBs. Slide 2 Hole Mounting Axial components: Sequencing and mounting Radial components: Mounting DIP components: Mounting Odd components: Robot or hand mounting Fig. 7.1:The process for production of hole mounted PCBs

3. Electronic Pack….. Chapter 7 Production of PCBs. Slide 3 Hole Mounting, continued Fig. 7.2 a): Schematic example of the most efficient sequence of mounting the components of a particular PCB.

4. Electronic Pack….. Chapter 7 Production of PCBs. Slide 4 Hole Mounting, continued Fig. 7.2 b): The principle of sequencing.

5. Electronic Pack….. Chapter 7 Production of PCBs. Slide 5 Hole Mounting, continued Fig. 7.3:Sequencing machine.

6. Electronic Pack….. Chapter 7 Production of PCBs. Slide 6 Hole Mounting, continued Fig. 7.4: Axial inserter with two mounting heads.

7. Electronic Pack….. Chapter 7 Production of PCBs. Slide 7 Hole Mounting, continued Fig. 7.5: Simplified process in the axial inserter: 1): Cutting the components from the tape 2): Lead bending 3) - 4): Insertion 5): Cut and clinch 6): Return to starting position.

8. Electronic Pack….. Chapter 7 Production of PCBs. Slide 8 Hole Mounting, continued Fig. 7.6: DIP inserter.

9. Electronic Pack….. Chapter 7 Production of PCBs. Slide 9 Hole Mounting, continued Fig. 7.7: Manual mounting board with light guide.

10. Electronic Pack….. Chapter 7 Production of PCBs. Slide 10 Hole Mounting, continued Fig. 7.8: Wave soldering machine.

11. Electronic Pack….. Chapter 7 Production of PCBs. Slide 11 Wave Solder Process Apply adhesive by dispenser, screen printing or pin transfer Cure by heat or UV Turn board Wave solder –Double-wave soldering machine common for SMT –Not all SMD components suitable for wave soldering

12. Electronic Pack….. Chapter 7 Production of PCBs. Slide 12 Wave Soldering, continued Fluxing Pre-heating Soldering (Cleaning) Fig. 7.9: a): Principle of foam fluxer. b): Control system for density and level of the flux bath.

13. Electronic Pack….. Chapter 7 Production of PCBs. Slide 13 Wave Soldering, continued Fig. 7.10: a): Principle of wave soldering. b): The real shape of the wave.

14. Electronic Pack….. Chapter 7 Production of PCBs. Slide 14 Wave Soldering, continued Fig. 7.11: a): Industrial in line cleaning machine. b): The principle of ultrasound and vapour cleaning.

15. Electronic Pack….. Chapter 7 Production of PCBs. Slide 15 ElectroStatic Discharge (ESD) Precautions Fig. 7.12: An ESD protected working space. The resistors R normally are 100 Kohm - 1 Mohm.

16. Electronic Pack….. Chapter 7 Production of PCBs. Slide 16 Surface Mounting Soldering by wave solder process or by reflow process Fig. 7.13:Application of adhesive for SMD mounting by: a): Screen printing b): Dispensing c): Pin transfer

17. Electronic Pack….. Chapter 7 Production of PCBs. Slide 17 Surface Mounting, continued Fig. 7.14: a): Shadowing in SMD wave soldering. b): Solder bridging on fine pitch package.

18. Electronic Pack….. Chapter 7 Production of PCBs. Slide 18 Surface Mounting, continued Fig. 7.15: Double wave for SMD soldering. The first is a turbulent wave that wets, followed by a gentle “lambda wave” that removes superfluous solder. Lambda wave

19. Electronic Pack….. Chapter 7 Production of PCBs. Slide 19 Surface Mounting, continued Fig. 7.16: Temperature profile during wave soldering in a double wave machine.

