1. WP3: Progress Report Serafeim Katsikas & Fasiul Alam 1

2. Time Line 1/2 June 2013 Fasiul Start working on the project Sep 2013 Hardware Architecture Feb 2014 3D design of Modular Concept Feb 2014 Eleni Start working on the project March 2014 Sensor Board Electronic Design Sep 2014 Power Module Design Jan 2015 Prototypes Feb 2015 Test Campaign May 2015 Testing different embedded systems (Parallela) 2

3. Time Line 2/2 Sep 2015 2 nd Prototype Design Nov 2015 2 nd Prototype Hardware Developing Dec 2015 2 nd Test Campaign ? Feb 2 nd Prototype developed and documented Apr 2016 Final Documentation and Test results Aug 2016 End of Project 3

4. Deliverable and Milestone Reports Already Submitted Del & Mile no. Name of the delivery and milestone Project Month D3.1 Control and DAQ system HW and SW architecture design report, PSS module HW and SW architecture design report M16 D3.3 PSS module, CS, DAQ first prototype developed, performance test and system documentation M32 M19PSS module design, CS and DAQ system architecture design M16 M20PSS module first prototype manufactured, Control system and DAQ first prototype developed M30 Del & Mile no. Name of the delivery and milestone Project Month D3.4 PSS module, CS, DAQ 2 nd prototype developed, performance test and system documentation M40 D3.5 PSS system module, CS, DAQ HW+ SW final doc. incl. final tests results and recommendations, and M42 M21PSS module final prototype developedM36 M22Local specific trainings completedM42 Upcoming reports **We are now month of 32 (project month) **Total project month M48 4

5. Esr 6 Activities Fasiul’s PhD topic is “Situation Awareness – Operations Driven Role Assignment to Connective Objects” 2 publications 1 Conference 3 Workshops 5

6.  Current HW setup  PSS module original design plan  PCB design for Sensor and Power module  Design of sensor module  Programming, Integration and configuration of sensor module  Acquired sensing data  Power Module  Deliverable and Milestone reports  Some proposal for the selection of processing board 6 Overview

7. Current HW setup ESR-6 activities Sensor Module Power Module 7

8. PSS module original design plan GROUPMODULEPOSITION Power SupplyModule 1Bottom Processor & InterfaceModule 2Middle Sensor ModuleModule 3Middle Sensor ModuleModule 4Top We have designed only two module: Sensor and Power Note: Because of the main Processor Board we could not finalize whole module The current embedded board MIO-5271 is quite big and consumes 30 watts 8

9. PCB design Steps for Sensor and Power module 1: Starting new project (folder structure) 2: Schematic design 3: Selecting components and creating libraries (to select components for designs to prevent problems during production and about how to create useful libraries) 4: Footprints, 3D models, Starting new PCB ( to create footprints and 3D model of PCB) 5: Variants & BOMs (Creating and using variants, generating professional BOMs, job files) 6: Checking Libraries and Schematic 7: PCB Layout & Placement (start layout, placement) 8: PCB Layout & Impedances, Stack up (layout, calculate impedance and design own stack up) 9: Stack up Finishing PCB Length Matching (HDI stack up, finish / check PCB length matching) 10: Generating Output documentation 9

10. Sensor Module Some HW features of sensor module 1. It is built with ODH, Radiation, Humidity and Temperature, Body temperature, Accelerometer, Pressure, CO2 Sensors. 2.The main controller of the sensor module is based on MSP430 microcontroller. 3.The schematic and PCB works were compiled in Altium design development tool, a proprietary of Prisma Electronics. 4.The sensor module is very compact in size, i.e 60x50mm. 5.An electronic miniaturization has been considered in all design and component levels. 6.The sensor module has been developed based on modular concept. 7.This module can be used for remote sensing operation. 8.The module is operated by +5volt with approximate 0.5 watts. It can be also operate by USB power. PCB of sensor module Sensor module with enclosure 10

