1. 2011,Q1 Embedded Roadmap & CCC Service March 01,2011
YC Cheng

2. Embedded Growth Today and Future
PC/Server-like
2008 TAM $3.6B
Deeply Embedded
2008 TAM $11B
“Calpella” -> “Sandy Bridge based platform “
Mobile : Huron River /QM67
Desktop: Sugar Bay / Q67 /B65
Workstation: Bromolow / C206
“Tunnel Creek”

3. Intel Tick-Tock Dance: Advanced Process + Innovative Micro-architecture
2006
2007
2008
2009
2010
2011
2012
2013
Tick
Tick
Tick
Tick
65nm
45nm
32nm
22nm
Core
Nehalem
Sandy Bridge
???
Tock
Tock
Tock
Tock
Merom
Nehelem
Sandy
Bridge
Penry
Westmere
Ivy
Bridge
965GME
GM35
GM45
QM57
QM67
NISE x x
3140
3500
3600
EBC3 x x x
555
COMe
300 x x
257
267/8

4. Sandy Bridge Benefits

5. Sandy Bridge performance brief

6. Sandy Bridge Enhanced Visual Features

7. SB Platform Technology: Overview

8. Intel ECD Scalable platform Roadmap

9. Intel Low Power Platform Roadmap

10. Intel Atom Platform Raodmap

11. Newest D525/D425 platform

12. Queensbay Platform (Tunnel Creek)

13. Tunnel Creek CPU Features
LPIA Core
L2 Cache
LVDS (Display)
2D/3D
Graphics
DDR2
Controller
SDVO (Display)
LPC
Watchdog timer
8254 Timer
SPI
8259 APIC
Intel® HD Audio
PCIe x1 (4)
Tunnel Creek
SMBus
RTC & Sus.
GPIO (14)
Video Encode
Video Decode
Description
Tunnel Creek CPU
CPU Core
0.6 to 1.3GHz LPIA Core
Hyper-Threading and Virtualization (VTx)
45nm High K Process
Graphics
Integrated 2D/3D Graphics Engine
Running up to 400MHz
Supports OpenGL* ES2.0, OpenVG* 1.0, DirectX9.0c*
Fill Rate (MPPS):
Display
LVDS & SDVO Dual Independent Display
18/24-bit 1channel LVDS with max resolution of
SDVO max resolution of
Video Engine
Integrated Hi-Definition Video Decoder & Encoder
Encode format: MPEG4, H.264
Decode format: MPEG2, MPEG4, VC1, WMV9, H.264
Memory Controller
Single 32-bit channel, DDR2 667/800, 1GB max, memory down
Audio
Integrated Intel® Hi-Definition Audio
TDP
2.7~3.3W
Description
Tunnel Creek CPU
Timer
8254 Timer containing 3 counters
Watchdog timer (1us to 10min)
RTC IO
SPI to EFI BIOS (up to 20MHz)
SMBus v1.0 (up to 1MHz)
14 GPIO
LPC 1.1 (25MHz/33MHz)
4 PCIe x1 ports host only

14. Intel Atom family power consumption

15. Embedded Product Map ETX/COM Express Mini-ITX/uATX 3.5” 5.25”
ODM Service
Atom D525
EBC300
COM Express
ETX
NEX603
EBC500
Product
Service
Project
Service
POS
EBC301
ICES200
EBC540
NEX608
System
Xcare
ODM PASS
ICES210
Automation
EBC320
ICES122
EBC550
BIOS
Customization
3 days
Proposal
ICES270
NEX880
EBC340
ICES300
Sugar Bay
Embedded
OS support
ICES170
EBC545
Panel
support
NEX890
ICES251
EBC342
Bromolow
Thermal & Air
Flow Analysis
ICES252
CCC Service
EBC572
NEX881
EBC352
ICES253
Atom D525
Sugar Bay w/ Video embedded
PICMG
EBC555
ICES267
TYPE2 ,by16
EBC310
PICMG 1.3
Huron River
ICES267S
TYPE2 ,by SDVO
Huron River
Tunnel Creek
PEAK 876/7
PICMG 1.0
Wide
Temperature
EBC310X
Huron River
ICES268
TYPE6 ,2X HDMI
Desktop
Sandy Bridge
(Sugar Bay / Q67)
PEAK 872
Q45
PEAK 878
N450
ICES251X
Wide Temperature
Workstation
Sandy Bridge
(Bomolow / C206)
PEAK 777
G41
PEAK 8930

