1. We connect chips and systems
BME-ETT
Budapest University of Technology and Economics
Department of Electronics Technology
Prof. Gábor Harsányi
head of department
Presented by: Richárd Berényi
We connect chips and systems

2. BME – Faculty of Electrical Engineering and Informatics
Dept. of Control Engineering and Information Technologies
Dept. of Automation and Applied Informatics
Dept. of Computer Science
Dept. of Telecommunications
Dept. of Broadband Infocommunications and Electromagnetic Theory
Dept. of Electronics Technology
Dept. of Electron Devices
Dept. of Electric Power Engineering
Dept. of Measurements and Information Systems
Dept. of Telecommunications and Media Informatics
electrical engineering
Design, production and reliability of PCBs
Laser
technology
Sensor
technology
Integrated
Enterprise
Control
Systems
informatics
We connect chips and systems

3. BME-ETT’s Industrial Background in Hungary
> 10% GDP
> 30% Export
> people
We connect chips and systems

4. Competences in Electronics and Technology
Design and simulation of electronic circuits, PCB layout design
Complete design and simulation tools (Cadence)
Technology of module circuit boards
Complete prototyping line for PWB production
Flexible substrates
Thin film, Thick film
Technology of circuit assembly
Complete prototyping line for Surface Mount Technology assembling
Quality insurance and reliability
Accelerated lifetime tests
Failure analyses
We connect chips and systems

5. Recent industrial projects in Hungary
Research on lead-free soldering, process optimization
Research on polymer thick film technology
Laser drilled microvias in PCB and flexible substrates
Development of Automated Optical Inspection algorithms
Thin film evaporation, thickness distribution measurement and simulation
Application specific electrical tester development
Life-time increase of pick&place feeders
Optimization of solder paste stencil production technology
Development of interactive web-based education
Controlling system for six-sigma project
Quality tests, accelerated lifetime tests
Failure analyses
We connect chips and systems

6. We connect chips and systems
ETT-VLAB
BME-ETT developed a virtual laboratory environment for teaching microelectronics packaging technology.
It is an excellent tool for
students and engineers
to study
manufacturing equipment
processes
resulting products and
to make preparations for
hands-on experiments
VLAB can be used to
present laboratory facility
We connect chips and systems

7. X-ray structure and failure analysis
Opens of BGA bumps
PCB misalignment
tiltable detector
resolution: 600 nm
Examples of X-ray inspection applications:
 BGA, CSP ball inspection
Surface Mount Device solder joint
micro wire bond
multilayer printed wiring board 
interconnection
electromechanical components
effects of different solder pastes, fluxes
Wire-bond failures
We connect chips and systems

8. Scanning Acoustic Microscopy
reveals cracks, voids, delamination invisible for X-ray
non-destructive
SAM
Images of a solder joint failure
X-ray
optical
x-section
We connect chips and systems

9. Standard Climatic Tests
THC
-45°C..150°C
heat-up time: ~90min.
RH: %
Thermal shock
-60°C..200°C
lift time between
chambers ~10sec.
HAST
100°C..150°C
pressure: 2atm
RH: max. 100%
measurement of functional parameters during tests
We connect chips and systems

10. International relations – EU projects
FLEXIL
Laser processing of advanced flexible substrates
LidCat
Laser drilled µvias (50µm)
Cheap Multi Chip Modules
Establishment of fast prototyping low cost multichip module technology
LeadOut
Lead-free soldering process introduction for SMEs
FlexNoLead
Impacts of lead-free soldering on flexible technology
EMCI
Unique method for via metallization (embedded micro connector)
CLEAN
Leakage Currents and Static Power Consumption in Nanometer CMOS Circuits
We connect chips and systems

11. Leakage Currents and Static Power Consumption in Nanometer CMOS Circuits

12. Low-power interest in Hungary We connect chips and systems
BME Department of Electron Devices deals with semiconductor devices, including device physics, process technology, materials characterization, design of VLSI circuits, development of CAD tools and thermal measurement and characterization of ICs and IC packages.
Digital Media and System Engineering Laboratory (Prof.Dr. Ferenc Kovács) provides environment for the research of digital and analogue low-power circuits, development of VHDL-based circuit synthesis methods. His area includes the development of IC test equipment, real-time applications of VLSI circuits, low-power design of CMOS circuits and design of low-power biomedical instruments.
Analogical and Neural Computing Laboratory, MTA-SzTAKI, Budapest
Cellular Neural Networks (CNN) – a new computing paradigm for nonlinear spatio-temporal processing. Neurobiology is a motivating area. Research fields:
HW and SW implementation of CNN computers (CNN Universal Machine);
CMOS VLSI CNN chip development and application; emulated digital and optoelectronic implementations; systems research and system integration;
CNN chip set architectures interfaced to the digital world.
Integration Hungary Ltd (IHL) is a design center of Integration Associates Inc (IAI,
IAI is a fabless mixed-signal semiconductor manufacturer, Mountain View, CA, specialized in power management and IR, RF and wireline communication ICs.
IHL staff is focused on RF IC development. Main products are low data rate, low range ISM band transmitters and receivers (EZRadio products).
We connect chips and systems

13. We connect chips and systems
Contact details
Department of Electronics Technology
Budapest University of Technology and Economics
Goldmann t. 3., 1111 Budapest, Hungary
Contact: prof. Gábor Harsányi
Position: head of department
Tel.:
Fax:
Web:
Skills: high density electronic modules, PWB, laser technology,
sensors, biomedical applications, web-based courses
We connect chips and systems