© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Wayne Wigley- Advanced Technical Sales.

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview X6: The sixth generation of EXA technology Innovative eXFlash = 2X higher performance 12TB of memory, 15 CPU cores = leadership database performance Seamless Scalability Easy to configure and service Support for multiple generations of technology Enterprise class availability CPU, Memory, I/O resilience Hypervisor management Integration Flex System X6 System x3850 X6 System x3950 X6 FAST AGILE RESILIENT

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview 4 Socket Comparison 3 Traditional Rack Design 7 PCIe Slots High Availability Predictive Failure 40 Cores 2TB Standard Memory on x3850 1TB on HX5 8 x 2.5” Disk Drives on x3850 SSD only on HX5 +50% +300% +57% 10X More internal flash storage Leadership Performance Flexible Software-defined Modular Design 11 PCIe Slots I/O Choice HL or FL 8 Mezz adapters for Flex 11 PCIe Slots I/O Choice HL or FL 8 Mezz adapters for Flex Extreme Availability Fault Tolerance Extreme Availability Fault Tolerance 60 Cores 6TB Standard Memory 30 TB of Flash Storage Flash Accelerator & Caching 30 TB of Flash Storage Flash Accelerator & Caching Highest Storage Performance and Density Ultra-Low Latency Performance Highest Fault Tolerance & Fastest Serviceability Maximum I/O Throughput Application Optimized Fit-for-purpose

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview IBM System x3850 X6 Overview 5 The x3850 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. It’s also features IBM’s new modular rack design that can host multiple generations of technology in a single platform.  Intel® Xeon® based 4-socket 4U server that is scalable to 8-sockets 8U in the field  Supports up to 6TB of memory and 60 cores of processing power  Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications  Most flexibility by supporting a modular book design which allows clients to create “fit for purpose” solutions and host multiple generations of technology in the same package  In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that deliver mainframe class reliability Key Features Workloads  ERP  Analytics  Database  Virtualization Announce: 2/18, GA: 3/5 AGILE FAST RESILIENT

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview IBM System x3950 X6 Overview 6 The x3950 X6 delivers the most performance and capacity in the x86 segment without compromising on reliability, availability, and serviceability. This 8-way server is designed with seamless management and scalable performance for the largest, business critical workloads.  Intel® Xeon® based 8-socket 8U server with seamless management  Supports up to 12TB of memory and 120 cores of processing power  Single point of control and single serial asset tracking for ease of management  Up to 12TB of IBM’s newest DIMM based flash technology for ultra-low latency applications  Most flexibility by supporting a modular book design which allows clients to create “fit for purpose” solutions and host multiple generations of technology in the same package  In addition to Intel® RunSure® Technology, features X6 Advance RAS capabilities that deliver mainframe class reliability Key Features Workloads  ERP  Analytics  Database and OLTP  Virtualization Announce: 2/18, GA: 6/5 AGILE FAST RESILIENT

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Modular Book Design 8 Storage Book 4 Compute Books Each compute book includes 1 processor and 24 DIMMs Deliver up to 6TB of memory or 12.8TB of eXFlash memory – channel storage Each x3850 X6 contains 4 Compute books Ability to swap out Compute books as memory or processor generations change The Storage book delivers up to 6.4TB of eXFlash 1.8” SSD or 12.8TB of SAS 2.5” Ability to host 2 storage controllers for maximum bandwidth AGILE

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Modular Book Design 9 Create the fit-for-purpose solution, whether clients need to support typical HBAs or specialty GPGPU cards Primary I/O Book Up to 2 types of IO Books, Half-Length and Full-Length Each IO Book delivers an additional 3 PCIe slots Mezz-LOM solution gives clients the ability to select the networking technology that fits their requirements Hosts the IMM, PCIe slots, and the dedicated Mezz-LOM solution AGILE Up to 4 Power Supplies 900W, 1400W AC or 750W DC

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview 10  19nm MLC  10 Drive Writes Per Day  5 Year Warranty Patented Guardian TM Technology  <5µs Write Latency  >120K Read IOPS  >35K Write IOPS Ultra Low Latency, High Performance  Back Up Power Circuitry  End-To-End Data Protection  2M hours MTBF Enterprise Class Reliability  DDR3 protocol  Configurable As Block Device  Configurable As Memory Extension Memory Channel Interface  200, 400 GB Capacities  Scalable Architecture  19nm MLC NAND Scalable, Cost Effective Media  S.M.A.R.T. Monitoring  Supports TRIM  Maintenance Tools Additional Features eXFlash Memory Channel Storage IBM eXFlash Memory Channel Storage