16. Embedded board value Focus
Embedded PC
Development
Vertical
Digital Signage
Digital Wall
Panel PC/HMI
Automation
Value Added
Services
Panel Support
System Utility Xcare
-40~85 degree C
Wide Temp.
/ QC mechanism
Higher level QA
High Display
Low Power
Atom/Pineview
Dual Display
Support
panel support
24 bit/48 bit
Multi Panel
CCC Service
Design Assistance
Document Support
COM Product &
Thermal & Air
Analysis
Embedded OS

17. ATOM Embedded Solutions
Atom Dual Core
Single DC12V input
VGA + LVDS 18/24-bit
2x GbE
3x RS232
1x RS232/422/485
CF/PCI104
Display Outputs
1. VGA + DVI-D
2. 18 bits LVDS + DVI-D
SDVO1
DVI module
EBC352
D525
Display Outputs
1.VGA + 2x24 bits LVDS
2.18 bits LVDS + 2x24
bits LDVS
EBC540
N270
SDVO1
2x24 bit LVDS module
Atom E600 Extreme Ultra Low Power
Wide Temperature
VGA + LVDS 18/24-bit
2x Ethernet/Mini-PCIe/3x RS232
Dual Display
VGA + 18 bits LVDS
AT/ATX Power Input
Mini-PCIe + PCI slot+ PCI-104
5xRS232
1xRS232/422/485
EBC310X[E600 series]
Dual Display
Single DC12V input
VGA + LVDS 18/24-bit
Mini-PCIe
CF/3x RS232
3.5”
5.25”
Intel
ATOM Embedded
Solutions
EBC342[N270]
ETX
COM
Express
ICES 170
Atom N270
ICES 270
Atom N270
ICES 251/251X
ATOM N450
ICES 252
ATOM D510
ICES 253
ATOM D525
ETX Module
COMexp Basic Type II
COMexp Micro Type II

18. 3.5” embedded Roadmap Shipping Developing Planning LX800 Atom EBC 352MP MP
EBC 340
3.5”, Atom D525,
VGA+LVDS 18/24-bit,
2xGbE, Mini-PCIe,
4xCOM, PCI104, CF, DC12V
Embedded
Low Power MP MP
EBC 342
NPP : 2/B
NPP : 4/B
3.5”, Atom E640 1GHz,
DDR2-1GB onboard,
Mini-PCIe, 2xGbE,
VGA/LVDS, 3xCOM, DC12V
EBC 310
3.5”, Atom E640 1GHz,
DDR2-1GB onboard,
Mini-PCIe, 2xGbE,
VGA/LVDS, 3xCOM, DC12V
EBC 310X
-40~85C
Embedded
Deep
C3 : 3/E
C3 : 5/M

19. 5.25” embedded Roadmap Shipping Developing Planning VIA C7 Atom 945GME
Huron River
EBC 500 MP
EBC 550 MP
EBC 555
NPP : Mid of April, 2011
C3 : Mid of Jun, 2011
QM67, 2xGbE, iAMT,
PCIe X16/X4 slot,
VGA/DVI/HDMI/eDP/LVDS
Mini-PCIe, 4xCOM, DC12V
Performance
High
EBC 545
EBC 540 MP
EBC 540 MP MP
EBC 580E MP
Shipping
Developing
Planning

