1. THEMIS Mission CDRInstrument I&T 1 UCB, June 14 - 18, 2004 Instrument Integration and Test Rick Sterling / Sharon Jelinsky University of California – Berkeley Thm_CDR_IT_Revc

2. THEMIS Mission CDRInstrument I&T 2 UCB, June 14 - 18, 2004 Overview Overview / Topics  I&T Sequence  Facilities  Integration Platform  Instrument Requirements  Integration/Test Flow  Schedule Milestones  Transportation

3. THEMIS Mission CDRInstrument I&T 3 UCB, June 14 - 18, 2004 Sequence LevelLocationStatus Instruments (ESA, SST, EFI, FGM, SCM, IDPU, BOOMS) SSL, Europe ETU Versions In Progress Instrument SuiteSSLETU begins August Instruments with ProbeSwales, GSFC First Probe begins February 2005 Probes with PCASwales, GSFC Begins December 2005 PCA with rocketKSCBegins August 2006

4. THEMIS Mission CDRInstrument I&T 4 UCB, June 14 - 18, 2004 Thermal Chambers Space Sciences Lab New Chamber for EFI Booms Cal Chamber Upgrade for SST Test Chamber Requirements Pre-Test Clean Pre-Test Bakeout TQCM Monitoring Cryo-Pump Final Bakeout GN2 Backfill Calibration Chambers Vacuum only Ion Gun Manipulator Facilities - Environmental Available ChambersType HiBay L1TVAXB Booms HiBay L2TVSTEREO 320 T10TVSTEREO 320 CalVacESA Cal 320 “Mini”TVSCM, Bake-outs B20-TV “Bayside”TVEFI B20-Large TVTVPayload TV B20-Cal VAC2VacSST Cal B20-TV “Snout”TV Comment 339-TV Cal SST, IDPU, EFI ESA MCPs Vibration Facilities Wyle AMES EMI/EMC EMCE Engineering – Fremont

5. THEMIS Mission CDRInstrument I&T 5 UCB, June 14 - 18, 2004 Room B20  3 T/V Test Chambers: Bayside, Snout, Bertha  High Vacuum Base Pressures of 1x10e-6 torr or better  Thermal Systems with LN2 cooling and IR heating  Thermal Controllers: Watlow hardware & Anawin Software  Test Chambers Certified prior to instrument testing –Verify Outgassing levels less than 1% TML and 0.1% CVCM –RGA measures of residual gasses to less than 1x10e-7 PP –TQCM to measure condensable materials deposition rates B20 T/V CHAMBERS

6. THEMIS Mission CDRInstrument I&T 6 UCB, June 14 - 18, 2004 Bertha - Large Thermal Vacuum Test Chamber Dimensions: 9 ft. Diameter x 16 ft. Long Accommodates 2 THEMIS Instrument Suites at once Temperature cycles of -80C to +80C Base Pressure of less than 1 x 10e-6 torr Tests full ETU and 5 Flight Instruments Chamber ‘Bertha’

7. THEMIS Mission CDRInstrument I&T 7 UCB, June 14 - 18, 2004 THEMIS Snout Dimensions: 3 ft. Diameter x 3 ft. Long Accommodate EFI Axial Boom Temperature cycles of -100C to +110C Base Pressure of less than 1 x 10e-6 torr Tests IDPU, AXB T/V, and Boom Deployment Chamber ‘Themis Snout’

8. THEMIS Mission CDRInstrument I&T 8 UCB, June 14 - 18, 2004 Bayside 3 ft. Diam x 3 ft. Length Fits 2 Instruments Temp Range: –100 to +110C Base Pressure: <1 x 10e-6 torr Chamber ‘Bayside’

9. THEMIS Mission CDRInstrument I&T 9 UCB, June 14 - 18, 2004 Thermal Testing TV Plan 2 Component-Level TV Cycles Prior to Instrument-Level I&T 6 Instrument Level TV Cycles at Instrument-Level Survival, Cold Start, Cycles (Functional at extremes), Bake-out Deployments in Vacuum SPB: Full Deploy w Takeup reel AXB: Deploy Hot & Cold MAG: First Motion Hot & Cold Typical TV Profile:

10. THEMIS Mission CDRInstrument I&T 10 UCB, June 14 - 18, 2004 Bertha  Vacuum Chamber in full working order  Thermal System designed; Baseplate and Shroud in production  Thermal Controller off the shelf & on order Snout  Vacuum Chamber manufacture complete and under test  Thermal System designed; Baseplate and Shroud in production  Thermal Controller off the shelf & on order Bayside  Vacuum Chamber in full working order  Thermal System designed and built  Thermal Baseplate and Shroud under installation and test Status of Chamber Upgrades

