1. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 1 Peter Göttlicher, DESY-FEB Heidelberg September 15 th, 2011 A concept for power cycling the electronics of CALICE

2. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 2 Outline  Motivation for power cycling  Building blocks for power cycling  Alternatives  Consequences for power supplies  Summary

3. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 3 Motivation: Power Cycling to avoid active Cooling Very slow, but for long times  Need Power cycling To keep heat up below 0.5 0 C Simplified model: -No heat transfer radial “bad due to sandwich” -Octagon as cylinder: No heat transfer in  -Symmetry at IP-plane Mechanical design constraint: - No cooling within calorimeter to keep homogeneity and simplicity - Cooling only at service end Solution: Parabel + Fourier terms 0.0 0.5 1.0 1.5 2.0 z = Position along beam axis [m] Temperature increase [K] 0.0 0.1 0.2 0.3 Z=0m Z=2.2m Motivation Details see: P.Göttlicher, TWEPP-07, Prague, proceedings Page 296 40µW/channel

4. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 4 Building Blocks for the Power System 1. Planes with scintillators and SiPM’s, ASIC’s and PCB’s 4. Power supply 2. End of layer electronics DAQ is Optical: No issue for EMI 3. cable Building blocks 5. Definition of GND Electronics and GND PE

5. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 5 ASIC for fast SiPM Signals consuming Low Power Bunches from collider (ILC/CLIC): A train every 200ms Algorithm for power cycling: The ASIC switches the current of the functional blocks OFF. ASIC gets supplied all the time with voltage. PCB electronics and instruments stabilize the voltage L. Raux et al., SPIROC Measurement: Silicon Photomultiplier Integrated Readout Chips for ILC, Proc. 2008 IEEE Nuclear Science Symposium (NSS08) Functional tasks of the ASIC: 0.5% needed ADC Digital data transfer RAM ASIC: SPIROC-2b SiPM Amp. Fast amplifiers: 1ms ADC’s 3.2ms Common analogue parts, e.g. DAC’s, C-pipeline Digital control: 150ms >20µs ON before train 1µs Building blocks Time Function switched ON

6. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 6 ASIC as current switch Measurements: - Inductive current probes Slow: 0.25 – 50MHz Fast: 30MHz-3GHz - Setup: ASIC+ capacitors on a PCB - Expectation is ~40mA/ASIC, summed over all pins Measurement influence I-distribution to pins GND pin (1 of 2) of ASIC Expected waveform, Amplitude is arb. units. High pass of probe Measured currents at the GND-supply of ASIC Slow probe Fast probe GND pin (1 of 2) of ASIC Voltage pin (1 of 3) for preamplifier Tantal capacitor 0 200 400 600 [ns] time -20 0 20 40 60 [ns] time System has to deal with: EMI: electromagnetic interference -Wide frequencies 5Hz to few 100MHz -Huge currents 2.2A for a layer, 3.4kA for AHCAL-barrel Building blocks Bandpass:

7. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 7 Current loops To do: -Controlling return currents -Keeping loops small -Avoid overlapping with foreign components. Capacitive coupling To do: -Keep common mode voltage stable -Guide induces currents to source -Keep GND-reference closer than foreigns Electro Magnetic Interference in a Power Cycled System Reference ground : -Need good definition -Any induced/applied current produces voltage drops -Separation between reference / power return / safety or controlling currents and keeping currents within “own” volume and instrumentation Guideline: Avoiding emission avoids in most cases picking up of noise reference return Safety. PE Building blocks

8. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 8 Keeping the high Frequencies local: PCB itself 36 x 36 cm PCB with scintillators, SiPM’s LED 144mA switched current Part of a thin cassette between absorber layer of HCAL Layer structure of PCB: By that one get -a thin PCB and also -A good high frequency capacitor 60pF/cm 2 -Layout with short distance to via maintain the performance. Simulation model: “two diomensional delay line” 1cm x 1cm Building blocks GND d PCB = 50-60µm Vsupply GND

9. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 9 Tantal Voltage for ASIC stabilized by local discrete Capacitors Total: 12 Tantal/4 ASIC’s + 17 ceramics + PCB PCB, alone Tantal, AVX, 33µF Murata, 100nf Murata, 10nf Murata, 2.2nf Murata, 1nf Ceramics X7R 1kHz 1MHz 1GHz Impedance Z=|U|/|I| Frequency 90 0 -90 0 U to I phase shift 0 ASIC is supported over wide frequency range with Z< 0.1  144mA generates <20mV Oscillations are dumped for wide frequency range with phase  ±90 0 Trust in simulation: - <1.5GHz=(1/10) granularity - No resistive behavior of ASIC is included. That over estimates the resonances at high frequencies Result: - Locally good for > 10kHz - Additional effort < 10kHz 0.1  1  10  100  00.1  Capacitors mounted to the 36x36cm 2 PCB Simulation of voltage induced by current ceramic PCB-layer Dominated by: Capacitor like Coil like Building blocks

10. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 10 Low frequency charge storage for < 10kHz At end of layer, there is a bit of - space - cooling C2C2 C3C3 Building blocks

11. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 11 Voltage at ASIC: Measurement Control electronics for layer Reduced test setup: Control board, 1 interconnect, 1 board Tantal taken away Default setup Tantal moved to control boar d Power on Command, step in I ASIC Supply voltage of ASIC (AC-component) [mV] GND electronics 2m 2 /Layer 1.3mm distance C=13nF 4mV Stainless steel absorber = GND PE  OK, even with extrapolation to 1500 layers low? Investigations of reason and improvements possible, to be watched Time [ns] Voltage step: - Measured 4mV, 400ns - Extrapolate to full system < 80mV at far end OK for operation, over-,undervoltage, time, … Induces current into GND PE, if step is on GND electronics < 2 mA per layer Building blocks

12. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 12 Definition of GND-point: - good for keeping sensitive SiPM’s stable - single connection to reduce currents in GND PE system Connection of GND Electronics and GND PE Control electronics for layer GND electronics 2m 2 /Layer 1.3mm distance C=13nF Stainless steel absorber = GND PE Building blocks Parasitic: Single PE: 10 5 -10 6 e - SiPM scintillator The SiPM should not pickup noise from a floating PE-system: Connect as close as possible from GND Electronics to GND PE  Low Impedance connection and not large wire loops  Option as long as it is near by more connections within cassette, but risk of currents in the PE-system Mechanical easy accessible is the point as the end of layer at the DIF Nearest accessible point, at the layer (>100MHz) rely on: C LAYER_to_PE highest freqencies: - amplifier_auto-trigger - power switching /10: Few cm

13. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 13 Integrating to Infrastructure 70pF/m from cable to support ASIC as switched current sink 50m cable, 1mm 2, on a cable support 0 1 2 3 4 5 [ms] 6 time nA 0 -40 -80 -120 -160 Current per layer Current induced into GND PE Simulation of cable Impact of cable is a combination of choices: -Input filter: R=10 , C=1mF reasonable mechanical size EMI better  =100ms -Power supply behavior here neglected capacitance to PE, might be 2 order of magnitude larger than cable! Here: ideal V-source -Mechanical integration and galvanic isolation per (group or) layer and pair of wires for it With 1500 layers of AHCAL: I PE =120  A Really small, Ideal! No parasitic, C + =C - ! Don’t be too reluctant in EMI-rules Building blocks C -,C + Ideal No parasitics no parameter spread C + =C -

14. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 14 Current in Supply Cable Control electronics for layer Reduced test setup: Control board, 1 interconnect, 1 board, Short cable to laboratory supply Current per 1/18 layer in supply cable [mA] Preamplifiers ON ADC’s ON Work bench settings Without input filter with input filter  =10ms Input filter important to lower amplitude fluctuations and remaining frequencies within cable Important: EMI-crosstalk to others Frequencies are low Electronics like to have larger  to smoothen further  Mechanics easier in service-hall Building blocks

15. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 15 Cabling a multi layer calorimeter: Six such cables would allow 48 layers - Individual connected and galvanic isolation outside ILD or as compromise filter with ferrits -Additional covers, tubes for flammability? Special production: wires/cable optimized -On picture 4 x 0.5mm 2 : 12V (LED) just from DESY-stock 6V ASIC, FPGA, … GND Bias (120V) Locally 0.5mm 2 would be fine For 50m 1mm 2 or more would be better Issue is less than a factor 2 in cross section! - It is work to manufacture! But feasible for 1500 layers! - How many wire per cable? Small total cross section or good bending? An idea but not the only and not work through! Two layers grouped: Still easy low-L access to GND PE DIF steel Split point of wire Components on board Option ?: Less power supply channels Group of wires

16. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 16 Alternatives: Star grounding Large loops Parasitic current from loop 1: Worsened for: -Common return paths to own and foreign Cross talks and pickup noise -It will not stay locally for low frequencies Loop 1 Large Inductance: SiPM surrounding is worsened Transformers to own and foreign Antenna Frequency dependent: PE is whole metal structure of ILD Also to ILD magnet: Quench or fast discharge not yet studied, but larger loops are worse: Resistance needed? Power routing has to be parallel to GND rooting with low L and R>L*   But points are not points, they have a size Nowadays: Systems have noise from switching power and faster digital edges It’s a system issue and therefore tends to appear late completeness of ILD and risk at all modifications Connectors Has to withstand group current

17. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 17 Consequences per power supply Multichannel systems are available with basic features -With galvanic isolation per channel -Low ripple: 5-10(20) mVpp Their development was (partially) driven by research WIENER, CAEN, ISEG, and ?????? Comparison of AHCAL needs to a WIENER system AHCAL: (not final, not optimized/fully understood) - Group of three voltages allowed - 6V/1-2A, 12V/0.1A, 120V/5mA at DIF -- Up to now: constant voltage with over current trip is studied Option: Constant current or impedance controlled, if performance gets better - 1500 layers …. 4500 voltages see option to group 2 layers - Low ripple/noise because sensitive ILD-detector - Floating to PE, limited to ±24V? - Small coupling to GND PE, but good EMI compared: 50m cable on PE: 3.5nF. - Cope with fluctuation current: typical: 800mA/layer, 2ms MPOD just because other project - Single chan., - 50W per channel - Constant V with over current trip - Just 80chan/crate, but each 50W. - 5-10mVpp To be done? Longer scale or next steps: Adaptation/development : - Research center/industry? - Can lower power be converted to more channels? … if 1 to 1in power : More than 400 channels per crate Getting fast running: - Selecting a system and buy - Programming for combined power supply and DIF/uC

18. Peter Göttlicher | CALICE | Heidelberg, September 15 th 2011 | Page 18 Summary  Power cycling allows to reduce heat by factor 100!  Coherent fast switching ON/OFF of high current: CALICE-AHCAL: 2.2A*layers : 3.4kA for the barrel 5Hz to few 100MHz  System aspects at local design…. Not only power-pulsing also EMI - Local defined return-paths for current - Local charge storage for wide frequency range that keeps - the impedance small - the currents leaving a defined volume small with slow rise times  System aspects within the infrastructure Lower frequency part handled by cables and power supply Good integration of power supplies and cables.  Simulation leaves many parasitic/accuracy effects out Underestimates the high frequency EMI-disturbance …. Experiments, concepts to be better than simulation promises  Experimental setups and integration into ILD to be continued