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ERD and Memory Architectures Paul Franzon Department of Electrical and Computer Engineering paulf@ncsu.edu 919.515.7351
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2 High Level Overview Challenges for Memories Power consumption Bandwidth Resiliency Scaling (density, speed, power) Opportunities Increased use of memory in logic and routing Using ERD devices to help ERD memories scale Intersection with 3DIC Impact on Memory Architectures Scope for new and more specialized memory architectures Mobile; (Cloud) Computing; SSD; Structured ASIC;
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3 Challenge: Bandwidth Soon to exceed 1 TBps Key challenge: Power: DDR3 would consume 600 W at this bandwidth
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4 Challenge: Power Consumption Memory hierarchy is becoming the largest single consumer of the power in a computer Consumes 30%+ of power in today’s servers E.g. DARPA Exascale computing study Note: This assumed DRAM power was reduced from 600 pJ/bit to 3 pJ/bit
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5 Challenge: Resiliency Issues: SEU of SRAM Checkpointing and resiliency of entire processor Future scaled systems could spend 80% of their time checkpointing Note: DRAM Failures almost all due to packaging
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6 Opportunity: Power Reduced capacitance associated with scalable 4F 2 ERD memory technologies Change RAM architecture Smaller sub-arrays Less energy/access Low-swing interconnect Reduced overhead Revisit memory hierarchy to optimize energy, not latency Exploit 3DIC for energy reduction
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7 Challenge: Scaling Scaling Peripheral Circuits Smaller memory sub-arrays increases overhead of sense amps and row/column decoders 4F 2 cells increases overhead of sense amps and row/column decoders Need: Technologies and techniques to reduce overhead of peripheral circuits Circuit Solutions Use of ERDs Use of 3DIC to implement peripheral circuits in a circuit- optimized technology
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8 Challenge: Scaling 1R1D cells needed for resistive memories to ensure scalability (1R cells limits array size) Impact of rectification ratio on scalability with 1R1D cell On:Off Ratio Rectifcation Memory Size
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9 Opportunity: Memory as Logic 4F 2 programmable ERD memory cells permit high density Look Up Tables and programmable logic Nanocrossbar CMOL Potential for high-speed (low C) and high density Need to compare to logic ITRS to establish benchmark
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10 Opportunity: Memory as Interconnect Use programmable persistent memory elements as routable switchbox interconnect Use high-density, low-overhead memory in NOC store/forward routing architectures Example: Using a low-voltage nanocrystal flash device as an interconnect switch
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11 Other Comments ERD as a Solid State Disk? Definitely an opportunity but it looks like magnetic disk will always outscale solid state disk in density and cost/bit. Instead use inside memory hierarchy, e.g. Disk cache, checkpoint store ERD as Associative Memory, Bayesian inference calculator, etc.? Some ERD have analog behaviors that have yet to be exploited or explored E.g. Memristor, Memcapacitor, Meminductor
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12 Other Comments Memory in Logic 3DIC and 4F 2 memory cells permits memory-heavy architectures to be revisited But energy/bit-accessed has to better than energy/FLOP for computation Real need are algorithms that increase spatial locality
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13 Outline of ERD Chapter Memory Challenges Table with metrics Solution paths to these challenges Table with metrics New Opportunities for ERD Architectural and circuit opportunities Review of current memory enhanced architectures??? Nanocrossbar, CMOL, Synaptic Tables, largely qualitative, somewhat quantitative
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14 Feedback from Group 1.Quantify overhead of peripheral circuits as a function of core size 2.Latency matters too, both memory and interconnect. Typically traded for bandwidth. Quantify.
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