20. Mini-ITX/uATX Roadmap
Shipping
Developing
Planning
NEX608
Automation
Mini-ITX, Atom D525,
DDR3 SO-DIMM, Mini-PCIe, 1x PCI, 3xGbE, VGA/LVDS, 4x COM, DC24V, 2KV surge protection MP
C206
Q67
NEX881
NEX880
NEX890
C3 : 3/E
C3 : 3/E
MicroATX, Sugar Bay, Q67 or C206,
4x DDR3 DIMM, Mini-PCIe,
32x channels for video,
1x PCIe X16, 2xGbE, VGA/DVI-D/HDMI, 2x COM, ATX power input
MicroATX, Sugar Bay, Q67,
4x DDR3 DIMM, Mini-PCIe,
32x channels for video,
1x PCIe X16, 2xGbE, VGA/DVI-D/HDMI, 2x COM, ATX power input
Video Surveillance MP
C3 : 3/E
C3: 3/E
NEX603
Mini-ITX, Atom D525,
DDR3 SO-DIMM, Mini-PCIe, 1xGbE, VGA/LVDS, 6xCOM,
Cash Drawer, Touch Controller, DC12V
POS / Kiosk MP

21. EBC310/310X
Single DC12V input
COM2, 3
Mini PCIe
LVDS
SATA
LAN1
LAN2
USB
COM1
VGA
Main Features
Onboard Atom E640 1GHz ultra low power consumption SoC(3.6W)
On-board DDR2 800-MHz 1GB, Non-ECC and Un-buffered
Intel EG20T PCH (1.55W)
Dual display: VGA + LVDS 18-bit
2 x GbE, Intel 82574L/Realtek 8211CL
1x CAN, 1x MiniPCIe, 2x SATA, 4x USB, 8x GPIO
DC12V input, AT/ATX mode
Serial port: 3 port, COM1/3: RS232, COM2:RS232/422/485 BIOS selectable
EBC 310X supports wide operating temperature -40~85C

22. EBC352
COM2/3/4
Single DC12V input
SATA
PCI 104
Atom D525
ICH8M
LVDS 18/24-bit
LAN1
LAN2
USB
COM1
VGA
Main Features
Onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset
One 200-pin SODIMM socket up to 2 GB DDR3 667/800 MHz SDRAM
Dual display: VGA + LVDS (18/24-bit, single/dual channel)
1 x Mini-PCIe / PCI 104
1 x CF, 2 x SATA
2 x Intel 82574L GbE, 6 x USB, 8x GPIO, 5.1-CH Audio
DC12V input, AT/ATX mode
Serial port: 4 port, One DB9 Connector and Three 2 x 5 2.0mm box header w/ RS232 and 1x RS232/422/485 BIOS selectable

23. D525 performance

24. EBC340 Panel List G084SN05 V8 Main Features
VGA
USB
Mic-out
LAN
Mic-in
SATA
PCI 104
ICH7-M
COM1
945GSE
LVDS
CCFL
N270
Power
FAN
LTP
COM 2/3/4
G084SN05 V8
AUO 8.4” 800x600
Main Features
Onboard Atom N GHz CPU + 945GSE/ICH7-M Chipset
One 200-pin SODIMM socket up to 2 GB DDR2 400/533 MHz SDRAM
VGA & LVDS (1 x DF13 20-pin single channel 18bit LVDS)
1 x PCI 104
1 x CF, 1 x SATA
1 x GbE, 4 x COM, 6 x USB, 16-bit GPIO, 5.1-CH Audio
AT mode (+5V and +12 Vdc input)
Serial port: 4 port, 1xDB9 Connector and Three 2x5 2.0mm Box header serial port 2 support RS232/RS422/RS485
1 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