11. THEMIS Mission CDRInstrument I&T 11 UCB, June 14 - 18, 2004 Clean Room Features Requirement: 100K Class Nitrogen Gas purge available Continuous Oxygen Monitoring Temperature and Humidity Monitoring Weekly Air Quality sampling Controlled Access Crane Certification Staff Training Clean Rooms SSL

12. THEMIS Mission CDRInstrument I&T 12 UCB, June 14 - 18, 2004 Clean Room B20

13. THEMIS Mission CDRInstrument I&T 13 UCB, June 14 - 18, 2004 Clean Room 125

14. THEMIS Mission CDRInstrument I&T 14 UCB, June 14 - 18, 2004 Integration Platform Instrument Suite on Platform  Platform is same size as s/c deck  Framing supports platform to set comfortable work height  Metal rack alongside holds GSE and support equipment  GSE communicates with BAU Simulator via hardwire or ethernet INSTRUMENT PAYLOAD ASSEMBLY PLATE

15. THEMIS Mission CDRInstrument I&T 15 UCB, June 14 - 18, 2004 Parallel Integration and Test of S/C Platforms Parallel Integration/Test

16. THEMIS Mission CDRInstrument I&T 16 UCB, June 14 - 18, 2004 Instrument Cleanliness/Contamination Requirements ESA and SST require continual nitrogen gas purge Oxygen meter following instruments and gas purge equipment Normal ESD concerns Magnetometer sensors to be boxed except when under test and before flight Instrument-Provided GSE Accommodation Mu-Metal Enclosures for FGM & SCM N2 Purge Systems for ESA, SST Sphere Sensor Boxes for EFI Instrument Red/Green Tag Items Tracking IDPU - Arming plug enables actuators causing boom deployment EFI - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug EFI - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers SST - Covers to be removed before flight ESA - Cover; Arming plug; purge fitting;cocking pin nut Instrument Requirements

17. THEMIS Mission CDRInstrument I&T 17 UCB, June 14 - 18, 2004 Instrument Payload I&T Flow FGM Functional (Level 2) SCM Functional (Level 2) SST Functional (Level 2) Harness Bake-out IDPU-Harness Safe-to-Mate Payload EMC/EMI/MAGl Payload T-V ESA Functional (Level 2) Test Review Instrument PER MAG INTEGRATION EFI INTEGRATION ESA/SST INTEGRATION PAYLOAD ENVIRONMENTAL PayloadVibration Payload Acceptance ONLY if req’d (workmanship) Mag Alignment EFI AXB Deploy EFI SPB Deploy Mag Boom Deploy EFI Functional (Level 1) EFI Functional (Level 2) EFI/SCM/FGM Phasing ESA/SST Timing Payload CPT

18. THEMIS Mission CDRInstrument I&T 18 UCB, June 14 - 18, 2004 FGM I&T Flow FGS Vibration FGS Thermal IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration FGS Acceptance FGM Functional (Level 2) Inspection Mass Properties DC Magnetics 2 cycles T-V Bake-out +60C Sensor in TCU FGE Acceptance FGM Functional (Level 0) Without FGS Inspection IDPU Thermal 2 cycles T-V Bake-out +60C FGS Functional (Level 1) FGB Vibration FGB/SCB Thermal 1 cycle T-V Hot/Cold Deploy FGB Acceptance Inspection Mass Properties DC Magnetics Backplane Alignment EFI/SCM/FGM Phasing Mag Boom Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V FGM Functional Lev1) IDPU Acceptance Inspection Mass Properties DC Magnetics Test Review Boom Levels Instrument PER FGM BOOM (FGB) FGM SENSOR (FGS) FGM ELECTRONICS (FGE) FGM / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship)

19. THEMIS Mission CDRInstrument I&T 19 UCB, June 14 - 18, 2004 FGM Level 0 – Without Sensor (Aliveness) B-field about zero if FGM in Cal Mode (preferred mode) B-field saturated if feedback is closed Interface full functional Power consumption reduced by about 200mW FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test) B-field about 10,000nT, Noise about 1nT Full functionality, but B-field not representative FGM Level 2 – Sensor in TCU (Comprehensive Performance Test) B-field < 10nT, Noise <10pT/sqrt (Hz) B-field has to be available in full quality Delta in calibration coefficients known FGM Test Configurations