11. Programming, integration and configuration of Sensor Module 1. Programming of the microcontroller Intelligent Sensors Operating System (ISOS) developed by Prisma Electronics SA. The main responsibility of the Sensing uController software is reading and sampling the measurements from the sensors and forwarding them to main processor board through UART0 using the Modbus Protocol. In order to program and debug the PTU Sensing uController through JTAG, a JTAG adapter is used with the Texas Instruments USB Debug. Project Files FileTypeDescription ADC.c,.hContains functions to handle the Analog to Digital Converter Application.c,.hContains the sensor applications Delay.c,.hContains functions that implement time delay for a specified time period heart_beat_drv.c,.hDriver for the heart beat sensor HygroClip2_tmp _hum.c,.hDriver for the external temperature/humidity sensor (HygroClip2, rotronic) i2c.c,.hContains the functions that initialize and implement the I2C mode of USART init_clocks.c,.h Contains the functions that initialize the different clock crystals and implement the different clock signals IntHandler.c,.hContains the functions that implement the Interrupt Handler Io.c,.hContains functions for driving the LEDs and other I/O Main.c,.hThe main program Parameters.c,.hInitializes global parameters for several devices ProcSched.c,.hContains the functions that implement the Procedure Scheduler Protocol.c,.hContains functions that implement the Modbus protocol RegisterList.c,.hContains functions that implement the Registers List Sht_Drv.c,.hDriver the SHT1x/SHT7x Humidity and Temperature Sensor timerA.c,.h Contains the functions that initialize and implement the different count and operation modes of Timer A timerB.c,.h Contains the functions that initialize and implement the different count and operation modes of Timer B Usart.c,.hContains the functions that initialize and implement the UART mode and SPI mode of USART One of the important features of ISOS is it can be used for many more sensor modules 11

12. Programming, integration and configuration of Sensor Module 2.Calibration and testing Each sensor was tested separately in order to assure the connection with the microcontroller and their proper function regarding to power supply and noise level on the PCB. 3. Integration of sensor board The sensor board is configured by connecting through the console USB port of the PTU. In this way, the user has access to the terminal of the Linux distribution.  An USB cable to the Linux PC/PTU  Open putty or other similar software  Open the com port that is assigned to the PTU  Set the baud rate to 9600 4. Configuration of sensor board Program Files FileDescription PTU_forwarder.cThe main program PTU_forwarder.hHeader file of the main program json.cFunctions for creating and parsing JSON messages json.hHeader file of json.c ptu_forwarder.confConfiguration file for program and sensor parameters 12

13. Acquired Sensing parameters 13

14. Dose Radiation Measurement for AR application 14

15. Power Module Some HW features of power module 1.The power supply module is responsible for providing the power to the sensor board and PSS (PTU) sub-system. 2.It is based on LTC4008 battery charging circuit. 3.It provides 3 different voltage for example +12.0, +5.0, +3.3 volts. 4.The charging circuit has an output of +16V and it is used for for charging the battery. 5.The capacity of the battery is about 6800mAH. 6.The size of PCB footprint is 60x50mm with 6 layers design. 7.The selection of battery is a critical because of size, weight and ampere rating. 8.Current embedded board (Advantech) consumes approximately 30 watts which is very high. 9.An alternative backup plan is available from power gorilla. TypicalMax Embedded board4.68W29.52W uC0,33W0,5W Camera1.8W2W IMU.16W0.25W Display1W1.5W Paralinx HDMI Tx.1W1.5W The requirements of power Power module Battery Power gorilla BatteryParameters: Weight 700g Battery type HD Lithium Polymer Rechargeable Battery capacity 6 x 3500mAh Output voltage 5V - 24V Dimensions 215 x 130 x 17mm 15

16. Some proposals for the selection of processing board 16 Selecting the processing board is important for AR Software functional point

17. Number of Transistor in CPU and Performance over time 17 Every two years the number of transistors becoming double in a single processor, i.e. processing capacity increases

18. CPU VS POWER C = Capacitance V = Voltage F = Frequency 18

19. Selection depends on Operating System http://www.eetimes.com/document.asp?doc_id=1322014&print=yes 19

20. Selection depends on Supports http://www.eetimes.com/document.asp?doc_id=1322014&print=yes The most important factor in choosing an OS is availability of full source ­code. 20