25. EBC342 Panel List LTM190M2-L31 GL185WX1-1200 CHIMEI_V216B1-L01
VGA
USB
LAN LED
LAN1
LAN2
SATA Power
SATA
GPIO
ICH7-M
Mini-PCIe
COM1
COM2/3
945GSE
LVDS
CCFL
N270
Power
FAN
K/B
Mouse
Panel List
LTM190M2-L31
Samsung 19” 1440x900 48bit
GL185WX1-1200
AUO 18.5” 1366x768 24bit
CHIMEI_V216B1-L01
CMO 21.6” 1366x768 24bit
LM170E03
LG 17” 1280x bit
Main Features
Onboard Atom N GHz CPU + 945GSE/ICH7-M Chipset
One 200-pin SODIMM socket up to 2 GB DDR2 400/533 MHz SDRAM
Dual display: VGA & LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-bit))
1 x Mini-PCIe
1 x CF, 1 x SATA
1 x GbE, 3 x COM, 6 x USB, 16-bit GPIO, 5.1-CH Audio
Support AT/ATX mode and Single +12 Vdc input
Serial port: 3 port, One DB9 Connector and Two 2 x 5 2.0mm box header w/ RS232
1 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

26. EBC540 Panel List Main Features
power
PCI
2x SATA
Panel List
PCI 104
Mic-in
Line-out
DIMM
VGA
ICH7-M
945GSE
2x GbE LAN
SDVO1/2
2x USB 2.0
Mini-PCIe
KB/MS
LPT
2xCOM
CCFL
LVDS
COM CF
Main Features
Onboard Atom N GHz CPU + 945GSE/ICH7-M Chipset
One 240-pin DIMM socket up to 2 GB DDR2 400/533 MHz SDRAM
Dual display: VGA, LVDS (1 x DF13 20-pin 18-bit), SDVO for EBKSDVO1(DVI) & EBKSDVO2(LVDS)
1 x Mini-PCIe, 1 x PCI, 1 x PCI 104
1 x CF, 2 x SATA
2 x GbE, 6 x COM, 6 x USB, 8 GPIO, 5.1-CH Audio
Support AT & ATX mode
Serial port: 5x COM support RS232 and 1XCOM support RS232 /RS422/RS485
2 x Realtek RTL8111C-GR PCI Express Gigabit Ethernet

27. VGA+LVDS, VGA+DVI, LVDS+VGA, LVDS1+LVDS2,
EBC545
Panel List
LP154WP3
LG 15.4” 1440x900 36bit
M216H1-L01
CHI MEI 21.6” 1920x bit
Dual output option:
VGA+LVDS, VGA+DVI, LVDS+VGA, LVDS1+LVDS2,
Main Features
GM45 + ICH9-M supports Intel Core™ 2 Quad, Core™ 2 Duo, Celeron CPU
Two 240-pin DDR3 DIMM up to 8 GB 1066MHz DRAM
Dual display GM45 integrated GMA4500MHD: VGA +VGA, LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-bit)), SDVO for EBKSDVO1(DVI) & EBKSDVO2(LVDS)
1 x PCI, 1xPCI 104+
4 x SATA
2 x GbE, 4 x COM, 6 x USB, 8 GPIO
Serial port: 3 x COM support RS232 and 1 x COM support RS232/RS422/RS485(BIOS setting)
2 x Intel® 82574L PCI Express GbE

28. EBC550 Panel List LP154WP3 M216H1-L01 Main Features
AUX
Mic-in
4x COM
PCIe 16
4xSATA
Line-out
VGA
2x GbE LAN
ATX
CCFL
LTP
CPU socket
GM45
2x DDR3
LVDS
PCI
ICH9-M
2x USB 2.0
KB/MS
LP154WP3
LG 15.4” 1440x900 36bit
M216H1-L01
CHI MEI 21.6” 1920x bit
Main Features
GM45 + ICH9-M supports Intel Core™ 2 Quad, Core™ 2 Duo, Celeron CPU
Two 240-pin DDR3 DIMM up to 8 GB 1066MHz DRAM
Dual display GM45 integrated GMA4500MHD: VGA & LVDS (2 x DF13 20-pin up to 24-bit & Dual pixel (48-bit))
1 x PCI, 1xPCIe*16, 1xPCIe*4
4 x SATA
2 x GbE, 4 x COM, 6 x USB, 8 GPIO,
Serial port: 4x COM support RS232 only
2x Intel® 82574L PCI Express GbE

