1. Sputtering Deposition System R eginald B ryant X u S un MAS 961, Spring 2004 Project Proposal

2. Presentation Overview I. Project Overview II. System Description III. Functionality IV. Design Process V. Hello-World Demonstration

3. I. Project Overview  A Gas Sputter Deposition System is proposed. Basic function is deposition of conductive and dielectric materials (including Al, SiN…) on various substrates (including Si, SiO).  The Advantage of this system over the existing technology is:

4. System Description  There are primarily SIX components in the system: 1. Target System ----- target material layer to be deposited on the substrate 2. Shutter & Masks ----- programmable deposition pattern 3. Plasma Sources ----- plasma hitting and kicking off target particles 4. Movement Control System ----- XYZ movement of target layer and/or shutter masks 5. Sample Holding System ----- fixed plane to hold sample at the bottom of enclosure 6. Enclosure & Pump ----- Entire system is enclosed in rare gas environment with temp, pressure control

5. 1. Target System  Function: ----- Holding target heads  Design Parameters: ----- Quality of target layer (existing standard deposition technology) ----- Topology of heads We plan to make only two target heads for prototyping

6. 2. Shutter and Masks  Function: ----- Deposition pattern one-use masks or programmable reusable shutter  Design Parameters: ----- The complexity and resolution of the pattern

7. 3. Plasma Source  Function: ----- Use high microwave voltage to generate Argon plasma. Electrons in plasma heat target material and kick them out.  Design Parameters: ----- Power level of plasma source, control electrical network.

8. 4. Movement Control System  Function: ----- Control the movement of deposition-head including X-Y-Z- axis.  Design Parameters: ----- Movement precision and operation complexity ----- Good to compatible with existing prototyping machine such as Modella, laser cutter or waterjet

9. 5. Sample Holding System  Function: ----- holding the sample substrate  Design Parameters: ----- easy to operate

10. 6. Enclosure and Pump  Function: ----- Include all the parts of system in a vacuum enclosure to ensure a clean environment. Temperature control.  Design Parameter: ----- Reasonable vacuum, temperature

11. Functionality  Deposition Scaling from 10 microns to 10 nanometers.  Monolithic Passive components  Monolithic Active components  Multilayer chip

12. Design Process  Physical Modeling –Theoretical analysis of required temperature, pressure, geometry –Computer simulations of deposition process  Design Optimization -- Different schemes, e.g. target heads movable or masks movable or both  Component fabrication -- Target heads, shutter/masks, enclosure, electronic parts  Component Test --  System Assembly

13. Hello-world demonstration  Multilayer conductive wires sandwiched between insulators.  Test the electrical quality, i.e. continuity of the wires and isolation of different layers