21. Imax6 Tiny COM 38 mm 21

22. iMAX6 Tiny COM with career board 80 mm 90 mm 22

23. 5TH GENERATION INTEL® CORE™ PROCESSORS Provided By Kontron 95 mm 23

24. Specifications of board 24

25. i5/i7 COM with career board 25

26. Intel® NUC NUC5i5RY board 111 mm 115 mm A revolution in ultra-compact device design, the Intel® NUC kit NUC5i5RYK packs a range of features, including the latest 5th generation Intel® Core™ i5 processor and Intel® HD Graphics 6000, into 4 inches square. This fully scalable Mini PC has the performance to drive home theater PCs, media server PCs, home hubs, and intelligent computing for small spaces. 26

27. Intel® NUC NUC5i5RY board 27

28. Parallella Embedded platform Parallella-16 Embedded Platform, Epiphany III An FPGA based dual- core ARM Cortex-A9 single-board computer with an Epiphany III 16- core coprocessor chip. Parallella is a credit card sized 'supercomputer' consuming less than 5W of power. This very low cost platform is designed for developing and implementing high performance applications for which parallel processing is ideally suited. Parallella boards are designed so that interconnection forming large clusters is straightforward. 28

29. ODROID-XU3 Embedded platform 29 Samsung Exynos5422 Cortex™-A15 2.0Ghz quad core and Cortex™-A7 quad core CPUs * Mali-T628 MP6(OpenGL ES 3.0/2.0/1.1 and OpenCL 1.1 Full profile) * 2Gbyte LPDDR3 RAM at 933MHz (14.9GB/s memory bandwidth) PoP stacked * eMMC5.0 HS400 Flash Storage * USB 3.0 Host x 1, USB 3.0 OTG x 1, USB 2.0 Host x 4 * HDMI 1.4a and DisplayPort1.1 for display * Integrated power consumption monitoring tool

30. Comparative Features Board NameProcessorPheperialsPowerOSSize Imax 6 tinyFree Scale Imax 6, 4 core, 1.2 GHz, DDR3, 4GB SDHC HDMI, USB2, Ethernet, Camera interface etc 12volts 5 watts Linux90*80mm Intel 5 th Generation, by Kontron Intel i5/i7 processor, DDR3, 8GB RAM HDMI, USB2, USB3, Ethernet, Camera interface etc 12 volts 10-15 watts Windows, linux,170*145mm Intel® NUC NUC5i5RY board Intel i5 processor, DDR3, 16GB RAM HDMI, USB2, USB3, Ethernet/wifi, etc 12 volts 10/15watt Windows, archlinux, fedora, ubuntu, xubuntu 115*111mm Parallella-16 Embedded Platform Super computer Epiphany III An FPGA based dual- core ARM Cortex- A HDMI, USB2, Ethernet, Camera interface etc 5volts, 10 wattsLinux, ubuntu54*87mm ODROID-XU3Samsung Exynos5422 Cortex™-A15 2.0Ghz quad core It has all pheperials5 volt 10-20watts Linux, ubuntu94 x 70 mm 30

31. What’s Next? Scenario 1 – Use the same processor and peripherals like Advantech Devboard MIO5271 Scenario 2 – Use Gumstix DuoVero Scenario 3 – Use another board like Imax6 Tiny Scenario 4 – Use ODROID-XU3 – Parallella board 31

32. The facts Intel i5GumstixImax6 TinyParallellaODROID-XU3 Processing power EnoughPoorMaybe PoorMaybe enough ConnectivityFullNo USB3.0 full SizeVery LargeVery smallSmall small Power Consumption Very high >30WLowMediumLowmedium Design Difficulty Extreme Difficult Not difficultDifficultNot very difficult Software Development Effort Already developed There is previous work DifficultVery DifficultMaybe difficult PropositionUse the Advantech and improve the Sensor Board + Power Develop the modular architecture concept Use the Parallella Board and improve the Sensor Board 32

33. Thank you all 33