20. Electronic Pack….. Chapter 7 Production of PCBs. Slide 20 Reflow Solder Process Print solder paste Mount components Dry solder paste Solder by heating to melting of paste

21. Electronic Pack….. Chapter 7 Production of PCBs. Slide 21 Solder Paste Consists of: –Solder particles (≈ 80 % by weight) –Flux –Solvents and additives to give good printing properties (rheology) Typical mesh count in screen: 80 per inch Area ratio: A o = a 2 /(a+b) 2 Paste volume deposited: V = Vo Ao t "Solder ball test" for quality of solder paste and solder process

22. Electronic Pack….. Chapter 7 Production of PCBs. Slide 22 Solder Paste, continued Fig. 7.17: Microphotograph of Multicore solder paste type Sn 62 RMA B 3. The designation means 62 % by weight of Sn, 35.7% Pb, 2%, Ag, 0.3% Sb, RMA flux, 75 µm average particle size, 85% metal content, viscosity 400 000 - 600 000 centipoise.

23. Electronic Pack….. Chapter 7 Production of PCBs. Slide 23 Solder Paste, continued Fig. 7.18: Test of solder paste: The paste is printed through a circular opening with a diameter of 5 mm, in a 200 µm thick stencil. After reflow, the paste should melt into one body, without any particles spreading out.

24. Electronic Pack….. Chapter 7 Production of PCBs. Slide 24 Screen Printing Woven screen (stainless steel or polyester) with organic photosensitive layer, which is patterned with holes (mask). Metal stencil with etched or drilled openings. Polyester stencil with punched or drilled openings. Definition and accuracy depends on type, mesh count, thickness, tension, squeegee, speed, etc. Printing is a complex craft.

25. Electronic Pack….. Chapter 7 Production of PCBs. Slide 25 Screen Printing, continued Off-contact for screen printing, contact for stencil. Two-step stencil for best definition. The most advanced printers are fully automatic with vision system for alignment.

26. Electronic Pack….. Chapter 7 Production of PCBs. Slide 26 Surface Mounting, continued Fig. 7.19: Detail of printing stencil (left) and printing screen with fine line printing pattern.

27. Electronic Pack….. Chapter 7 Production of PCBs. Slide 27 Surface Mounting, continued Fig. 7.20: Detail of printing stencil with fine pitch printing pattern: Cross section of a stencil etched from both sides, with an acceptable, small amount of offset (40 x magnification).

28. Electronic Pack….. Chapter 7 Production of PCBs. Slide 28 Surface Mounting, continued Fig. 7.21: Two steps printing stencil.

29. Electronic Pack….. Chapter 7 Production of PCBs. Slide 29 Surface Mounting, continued Fig. 7.22: Printing through 0.3 mm diameter holes with Mylar stencil. To obtain the correct amount of solder paste two or three small holes may be used for each solder land.

30. Electronic Pack….. Chapter 7 Production of PCBs. Slide 30 Surface Mounting, continued Fig 7.23 a): Screen printer.

31. Electronic Pack….. Chapter 7 Production of PCBs. Slide 31 Surface Mounting, continued Fig. 7.23 b): The squeegee (DEK).

32. Electronic Pack….. Chapter 7 Production of PCBs. Slide 32 IR Soldering Fig. 7.24 a): IR furnace. Schematically with low temperature "area emitter".

33. Electronic Pack….. Chapter 7 Production of PCBs. Slide 33 IR Soldering, continued Fig. 7.24 b): Industrial IR furnace.

34. Electronic Pack….. Chapter 7 Production of PCBs. Slide 34 IR Soldering, continued Infrared Soldering Planck´s law: W/A = k 1 -5 {exp(k 2 / T)-1)-1}, –where: –W/A = emitted energy pr. second per m 2 area –k 1 = 2  hc 2 –h = Planck´s constant –k 2 = hc/k –k = Boltzmann’s constant Wavelength of max. radiation: – max = k 3 /T Total radiated energy (Stefan Boltzmann´s law): –W/A =  T 4  = Stefan Boltzmann’s constant  = emissivity (between 0 and 1)

35. Electronic Pack….. Chapter 7 Production of PCBs. Slide 35 IR Soldering, continued Fig. 7.25: Typical temperature profile for an IR furnace.

36. Electronic Pack….. Chapter 7 Production of PCBs. Slide 36 Vapor Phase Soldering Newton´s law :  Q/  t = hA (T f -T s ) Where:  Q/  t = energy transferred pr. sec. (W) A = total area h = heat transfer coefficient T f = vapour temperature (boiling point) T s = PCB temperature PCB temperature approaches T f asymptotically: (T s -T o ) = (T f -T o )(1 -exp (-t/to))

37. Electronic Pack….. Chapter 7 Production of PCBs. Slide 37 Vapour Phase Soldering Fig. 7.26 a): Principle of in-line vapour phase soldering machine.