29. NEX603 Industry main board for POS/KIOSK Main Features
Mini-ITX, Onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset
Two DDR3 SODIMM socket up to 4GB
Dual display: VGA + LVDS (optional 18/24-bit, single/dual channel)
1 x Mini-PCIe
1 x RJ11 for cash drawer
1 x GbE, 2x SATA, LPT, Audio
DC12V input
Serial port: 6 ports, COM1~4 w/ +5V or +12V DC output selectable, COM5 & 6 w/ +12V DC output

30. NEX608 Industry main board for Automation Main Features
Mini-ITX, onboard Atom D525 Dual core 1.8GHz / D425 Single core 1.8GHz + ICH8M Chipset
One DDR3 SODIMM socket up to 2GB
Dual display: VGA + LVDS (18/24-bit, single/dual channel)
1 x Mini-PCIe, 1 x PCIe
3 x GbE
2x SATA, LPT, Audio, 4-in/4-out GPIO
DC24V input
Serial port: 4 ports, COM1, 3, 4 RS232 COM2 RS232/422/485 selectable

31. NEX881 Industry main board for Video Surveillance Main Features
MicroATX, Support Intel® 2nd generation Core™ i7/i5/i3 Desktop processors(Sugar Bay)
Q67 Platform Control Hub
Support Non-ECC Dual Channel DIMM-DDR3 1066/1333 MHz up to 8GB
Onboard 32 channels video input maximum
1 x Intel® 82579LM Gigabit Ethernet support for AMT 7.0
1 x Intel® 82583V PCI Express Gigabit Ethernet
VGA/DVI-D/HDMI
1x PCIe X16 slot
6x SATA, USB, Audio, 2x COM

32. ETX/COM Express Contents
COM Products Roadmap
- ETX
- COM Express
COM Competence Center (CCC) Services

33. COM Express Product Roadmap
ICES 267
Huron River
ES Q1’11
ICES 267S
Huron River
ES Q1’11
ICES 268
Huron River
ES Q1’11
ICES 300
C2D/GM965
ICES 200
C2D/945GME
Entry Power-Effective Performance
ICES 210
Atom Z510/
Z530
ICES 270
Atom N270
ICES 251
Atom N450
ICES 252
Atom D510
ICES 253
Atom D525
NPP : Beginning of Jan., 2011
Shipping
Developing
Planning
C3 : End of Jan., 2011
ICES 251X
Atom N450
-40~85C
Existing Q1’ Q2’11

34. ETX Product Roadmap Entry Power-Effective Performance Shipping
ICES 170
Atom N270
ICES 122
LX800
Shipping
Developing
Planning
Existing

35. ICES 267 Type 2 COM Express Module Main Features
QM67
DDR3
SO-DIMM
Socket FCPGA 998
Main Features
Support Intel 2nd generation Core Mobile processors for powerful computing
Integrated Intel HD graphics for 3D performance & Clear Video
PCH QM67
1x DDR3 SO-DIMM (1066/1333 MHz)
LVDS 18/24-bit, single/dual channel
Intel AMT 7.0
6 Express lanes
VGA, PCI, IDE, LAN