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Intel ® Xeon ® Processor E3 Family Highest density, lowest cost Intel ® Xeon ® Processor E3 Family Highest density, lowest cost Intel ® Xeon ® Processor E5 Family Most flexible & efficient Intel ® Xeon ® Processor E5 Family Most flexible & efficient Intel ® Xeon ® Processor E7 Family Highest reliability & scalability Intel ® Xeon ® Processor E7 Family Highest reliability & scalability Intel ® Xeon ® Processor Families Positioning E5-4600 v2 E7-8800/4800/2800 v2 E5-2400 v2 E3-1200 v3 8-Socket+/4-Socket/2-Socket Top of the Line Performance Entry 2-Socket Dense 4-Socket Dependable & Economical 1-Socket E5-2600 v2 Mainstream Leadership

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Intel ® Xeon ® Processor E7-8800/4800/2800 v2 Overview Integrated PCI Express* 3.0 Up to 32 lanes per socket Up to 3 DIMMs per channel (up to 24 DDR3 1600Mhz DIMMs per socket) Up to 37.5MB Shared Cache I ntel ® Xeon ® Processor E7-4800 v2 Product Family Up to 4 Intel ® C102/C104 Scalable Memory Buffers per socket 13 All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. 64-bit Intel Xeon Multi-core Enterprise Processor Up to 15 cores and 30 threads (with Hyper- Threading) per socket Up to 37.5 MB of shared last-level cache (LLC) QuickPath Interconnect (QPI) 1.1 with speeds up to 8.0 GT/s Integrated I/O (IIO) 32 lanes of PCI Express 3.0. 4 lanes of PCI Express 2.0 (or DMI) 2 Internal Memory Controllers 4 Intel SMI2 channels

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Memory Architecture Overview 14 Up to 24 DIMMs per socket Up to 4 Intel ® C102/C104 Scalable Memory Buffers per socket Up to 37.5MB Shared Cache I ntel ® Xeon ® Processor E7-4800 v2 Product Family Up to 8 DDR3 Channels 1 to 6 DIMMs per Buffer 8 DDR3 channels per socket Up to 24 DDR3 DIMMs per socket Supports up to 64GB DDR3 LR-DIMM Up to 6TB in a 4S platform, 12TB in a 8S platform 1 Large Memory Capacity Up to 1600MHz DDR3 speeds Intel ® SMI Gen 2: Up to 2.66 GT/s Memory Controller can support 2 modes Performance Mode (higher I/O, B/W) Lockstep Mode (highest DDR3 speeds) POR Speeds, Memory Controller Modes Active (Rack): Up to 9W @2.66 GT/s Idle: Up to 2.5W Power (Target) 1 Memory capacity possible by populating all (96 for 4S; 192 for 8S) DIMMs with 64GB DDR3 LR-DIMMs All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Intel ® E7-8800/4800/2800 v2 product Basic 12-15 Cores QPI: 8.0 GT/s Up to 37.5M cache Intel ® HT Technology Intel ® Turbo Boost Technology SMI Gen2: Up to 2666 MT/s 2:1 DDR3:1333 MHz (max) 1:1 DDR3:1600 MHz (max) 8-12 Cores QPI: 7.2 GT/s Up to 24M cache Intel ® HT Technology Intel ® Turbo Boost Technology SMI Gen2: Up to 2132 MT/s 2:1 DDR3: 1066 MHz (max) 1:1 DDR3: 1333 MHz (max) 8S/Scalable* 4S/Scalable* 2S/Scalable* Frequency Optimized : HPC Standard Advanced *Scaling capability refers to maximum supported number of CPUs in a “glueless” platform (e.g.8S means that this SKU can be used to populate up to 8 sockets in a single system).. Above skus may be used in even larger than 8S systems through the use of 3 RD party node -controllers (not available from Intel). ++ Please refer to the memory population matrix table for detailed information on POR Slots-per-Channel (SPC) & DIMMS-per-Channel (DPC) combinations Frequency Optimized : Enterprise 6 Cores QPI: Up to 6.4 GT/s Up to 12M cache Intel ® HT Technology SMI Gen2: Up to 2132 MT/s 2:1 DDR3: 1066 MHz (max) 1:1 DDR3: 1066 MHz (max) 8S/Scalable* QPI: 8.0 GT/s Up to 30M cache Intel Turbo Boost SMI Gen2: Up to 2666 MT/s 2:1 DDR3: 1333 MHz (max) 1:1 DDR3:1600 MHz (max) Segment Optimized 8S/Scalable* QPI: 8.0 GT/s Up to 37.5M cache Intel HT Technology Intel Turbo Boost SMI Gen2: Up to 2666 MT/s 2:1 DDR3: 1333 MHz (max) 1:1 DDR3:1600 MHz (max) 15C 130W 2.5GHz 37.5M 15C 130W 2.5 GHz 37.5M 15C 130W 2.5 GHz 37.5M 15C 130W 2.5GHz 37.5M 15C 130W 2.5GHz 37.5M 12C 105W 2.3GHz 24M 12C 105W 2.3GHz 24M 12C 105W 2.3GHz 24M 12C 105W 2.3GHz 24M 12C 105W 2.3GHz 24M 12C 105W 2.3GHz 24M 15C 130W 2.3GHz 30M 15C 130W 2.3 GHz 30M 15C 130W 2.3 GHz 30M 15C 130W 2.3GHz 30M 10C 105W 2.2GHz 20M 10C 105W 2.2GHz 20M 15C 155W 2.8GHz 37.5M 15C 155W 2.8 GHz 37.5M 15C 155W 2.8 GHz 37.5M 15C 155W 2.8 GHz 37.5M 15C 155W 2.8 GHz 37.5M 12C 130W 2.6 GHz 30M 8C 105W 2.0GHz 16M 8C 105W 2.0GHz 16M 6C 105W 1.9GHz 12M 6C 105W 1.9GHz 12M E7-4890 v2 E7-4870 v2 E7-4880 v2 E7-4860 v2 E7-4850 v2 E7-4830 v2 E7-4820 v2 E7-4809 v2 E7-8890 v2 E7-8870 v2 E7-8880 v2 E7-8850 v2 E7-2890 v2 E7-2870 v2 E7-2880 v2 E7-2850 v2 10C 155W 3.2GHz 37.5M 10C 155W 3.2GHz 37.5M 6C 155W 3.4GHz 37.5M 6C 155W 3.4GHz 37.5M E7-8891 v2 E7-8893 v2 105W 15C 105W 2.2 GHz 37.5M 105W 15C 105W 2.2 GHz 37.5M High Performance, Low Power E7-8880 L v2 130W 12C 130W 3.0GHz 30M 130W 12C 130W 3.0GHz 30M E7-8857 v2