38. Electronic Pack….. Chapter 7 Production of PCBs. Slide 38 Vapour Phase Soldering, continued Fig. 7.26 b): Industrial in-line vapour phase soldering machine.

39. Electronic Pack….. Chapter 7 Production of PCBs. Slide 39 Vapour Phase Soldering, continued Fig. 7.27: Heat transfer coefficient for air and fluorocarbons. Boiling fluorocarbons, at the bottom, give 200 - 400 times more efficient heat transfer than air.

40. Electronic Pack….. Chapter 7 Production of PCBs. Slide 40 Vapour Phase Soldering, continued Fig. 7.28: Temperature profile through in-line vapour phase soldering machine.

41. Electronic Pack….. Chapter 7 Production of PCBs. Slide 41 Vapour Phase Soldering, continued Fig. 7.29: Chemical composition of fluoro carbons for vapour phase soldering. Top: The liquid FC-5311 (3M): C14 F24 is derived from C14 H10. Bottom: The liquid LS 230 (Galden).

42. Electronic Pack….. Chapter 7 Production of PCBs. Slide 42 Vapour Phase Soldering, continued Table 7.1: Physical properties of some primary vapours for reflow soldering.

43. Electronic Pack….. Chapter 7 Production of PCBs. Slide 43 Other Soldering Methods Impulse (hot bar-, thermode-) soldering Hot plate / hot band soldering (thick film hybrid) Hot air soldering Laser soldering

44. Electronic Pack….. Chapter 7 Production of PCBs. Slide 44 Thermode Soldering Fig. 7.31: Two types of thermodes for thermode soldering.

45. Electronic Pack….. Chapter 7 Production of PCBs. Slide 45 Thermode Soldering, continued Fig. 7.32: Temperature profile for thermode soldering.

46. Electronic Pack….. Chapter 7 Production of PCBs. Slide 46 Component Placement –Automatic, dedicated pick-and-place machines –Manual placement (prototypes, repair) –Semi-manual (light guided table, etc.) Programmable robot Elements of Pick-and-Place Machine –Board magazine/feeder system –Mounting head(s) (with interchangable grip tools) –Programming/control unit –Component "storage" and feeder –(Vision system)

47. Electronic Pack….. Chapter 7 Production of PCBs. Slide 47 Component Mounting Fig. 7.33: SMD pick-and-place machine (Siemens). The mounting head may also include an electronic vision system for very accurate placement of fine pitch components.

48. Electronic Pack….. Chapter 7 Production of PCBs. Slide 48 Component Mounting, continued Fig. 7.34: a): Mechanical gripper in a pick-and place machine. b): Detail of the component tape when a component is in position for picking. c): Vibration feeder.

49. Electronic Pack….. Chapter 7 Production of PCBs. Slide 49 Component Mounting, continued Fig. 7.35: Fuji CP-II pick-and- place machine. The machine has magazine for over 100 types of small components, nominal speed up to 15 000 components per hour, placement accuracy 0.10 mm. It has a rotating head with 12 positions, bottom figure, and two alternative tools at each position. There are components at all 12 positions at any time, with a separate operation being performed. A CCD camera shows the accurate position and orientation on a CRT screen (Fuji).

50. Electronic Pack….. Chapter 7 Production of PCBs. Slide 50 Component Mounting, continued Fig. 7.36: Philips large hardware controlled pick-and-place machine.

51. Electronic Pack….. Chapter 7 Production of PCBs. Slide 51 Solder faults Fig. 7.38: Small SMDs standing on edge due to the "Manhattan-" or "tombstone-" effect.

52. Electronic Pack….. Chapter 7 Production of PCBs. Slide 52 Robot System for Placement Advantages: –Flexibility: Can handle most odd component types and boards, in low and high volumes –Uniform quality –High placement accuracy (≤ 0.02 mm) –Non-manned operation (over night) –Can work in hostile environments –Tests and controls can be included in placement operation by special sensors on robot

53. Electronic Pack….. Chapter 7 Production of PCBs. Slide 53 Robot Mounting Fig. 7.39: Example of a programmable placement robot for electronics: The SCARA robot.