20. THEMIS Mission CDRInstrument I&T 20 UCB, June 14 - 18, 2004 SCM I&T Flow SCM Sensor Vibration SCM Sensor Thermal SCM Pre-Amp Bake-out IDPU/ESA/ SCM Pre-Amp Vibration SCM Sensor Bake-out Functional (Level 3) Bake-out +60C 3 cycles (air) SCM Sensor in Mu Metal SCM Pre-Amp Thermal SCM Pre-Amp Acceptance IDPU Thermal 2 cycles T-V Bake-out +60C SCM Functional (Level 1) SCB Vibration 14.1g RMS FGB/SCB Thermal 1 cycle T-V Hot/Cold Deploy SCB Acceptance Inspection Mass Properties DC Magnetics Bake-out +60C Alignment EFI/SCM/FGM Phasing Mag Boom Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload TV 6 cycles T-V SCM Functional (Lev 2) IDPU Acceptance Inspection Mass Properties DC Magnetics Test Review Boom Levels Instrument PER SCM BOOM (SCB) SCM SENSOR (SCM) SCM PRE-AMP SCM / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) SCM Sensor Acceptance Inspection Mass Properties DC Magnetics 3 cycles (air) Inspection Mass Properties DC Magnetics

21. THEMIS Mission CDRInstrument I&T 21 UCB, June 14 - 18, 2004 SCM Test Configurations SCM Safety – Feedback Plug Required when SCM Pre-Amp is powered and sensor is not connected SCM Level 0 – With SCM EGSE I/F Box (Aliveness) Same Power, Command, Analog output interfaces Power and Cal Mode identification by LED Cal Signal re-injected to the input Signal generator connected to input Validation by analysis of data SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test) Sensor kept in mu metal box during integration Axis identification Re-verification of end-to-end calibration Phase relation Check of conducted noise SCM/EField timing reference

22. THEMIS Mission CDRInstrument I&T 22 UCB, June 14 - 18, 2004 ESA I&T Flow ESA Functional (Level 2) Instrument Functional Cover Simulator Test ESA Thermal ESA Acceptance Inspection Mass Properties DC Magnetics ESA/SST Timing Payload Safe-to-Mate Harness Payload EMI/EMC/MAG Payload T-V 6 cycles T-V ESA Functional (Lev 1) Test Review Instrument PER ESA SENSOR ESA ELECTRONICS (ETC) ESA / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 2 cycles T-V Bake-out +60C IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration ESA Functional (Level 0) IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics ETC Acceptance Inspection

23. THEMIS Mission CDRInstrument I&T 23 UCB, June 14 - 18, 2004 SST I&T Flow SST Functional (Level 2) SST w/ Radiation Source Attenuator Test SST Vibration SST Thermal SST Acceptance Inspection Mass Properties DC Magnetics ESA/SST Timing Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V SST Functional (Level 1) Test Review Instrument PER SST SENSOR SST ELECTRONICS (DAP and ETC) SST / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 2 cycles T-V Bake-out +60C IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration DAP Acceptance SST Functional (Level 0) Without SST Inspection IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics ETC Acceptance Inspection

24. THEMIS Mission CDRInstrument I&T 24 UCB, June 14 - 18, 2004 EFI I&T Flow EFI Pre-Amp Bake-out EFI AXB Deploy Sensor in Mu Metal EFI Pre-Amp Thermal EFI Pre-Amp Acceptance AXB Vibration AXB Thermal 1 cycle T-V Hot/Cold Deploy AXB Acceptance Inspection Mass Properties DC Magnetics Bake-out +60C EFI Functional (Level 2) EFI/SCM/FGM Phasing EFI SPB Deploy Payload Safe-to-Mate Harness Payload EMI/EMC/MAGl Payload T-V 6 cycles T-V EFI Functional (Lev 1) Test Review Instrument PER EFI AXIAL BOOM (AXB) EFI RADIAL BOOM (SPB) EFI PRE-AMP EFI / PAYLOAD INTEGRATION PAYLOAD ENVIRONMENTAL Payload Vibration Payload Acceptance ONLY if req’d (workmanship) 3 cycles (air) Inspection Mass Properties DC Magnetics EFI ELECTRONICS (BEB and DFB) SPB Vibration SPB Thermal 1 cycle T-V Hot/Cold Deploy SPB Acceptance Inspection Mass Properties DC Magnetics EFI Pre-Amp Vibration IDPU Safe-to-Mate IDPU/ESA/ SCM Pre-Amp Vibration BEB Acceptance EFI Functional (Level 0) Without sensors Inspection IDPU Thermal 2 cycles T-V Bake-out +60C Backplane IDPU Acceptance Inspection Mass Properties DC Magnetics DFB Acceptance Inspection

25. THEMIS Mission CDRInstrument I&T 25 UCB, June 14 - 18, 2004 Upcoming Milestones

26. THEMIS Mission CDRInstrument I&T 26 UCB, June 14 - 18, 2004 Transportation Transportation and Logistics  Air Transport of Instrument Suites from Berkeley to Swales  Fed Ex Critical/Specialty Freight Overnight  Point to Point, Highest Security  Transport Berkeley’s spacecraft platform to Swales also  Post-Transport Acceptance Test at Swales