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Memory Modes 21 Memory Operation Modes Supported Independent Mode - Performance mode. Each DDR3 channel is addressed individually via burst lengths of 8 bytes. The Intel SMI2 channel will operate at twice the DDR3 data rates. Lockstep Mode - The high RAS mode supporting DDDC with x4 DRAMs. The memory controller handles all cache lines across two DDR3 channels behind one JC. The Intel SMI2 channel operates at the DDR3 transfer rate. Mirrored Mode - The memory contents of the system are mirrored between CPU sockets. Because of mirroring of the memory, the total memory available to the system is half of the memory that is physically installed. Rank Sparing Mode - One memory DIMM rank is a spare of the other ranks on the same channel. The spare rank is held in reserve and is not utilized by the system as part of its system memory. Two modes of operation: 2:1 Independent Channel Mode SMI2 Max Freq. – 1.33 GHz (2 transfers per clock = 2667 MHz) SMI2 Transfer Rate – 2.67 GT/s SMI2 Channel Bandwidth – 21.3 GB/s 1:1 Sub-Channel Lockstep Mode SMI2 Max Freq. – 0.93 GHz (2 transfers per clock = 1600 MHz) SMI2 Transfer Rate – 1.6 GT/s SMI2 Channel Bandwidth – 12.8 GB/s

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview X6 platforms deliver the best memory scalability in the industry 22 Standard x86 servers will see memory speed lower as more DIMMs are populated  Each processor has 8 channels  Each channel supports up to 3 DIMMs  Results in 24 DIMMs per processor  As you add more DIMMs to each channel, the Intel ® architecture will lower the memory bus speed from 1333Mhz to 1066Mhz (20% reduction) for workloads over 1TB (assuming 16GB DIMMs) CPU 1333 Mhz Memory CPU 1066 Mhz Memory ! x3850 X6 and x3950 X6 are designed to maintain memory performance for larger workloads  For memory workloads from 500GB and above, the X6 platforms will be able to maintain the 1333 Mhz memory bus speed  Delivering higher performance for larger workloads with scalable memory performance FAST

