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Bulk Micromachining of Silicon for MEMS
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Mechanical Material SILICON?
Stiff => Thinning is required for appreciable strain
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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Structure of Single Crystal Silicon
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Miller Indices for Single Crystal Silicon
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Miller Indices for Single Crystal Silicon
SCS has anisotropic properties: Electrical, Thermal, Mechanical, Chemical
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ETCHING for BULK MICROMACHINING (Isotropic/Anisotropic)
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ETCHING for BULK MICROMACHINING (Isotropic/Anisotropic)
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ETCHING for BULK MICROMACHINING (Cavity/Cantilever Anisotropic)
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DRY (Plasma) ETCHING
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Deep Reactive Ion Etch (DRIE)
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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Single Crystal Silicon for MEMS
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What is MICRO-MACHINING?
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What can Micromachined Parts/Systems do for us
What can Micromachined Parts/Systems do for us? Be a Conduit to Microscopic Domain: 1. Sensing (Information) 2. Information Processing 3. Communication 4. Manipulation (Actuation and Control)
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Why / Why not SILICON? Semiconductor: Active Devices + Sensors (Photo-Magneto-Strain Sensing) Insulator: SiO2 , Si3N4 , Glass Thin Film Conductor: Aluminum, Gold, Silicides PhotoLithography: Planar control (+ & -)
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Mechanical Material SILICON?
Stiff => Thinning is required for appreciable strain
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Micromachining of SILICON?
Additive Processes: Chemical and Physical Deposition (Thin Layers only) (Single/Poly) Removal Processes: Chemical and Physical Etching (Wet/Dry/Plasma/Inert/Reactive) (Bulk/Film) (Anisotropic/Isotropic) MICROMACHINING of SILICON => (a) BULK (substrate) (b) SURFACE (films)
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BULK MICROMACHINING (Etchants: Isotropic/Anisotropic)
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BULK MICROMACHINED (Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED (Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED (Silicon Capillary for Insulin Infuser)
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BULK MICROMACHINED (Silicon Mask for Cylindrical Micromotion Sensor)
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BULK MICROMACHINED (Series Connected Photovoltaic Converter Battery)
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BULK MICROMACHINED (Series Connected Photovoltaic Converter Battery)
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BULK MICROMACHINED (Series Connected Photovoltaic Converter Battery)
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Micro Electro Mechanical Sytems
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M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology)
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Three-Layer Poly-Silicon Surface Micromachining Process (to build Mechanical Parts on CMOS IC)
Final cross sectional view with 7 layers
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Three-Layer Poly-Silicon Surface Micromachining Process
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Surface Micromachined
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Micromachining of Projection Camera
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M.G.Guvench M (CMOS-IC Technology) + E (CMOS-IC Technology) + M (Silicon and Sacrificial Layers) + O (Aluminum) + S (IC Packaging Technology)
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Surface Micromachined Silicon Sensors
M.G.Guvench
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Surface Micromachined Silicon Sensors
M.G.Guvench
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Electrostatic Field Sensors
M.G.Guvench
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Electrostatic Field Sensors
M.G.Guvench
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Electrostatic Field Sensors
M.G.Guvench
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Mass (Absorption/Deposition) Sensor
M.G.Guvench
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Mass (Absorption/Deposition) Sensor
M.G.Guvench
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Mass (Absorption/Deposition) Sensor
M.G.Guvench
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Electrostatic Field Sensors
M.G.Guvench
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Flow Skin Friction Sensors
M.G.Guvench
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Flow Skin Friction Sensors
M.G.Guvench
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CMOS Analog Chip Design (Operational Amplifier)
M.G.Guvench
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Surface Micromachined Silicon Sensors
M.G.Guvench
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MEMS Switch
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MEMS Micromotor
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A Mass (Absorption/Deposition) Sensor
M.G.Guvench
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