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MultiMEMS MPW Design Introduction Course Part1: Introduction.

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Presentation on theme: "MultiMEMS MPW Design Introduction Course Part1: Introduction."— Presentation transcript:

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2 MultiMEMS MPW Design Introduction Course Part1: Introduction

3 The MultiMEMS Organisation Partners: SensoNor SINTEF ICT Vestfold University College (VUC)  Sattelite Access Centres (SAS) LioniXs, the Netherlands C2V, the Netherlands AML, UK Imego, Sweden FraunHofer ISIT, Germany MicroStencil UK

4 Where is Horten ? In Norway: 90 km South of Oslo, on the west side of the Oslo-fjord. Nearest Airport: Torp (40 km)

5 MultiMEMS MPW Design Introduction Course At the end of this course you should be able to: Understand the MultiMEMS organisation. Understand the steps involved in MPW production Understand the limitations and the possibilities of the MultiMEMS MPW process Understand the main laboratory processing steps Use the MPW design handbook in design work Have an understanding of the main possibilities and limitations of the SensoNor foundry process Use the MultiMEMS system in product development

6 A total MST Concept Assembly and Packaging Assembly and Packaging ASIC design kit ASIC design kit Package design kit Package design kit Micro- structure design kit Micro- structure design kit Micro- structure element Design ASIC Design Package Design Sensor Element Manufacture Sensor Element Manufacture ASIC Manufacture ASIC Manufacture System Integration System Integration Test and Qualification Test and Qualification 5

7 Concept & feasibility Test & evaluation Traditional MST development MEMS development has historically been very research oriented. The manufacturing has been done using a project specific process in a research lab Very costly or impossible to transform to volume production Idea Design & modelling Prototyping 6

8 Concept & feasibility Development using an industrial MST process Test & evaluation Idea Design & modelling Prototyping Established, documented and qualified (repeatable, reliable) processes developed for MEMS products Infrastructure for support from design and development to manufacturing Easy to ramp up to volume production since an established process is used An established process gives confidence in cost prediction Production ramp-up Trial series production Qualification in system 7

9 Why Multi Project Wafer? Share the cost with other users! Access to industrial manufacturing process in a cost effective way Low-cost for prototyping compared with a custom run Can be used for low volume production Direct transfer to high volume production 8

10 MPW Services Today several MPW (Multi Project Wafer) services are available from MEMS Foundries. The following MPW services are offered through Europractice: Bulk Micromachining MPW MultiMEMS (SensoNor) MultiMEMS (SensoNor) Surface Micromachining MPW Bosch SOI Micromachining MPW MEMSOI (TRONIC’S Microsystems) MPW for diffractive optical elements CSEM 9

11 Concept & feasibility Design & modelling Prototyping Qualification in system Trial series production Test & evaluation Production ramp-up Test VUC SINTEF SensoNor DELTA MPW VUC SensoNor Micro- Component Production SensoNor MicroComponent Idea MultiMEMS – From Idea to Production Design Houses SINTEF FrH-Isit LioniX Imego C2V AML Alternative access points!

12 Foundry processes in MultiMEMS Based on SensoNor’s 4th generation wafer process High-precision membrane / spring definition 3-stack glass-Si-glass Hermetically sealed Buried conductor technology (patent)

13 Buried Piezo resistor Surface Piezo resistor Via etching Standard Processes 12

14 MultiMEMS MPW One of SensoNor’s standard foundry processes Four different chip sizes (3x3, 3x6, 6x3 and 6x6 mm x mm) 10, 15 or 20 chips depending on chip size Design tool support Library of elements 13

15 Product examples Accelerometers SA series e.g. 20,30,50 Tyre pressure sensors SP series e.g. 10,11,12,13 14

16 Design Examples from previous MPW runs Flow and Pressure Gas and Thermal Acceleration and Force

17 Flow and Pressure

18 Gas and Thermal

19 Acceleration and Force

20 Introduction End of this chapter Questions or comments?


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