54. Electronic Pack….. Chapter 7 Production of PCBs. Slide 54 Robot System for Placement Must be carefully considered: Cost, including the external equipment, fixtures, transport system Lower capacity than Pick-and-Place Requires careful planning, and often much dedicated surrounding equipment

55. Electronic Pack….. Chapter 7 Production of PCBs. Slide 55 Robot Mounting, continued Fig. 7.40: The main components of a robot system.

56. Electronic Pack….. Chapter 7 Production of PCBs. Slide 56 Robot System Components Manipulator –Learning unit –Control unit Types of Manipulator Coordinate Systems –Cartesian –Cylindrical (including "Scara") –Spherical –"Human-like"

57. Electronic Pack….. Chapter 7 Production of PCBs. Slide 57 Robot Mounting, continued Fig. 7.41: Types of robot arms: a): Cartesian motion. b): Cylindrical. c): Spherical. d): "Human like". The SCARA robot is a special version of the cylindrical type.

58. Electronic Pack….. Chapter 7 Production of PCBs. Slide 58 Robot System Components, continued Programming –"Lead-and-learn” –"Jog-and-learn” –"Synthetic programming"

59. Electronic Pack….. Chapter 7 Production of PCBs. Slide 59 Robot Mounting, continued Fig. 7.42: Multi gripper head.

60. Electronic Pack….. Chapter 7 Production of PCBs. Slide 60 Robot Uses in Electronics Production –Component placement –Production of parts (coils, cables,.... –Board feeding –Handling of boards, components in testing –Automatic trimming in test –Parts assembly for board, rack, chassis, etc. –Screw and glue operation –Soldering, welding etc.

61. Electronic Pack….. Chapter 7 Production of PCBs. Slide 61 Robot Mounting, continued Fig. 7.43: Robot cell for electronic component placement (Adept).

62. Electronic Pack….. Chapter 7 Production of PCBs. Slide 62 Types of Boards: SMD and Mixed Assembly SMD side A SMD side A and hole components side B SMD side A and B SMD both sides, hole components side B

63. Electronic Pack….. Chapter 7 Production of PCBs. Slide 63 Process Sequences Fig. 7.44 a -d): Process sequences for boards with different types of components on the two sides. The steps marked "For all processes" on figure a) are not repeated on the other figures.

64. Electronic Pack….. Chapter 7 Production of PCBs. Slide 64 Process Sequences Fig. 7.44 a -d): Process sequences for boards with different types of components on the two sides. The steps marked "For all processes" on figure a) are not repeated on this figure.

65. Electronic Pack….. Chapter 7 Production of PCBs. Slide 65 Process Sequences Fig. 7.44 a -d): Process sequences for boards with different types of components on the two sides. The steps marked "For all processes" on figure a) are not repeated on this figure.

66. Electronic Pack….. Chapter 7 Production of PCBs. Slide 66 Process Sequences Fig. 7.44 a -d): Process sequences for boards with different types of components on the two sides. The steps marked "For all processes" on figure a) are not repeated on this figure.

67. Electronic Pack….. Chapter 7 Production of PCBs. Slide 67 Board Testing Functional test "In-circuit" test NB: Good designs use one-sided testing –Test jigs

68. Electronic Pack….. Chapter 7 Production of PCBs. Slide 68 Testing of PCBs Fig. 7.45: Two methods for single sided test of a board with components on both sides.

69. Electronic Pack….. Chapter 7 Production of PCBs. Slide 69 Testing of PCBs Fig. 7.46: Bed-of-nails test fixture.

70. Electronic Pack….. Chapter 7 Production of PCBs. Slide 70 Testing of PCBs Fig. 7.47: a) Detail of single sided test fixture. b) Double sided fixture.

71. Electronic Pack….. Chapter 7 Production of PCBs. Slide 71 Testing of PCBs Fig. 7.48: Two types of test pins.

72. Electronic Pack….. Chapter 7 Production of PCBs. Slide 72 Testing of PCBs Fig. 7.49: Unacceptable testing. The test point should be on the Cu foil on the board, not on the component lead.