36. COM Express functional blocks
Capabilities
PCI Express
Up to 32 lanes, shared with 16 PCI Express Graphics lanes and 2 ExpressCard lanes
SATA/SAS
Up to 4 Serial ATA or Serial Attached SCSI links
LAN
Up to 3 10/100/1000Base-T links (PHY included)
USB
Up to 8 USB 2.0 ports
Memory
On-board or expansion sockets, single or dual channel
Graphics
Up to 2 LVDS channels for LCD panels Up to 2 SDVO channels for DVI/TMDS flat-panel displays x16 PCI Express Graphics link for external GPUs (multiplexed with SDVO) TV-Out scan conversion
CPU & chipset
CISC, RISC, VLIW, etc.
System Management
I2C, watchdog timer, SMBus
Power Management
Save-To-RAM, Save-To-Disk, Suspend, Sleep, Wake

37. Compact, High Performance
COM form factors
COM-Express
Multi-Core
155 mm
125 mm
95mm 95mm
Compact, High Performance
110mm
95mm
Extension
Basic
*Type2 / 6
Micro
Pentium M
ETX
114 mm
AMD LX
95mm
High Integration and Scalable

38. CCC Services – Key Benefits
Save Cost
Assembly & Upgrade Cost  
It helps to reduce the cost of making daughter boards or I/O cables
customer is also able to save cost when they update their applications to support higher-level calculations; they just simply need to change the COM module.
Secure Knowledge
Strong engineering know-how is the key to success for most applications. Customers can keep key design specifications on the carrier board, limiting exposure to design partners outside the company.
Timing    
A COM-based project can help shorten the project development schedule because about 80% of the design is already contained in the COM module. Customers can focus their attention on the 20%
Flexibility    
The modularized design of a COM-based project allows customers to configure COM modules with several carrier boards for different applications without having to create a new board.

39. COMexp Carrier Board Compatible
Congatec
Conga-BA945
MSC Vertriebs
CXb-A945M
NEXCOM ICES270
ADLink
Express-AT
Advantech
SOM-5761

40. Nexcom CCC Services Nexcom COM Competence Center (CCC) Services
Nexcom’s
COM +
Existing
Base Board
Nexcom’s
COM +
Customer’s Design
Base Board
Nexcom’s
COM +
Customer’s
Base Board
Nexcom’s
COM +
Nexcom’s Customized
Base Board
COM Product &
Document Support
Customized
Services
Design Assistance
Services
Embedded OS
Services
ETX & COM Exp.
Evaluation Board
Document
- Design Guide
- EB’s Schematic
- ME Drawing
- Certification
Customer Base
Board Design
Thermal Design
Manufacturing
Thermal Solution
On-site Technical
Support
Schematic Review
Placement/ Layout
Review
Debugging
Design Training
Design Database
Customized BIOS
Modularized BIOS
eOS Installation
Custom OS Image
Device Driver
BSP Support

41. Modularized Thermal Solution Customized Thermal Solution
CCC Services – Thermal Solution
Modularized Thermal Solution
Customized Thermal Solution
Reducing design effort
High flexibility
Easy to upgrade
Mechanical drawing
Mock-up sample
Production

42. Comprehensive Document & Design Review Support
Thermal Solution Services
Heat Sink
Com Product Services
Heat Spreader
Embedded Software Services
COM Modules
Design Assistance Service Carrier Board Development
Customer Carrier Board

43. CCC Services – Embedded Software
BIOS Customization
Embedded OS Services
Nexcom User Interface ( NUI )
BIOS Customization
Modularized BIOS Core Architecture
Enhanced Embedded Core Feature
BIOS Customization Services
NUI
Embedded OS Services
Custom OS Image
Complete Device Driver
Support
NUI
Nexcom User Interface

44. CCC Services – Design Assistance
Schematic Review
Placement/Layout Review
Debugging Assistance Service
General/Special Reference Design Database
Schematics Review
Placement/Layout Review
Expansion Interface
I/O Port
Storage
Other
Layout Guide line
Trace Review
Mechanical Conflict
Debugging Assistance Services
General/Special Reference Design Database
Phenomenon Duplication
Analysis and Verification
Solution and Suggestion

45. Thank You