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview IBM eXFlash Memory Channel Storage Benefits  Fastest flash response time in the market –Significantly lower write latency than any other Flash offering; as low as 3.3 microseconds Up to 83% lower latency than PCIe** and 95% lower latency than SSD*** Fastest response time available for analytics, critical VMs and high frequency trading  Consistent performance under mixed workloads –more than 125K IOPS per eXFlash DIMM †, scaling linearly without negatively impacting latency –On memory bus – avoids potential I/O contention Databases from 200GB to 12.8TB have deterministic response times and consistent performance  Scalable form factor/performance/capacity –Leverages ubiquitous DIMM slots - ideal for all server types including Flex System –Interoperable with standard DDR3 RDIMMs –Supports anywhere from 200GB to 12.8TB of flash 24

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview IBM eXFlash MCS Configuration Rules  Maximum of one eXFlash DIMM per DDR3 memory channel is supported  At least one RDIMM must be installed in the same memory channel as eXFlash DIMM  eXFlash DIMMs only support RDIMMs; other memory types not supported  eXFlash DIMMs with different capacities (i.e. 200 GB and 400 GB) can not be intermixed in the same server  eXFlash DIMMs are supported only in memory performance mode; other memory modes of operations (such as lockstep, memory mirroring, and memory sparing) not supported.  Maximum capacity is 32 x 400GB = 12.8TB  IBM will add enhanced market offering features over time  See Session xSM04e for additional information. Tuesday and Thursday IBM eXFlash MCS

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview 8 HDD or 16 eXFlash SSD LCD Display 1 USB 2.0 2 USB 3.0 Front Video Power Button Storage I/O Card Raid Adapter 2 Slots Storage I/O Book Overview 27 Gen 3 Drive Enclosures

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview RAID Adapters  ServeRAID M5210 Internal RAID Adapter –May only plug into “Storage Adapter Slots. –PCI Low Profile, MD2 Length Card outline –PCIe Gen 3 x8 lanes –RAID 0/1/10 support – no Cache on base card –LSI SAS3108  ServeRAID M5120 – 6 Gb SAS RAID Adapter (External) –PCI Low Profile, Half-length - MD2 form factor –Eight external 6 Gbps SAS/SATA ports –Two external Mini-SAS connectors (SFF-8088) –6 Gbps throughput per port –LSI SAS2208  IBM N2215 High Performance HBA Non-RAID –May only plug into “Storage Adapter Slots” –PCI Low Profile, MD2 Length Card outline –8-port Controller (SAS 12G / SATA 6G) –PCIe Gen 3 x8 lanes –Non-RAID HBA, SSD/JBOD focused 29

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview I/O and PCIe changes on E7v2  PCIe controller has moved from IOH onto CPU  PCIe Gen 3 is passed through both the mid-planes from the compute books to the I/O books  8 lanes of PCIe Gen 3 from both CPU 0 and CPU 1 are routed to the storage book to provide connectivity for up to two storage adapters.  DMI from CPU 0 and CPU 1 are routed to the base I/O book for high availability legacy connectivity to the Patsburg PCH  DMI from CPU 2 and 3 are repurposed for PCIe Gen 2 and provide additional lanes for PCIe slots on full length full height I/O books when installed PCIe Gen3 doubles PCIe bandwidth to 8.0GT/s (1024MB/s / lane / direction) X4 Gen3 slot ~= 4GBps uni- 8GBps bi-directional bandwidth X8 Gen3 slot ~= 8GBps uni- 16GBps bi-directional bandwidth X16 Gen 3 slot ~= 16GBps uni – 32GBps bi-directional bandwidth PCIe Gen3 allows for more power per slot, within system operational constraints Slots now have NUMA considerations with IO adapter placement 31

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Base I/O Book Details 32 IMM v2 Patsburg Platform Controller Hub (PCH) MLOM Slot Gen3 x8 (Dual 10Gb, Quad 1Gb) Three PCIe Gen 3 slots 2-x16 and 1-x8 Four USB 2.0IMM 1GbE BaseT Port The Primary IO Book contains the minimum set of I/O components to form a complete server. High level breakdown of these components: Note: CPU2 and CPU3 correspond to 3 rd and 4 th CPUs (CPU0 is the 1 st CPU) 1 USB 2.0 Internal for Hypervisor

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview MLOM Adapters 33 Emulex VF A5 ML2 Dual Port 10GbE SFP+ Adapter Intel X540 ML2 Dual Port 10 Gb-T Adapter Intel I350-T4 ML4 Quad Port GbE Adapter Broadcom NetXtreme II ML2 Dual Port 10GbE SFP+ Adapter Broadcom NetXtreme II ML2 Dual Port 10Gb-T Adapter

