1. Rockwell Collins: WEEE, RoHS and Pbfree Soldering Processes! David Hillman Advanced Process Engineering May 2006

2. 2 WEEE, RoHS & Pbfree Soldering Agenda: Background Industry Current Status Rockwell Collins Status

3. 3 WEEE, RoHS & Pbfree Soldering Background: Waste Electrical and Electronic Equipment (WEEE) - Prevention of waste - Reuse, recycling and other forms of recovery - Implementation August, 2005! Restriction of Certain Hazardous Substances (RoHS) - Contribute to environmentally sound recovery and disposal - Lead, mercury, cadmium, hexavalent chromium, PBB and PBDEs (brominated flame retardants) The Drafts Are Now Directive Requirements - Implementation July 1, 2006

4. 4 WEEE, RoHS & Pbfree Soldering Background: Computer/Communications Segment: 1980’s to 1990’sComputer/Communications Segment: 1980’s to 1990’s 49% Market Share  64.7% Market Share 49% Market Share  64.7% Market Share 425 Million Cell Phones Produced In 2000425 Million Cell Phones Produced In 2000 “Lead Additives In Gasoline Are Bad” “Lead Additives In Paint Products Are Bad” “Can Lead Be Eliminated From Electronics? “Can Lead Be Eliminated From Electronics?” Consumers Have Been Socially Biased That Lead Is Bad!

5. 5 WEEE, RoHS & Pbfree Soldering Industry Status: Current Direction Of Class 3 OEMs !!! Class 2 - Industrial Electronics - Will Make 2006 Deadline

6. 6 WEEE, RoHS & Pbfree Soldering Rockwell Collins Filed A Request for Exemption on September 21, 2004 with EU TAC – Review Completion Deadline of December 2004 Request for Further Exemption from the Requirements of Article 4(1) of Directive 2002/95 for Applications of Cadmium, Lead, and Hexavalent Chromium in the Aviation Sector submitted on behalf of Rockwell Collins, Inc. by Hunton & Williams Avenue Louise 326 box 6 B-1050 Brussels Tel. 02/643 58 00 Fax 02/643 58 22

7. 7 WEEE, RoHS & Pbfree Soldering

8. 8 Rockwell Collins Status Five Areas Of Focus –Area #1: Printed Wiring Board Finishes –Area #2: Component Lead Finishes –Area #3: Equipment/Manufacturability –Area #4: Reliability –Area #5: Legacy Product Issues

9. 9 WEEE, RoHS & Pbfree Soldering Rockwell Collins Status Area #1: Printed Wiring Board Finishes: Effort Complete: New Finishes Implemented Immersion Silver, Immersion Tin, ENIG (Immersion Gold) Rockwell Collins PWB Design Guidelines Revised Finish Advantages/Disadvantages Comparisons Decision Tree Charts Technology/Functionality Charts

10. 10 WEEE, RoHS & Pbfree Soldering Rockwell Collins Status Area #2: Component Lead Finishes: * Surface Finish Position Statement Sent to Supply Base * Lead-Free Component Protocols Implemented Tin WhiskersPbfree BGA

11. 11 WEEE, RoHS & Pbfree Soldering Area #3: Equipment/Manufacturability: * 7 DOE Assembly Process Trials Completed Collins is working on characterization of current RC soldering processes, obtaining capable vs. retrofit vs. replace comparisons, and understanding overall impact on current soldering practices Rockwell Collins has selected: SAC305 for a Pbfree Alloy Tin (Sn) Silver (Ag) 3% Copper (Cu) 0.5%

12. 12 WEEE, RoHS & Pbfree Soldering Area #3: Equipment/Manufacturability: ***34ºC Increase Over Current Solder Processes !!!

13. 13 WEEE, RoHS & Pbfree Soldering Rockwell Collins Status: Area #3: Equipment/Manufacturability: P3 = 3.3%P1 = 1.1%P2 = 2.2%

14. 14 Area #4: Reliability: JCAA/JGPP No Lead Solder Program: Test Vehicle & Solder Alloys: Sn3.9Ag0.6Cu (SAC) for reflow and wave soldering Sn3.4Ag1.0Cu3.3Bi (SACB) for reflow soldering Sn0.7Cu0.05Ni (SNIC) for wave soldering Sn37Pb (SnPb) for reflow and wave soldering

15. 15 WEEE, RoHS & Pbfree Soldering Rockwell Collins Status Area #5: Legacy Product Issues: * Effort In Progress: AOE Internal Test on Laminate and Structures

16. 16 Material Investigations - Solder Alloy Selection - Flux Selection - JCAA/JGPP Test Program (Testing Lead- Free Finishes on Components and Lead- Free Solders) Process Capability and Reliability Investigations - Wave Solder Trials - Reflow Process Trials - Equipment Analysis - CALCE Test Program Product Pathfinder Trials - Commercial Avionics Product - Military Avionics - Additional Product Selections Implement Lead-Free Process - Selected Facility Implementation including materials, process and product documentation activities

17. 17 Product Pathfinder Trials: Navy Mantech FA-18AB HUD Pbfree Project WEEE, RoHS & Pbfree Soldering

18. 18 WEEE, RoHS & Pbfree Soldering WEEE, RoHS, & Pbfree Will Impact You!