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Half-Length I/O Book Details 34 One x16 Slot Two x8 Slots x3850 X6 modular I/O book design allows clients to select the type of I/O infrastructure within the server The Half-Length I/O Book provides up to 3 PCIe slots each Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book Each Half-Length I/O Book is Hot-Swappable Note: CPU2 and CPU3 correspond to 3 rd and 4 th CPUs (CPU0 is the 1 st CPU)

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Full-Length I/O Book Details 35 Two x16 Slot One x4 Slots The Full-Length I/O Book provides up to 3 PCIe slots each Up to 2 of these Books can be added to the 4-Socket configuration for a total of 6 additional slots to the 3 standard on the Primary I/O book The Full-Length I/O Book supports one high power PCIe card (GPU/Accelerators) with a max power of 300W Two AUX power connectors provided to support 225W and 300W support: one 2x4 for 150W, one 2x3 support up to 75W AUX power to support 300W cards Support for Double- Wide cards Note: CPU2 and CPU3 correspond to 3 rd and 4 th CPUs (CPU0 is the 1 st CPU) Air Baffle I/O Book Guide

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Full Length PCIe Expansion Card  Two auxiliary power connectors are provided on Pavo in order to support 225W and 300W high power adapters  One 2x4 power connector. This power connector can support up to 150W of power. 2x3 cables may also be plugged into this connector.  One 2x3 power connector. This power connector can support up to 75W of power 36 2x4 Auxiliary Connector 2x3 Auxiliary Connector

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Expansion to 8 socket  8u, 8 CPU, 192 DIMM, 22 PCIe, 16 HDD  FlexNode physical partition to two 4S  Front/rear service only, similar to 4u  Unique Parts: –8U Chassis –8 socket Midplane/Shuttle  Common: –Processor/Memory Book –I/O Books –Power Supplies –Storage Book –HDD backplanes 39

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview 4S to 8S Upgrade 40 Parts Re-used 4S Unique Parts Removed 8S Upgrade Kit HDD/Storage Module Fan, Processor & Memory Module 4S Chassis 4S I/O Shuttle 4S Midplane I/O Modules 8S Midplane 8S I/O Shuttle 8S Chassis Primary I/O Module Storage Module 4S Configuration 8S Configuration

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Leadership Performance with IBM System x3850 X6 SPECVirt TPC-E SAP SD two-tier (4-socket) # 1 # 1 #1#1 THREE #1 RECORD PERFORMANCE BENCHMARKS ACHIEVED AT PRODUCT ANNOUNCEMENT 1 (1/16/2014) ACTION: Drive High End Solutions Focus: We have leadership across multiple workloads client deploy. 7X OLTP Performance Improvement on Microsoft SQL Server 2014 Enterprise Edition TPC-H Paper: “OLTP Performance Unleashed…” # 1 MORE #1 PERFORMANCE BENCHMARKS ACHIEVED SINCE LAUNCH Microsoft SQL Server 2014 Enterprise Edition CONTINUED MOMENTUM 1 Click links for exact data about benchmarks. 4/16/14

© 2014 IBM Corporation High Value x6 3850/3950 Technical Overview Reference  3850x6 Landing Page –http://www-03.ibm.com/systems/x/hardware/enterprise/x3850x6/index.htmlhttp://www-03.ibm.com/systems/x/hardware/enterprise/x3850x6/index.html  3950x6 Landing Page –http://www-03.ibm.com/systems/x/hardware/enterprise/x3950x6/index.htmlhttp://www-03.ibm.com/systems/x/hardware/enterprise/x3950x6/index.html  Solutions and Reference Architectures –http://www-03.ibm.com/systems/x/solutions/index.htmlhttp://www-03.ibm.com/systems/x/solutions/index.html  3850/3950 Configuration and Options Guide –http://www-03.ibm.com/systems/xbc/cog/x3850x6_3837/x3850x6_3837aag.htmlhttp://www-03.ibm.com/systems/xbc/cog/x3850x6_3837/x3850x6_3837aag.html  IBM Server Proven –http://www-03.ibm.com/systems/info/x86servers/serverproven/compat/us/indexsp.htmlhttp://www-03.ibm.com/systems/info/x86servers/serverproven/compat/us/indexsp.html  IBM x86 Solutions for VMware –http://www-03.ibm.com/systems/x/os/vmware/http://www-03.ibm.com/systems/x/os/vmware/ 43

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