1. No-Fault Development: Building Rock Solid Solutions with Industrial Computers
Keith Williamson
Manager Technical Marketing
CompactPCI Product Organization
Motorola Computer Group

2. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

3. Why Standards-based Industrial Computers?
Ubiquitous Form Factor
Ruggedized
Wider Range of Payload
Scalability
Interoperability
Long Product Life
Improved Costs and Time to Market
Safety / EMC / EMI / Environmental
Universal Networking and Storage
Common System Management
Multi-member and Cross Industry Participation
Architected for High Availability!
Industry standards impact a variety of aspects within the design and development of industrial computing equipment. Original Equipment Manufacturers (OEMs), Service Providers and hardware, software and silicon suppliers have all recognized the need for industry standards.
Ubiquitous Form Factor: A common form factor allows for vendor flexibility across platforms and boards. It allows for the interoperability and interexchange of equipment. A customer is not locked to a proprietary design, be it their own or a vendor’s.
Wider Range of Payload : A wider range of payload options is available through industry standards. A customer can now choose between a variety of vendor’s hardware/software/silicon to meet their capacity, functionality, schedule and cost requirements.
Long Product Life: Industry standards equate to long product life. Since standards typically outlast actual product life cycles, a customer has the advantage of extending the life cycle of their particular product and application. Also, vendors are more likely to continue the support of standards based products.
Improved Costs and Time to Market: Industry standards improves the availability of needed product which translates to improved cost and time to market. Standards also improve the competitiveness of products resulting in improved costs and schedules.
Interoperability: A key to any network component is interoperability. Industry standards allow communication and non-interference to exist between integral components within a network architecture.
Clear Upgrade Path: Embedded in most industry standards is a clear upgrade path. This allows a allows a customer to choose a particular standards approach with confidence that their future capacity and functional requirements will be addressed through a smooth transition to future standards. An example is PICMG’s evolution plans from CompactPCI to AdvancedTCA.
Safety / EMC / EMI / Environmental: A critical component to any product design is adherence to safety, EMC, EMI and environmental standards. Products must behave as designed within their designated operating environments which includes temperature, humidity, EMC and vibration. Products must also be able to survive the transport environment as defined by standards. These products should not pose any safety hazards or electromagnetic interference on other components within the environment.
Universal Networking and Storage: Closely related to interoperability, networking and storage protocols defined by standards allows for universal switching, routing and storage methodologies across network components. Sophisticated applications such as security and QoS can be supported across a variety of network components.
Common System Management: Users and service providers prefer a common system management infrastructure and interface across their network components. Industry standards allows for this common infrastructure. Design cycle time for system management interfaces is greatly reduced.
Multi-member and Cross Industry Participation: A solid benefit of industry standards is the contributions from a consortium of users and suppliers within and across industries. Even though the creation of standards can be contentious, the results usually bring out the best and most practical requirements that benefit the majority of participants.

4. Standards for Industrial Computers
SAFETY/EMC/EMI
FCC CE
ENVIRONMENTAL
NEBS - GR-GS-CORE
ETSI – IEC / ETS / UL
MECHANICAL /
ELECTRICAL / FORM FACTOR
IEEE
VITA
PICMG
NETWORKING
Layer 2/3 IP
VLAN
DiffServ
IPv6
STORAGE
RAID
SCSI
FibreChannel
SYSTEM
MANAGEMENT
OPENIPMI
SNMP
SAF
This slide depicts examples of addressed standards for next generation platforms; in this case, the MXP Packet Transport Platform. The slide is meant to represent the variety of standards that are considered for the development and design of a next generation platform and its respective payload.
Environmental standards cover temperature, relative humidity, office vibration, transportation vibration, earthquake, drop, altitude, acoustic noise, heat dissipation, fire resistance and materials, illumination and airborne contaminants. Manufacturers will either claim that their products ore “designed to meet” NEBS and ETSI, or certification testing will be be completed for a reference configuration to claim compliancy.
IEEE and VITA specify a variety of mechanical and electrical requirements. PICMG refers to VITA/IEEE requirements along with additional form factor specifications.
Beyond design and development standards are the quality related standards that impact the entire development and manufacturing process. These standards are usually driven by the quality organization with a company.
NEBS – Network Equipment Building System
ETSI – European Telecommunications Standards Institute
IEEE – Institute of Electrical and Electronics Engineers
VITA - VITA was accredited as an ANSI (American National Standards Institute) standards development organization (SDO) in June of In 2001, the VSO was recognized as a Industry Technical Agreement (ITA) submitter by the IEC.

5. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

6. What is PICMG? CompactPCI 
PCI Industrial Computer Manufacturers Group founded in 1994 and headquartered in Wakefield, MA.
PICMG is a consortium, with over 600 members “who collaboratively develop open specifications for high performance telecommunications and industrial computing applications”
PICMG is the standards body that, to date, manages two standards:
PCI-ISA Passive Backplane – PICMG 1.x
CompactPCI (6U Eurocard Form Factor) – PICMG 2.x
PICMG has begun development of a new series of standards, AdvancedTCA™ -- PICMG 3.x
From (9/0/03)
What is PICMG
PICMG (PCI Industrial Computer Manufacturers Group) is a consortium of over 600 companies who collaboratively develop open specifications for high performance telecommunications and industrial computing applications. The members of the consortium have a long history of developing leading edge products for these industries. PICMG specifications include CompactPCI® for Eurocard, rackmount applications and PCI/ISA for passive backplane, standard format cards.
Our Mission Founded in 1994, PICMG's original mission was to extend the PCI standard, as approved by the PCI Special Interest Group (PCI SIG), for computer systems such as PCI/ISA, PCI/EISA and the PCI/3U or 6U Eurocard form factor known as CompactPCI. PICMG continues to develop important extensions and improvements to CompactPCI. Recently, PICMG announced it was beginning development of a new series of specifications, called AdvancedTCA™, for next-generation telecommunications equipment, with a new form factor and based on switched fabric architectures.
Our Purpose PICMG's purpose is to offer equipment vendors common specifications, thereby increasing availability and reducing costs and time to market. The PCI specifications provide a clear upgrade path for OEMs wishing to migrate to new designs.
PCI-ISA: Peripheral Component Interconnect – Industry Standard Architecture
Eurocard: “A series of mechanical board form factor sizes for rack-based systems as used used in VME, Multibus II and other applications defined by IEEE and IEC.”
Visit for membership information or to order specifications for members and non-members.

7. A Family of PICMG Specifications
1994
2002
2003
2004
2005
CompactPCI 
(Industrial Control)
(Military Aerospace)
(Telecom)
Specific to Telecom Market
CompactTCA ™
CompactPCI started about 9 years ago. It was intended to serve multiple markets including Industrial, Military, and Telecom. Since then, there have been many additional standards added under the CPCI umbrella – to the extent now that we no longer have any room on our front-plates to carry all the necessary glyphs! This leads to confusion, and in the end, problems with interoperability.
AdvancedTCA is the first open specification dedicated to the telecom market space. It was intended to serve specifically that one market and is intended to be useful for many years. New “form factors” only come along every years.
CompactTCA is a new effort underway to take the portion of CompactPCI that applies to telecom and create a more unified, consistent specification. This will increase interoperability and reduce integration times. This is still work in progress – expected to be ready by the end of 2004.

8. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

9. Mechanical/Electrical/Form-factor
Intrinsic HA Features
Mechanical/Electrical/Form-factor
PICMG 2.0 R3.0 - CompactPCI Core Specification
Provide systems that are electrically compatible with PCI systems
CompactPCI Features, per PICMG 2.0, include:
33 and 66Mhz PCI performance
32- and 64-bit data transfers
8 CompactPCI slots per bus segment at 33 MHz
5 CompactPCI slots per bus segment at 66MHz
Industry standard software support
3U small form factor (100 mm by 160 mm)
6U form factor ( mm by 160 mm)
IEEE Eurocard packaging
Wide variety of available I/O
System Management Bus
PICMG 2.0 R3.0 was ratified October 1, 1999.
CompactPCI extends PCI into industry systems.
MCG’s CPX and MXP family platforms adhere to PICMG 2.0, except that MXP products do not use the CompactPCI bus defined by this specification.

10. Intrinsic HA Features
Environmental: Humidity, Temp, Earthquake, Noise, Fire Resistance, Vibration
NEBS : GR-63-CORE
IEC
ETS300
UL1950
ISO7779
Safety/EMC/EMI
Safety: CSA C/US, VDE 0805
EMC/EMI: FCC Part 15, CE Mark
PICMG 2.0 R3.0 was ratified October 1, 1999.
CompactPCI extends PCI into industry systems.
MCG’s CPX and MXP family platforms adhere to PICMG 2.0, except that MXP products do not use the CompactPCI bus defined by this specification.

11. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

12. HA Networking
PICMG 2.16 R1.0 – CompactPCI Packet Switching Backplane Specification
802.3ab 10/100/1000BT auto-negotiating 8 wire point to point links
Star Network Topology
Node Slots with two links per node on J3
Fabric Slots support 20 or 24 nodes
Larger Payload Systems have redundant fabric slots
PICMG 2.16 R1.0 was ratified on September 5, 2001.
Along with PICMG 2.9, PICMG 2.16 distinguishes the MXP platform from MCG’s traditional CPX platforms. Embedded ethernet as provided through 2.16 significantly reduces external cabling and switching required for IP based applications. The MXP platform supports 10/100/1000BT transport through redundant fabric switches using a dual star topology.

13. HA Networking High Availability approaches: Use redundant switches
IP and MAC addr failover for nodes
Bonding Mode 1 for Linux nodes
Switch vendor supplied link failover
Link Aggregation (802.3ad)
PICMG 2.16 R1.0 was ratified on September 5, 2001.
Along with PICMG 2.9, PICMG 2.16 distinguishes the MXP platform from MCG’s traditional CPX platforms. Embedded ethernet as provided through 2.16 significantly reduces external cabling and switching required for IP based applications. The MXP platform supports 10/100/1000BT transport through redundant fabric switches using a dual star topology.

14. HA Networking PICMG 2.5 R1.0 – CompactPCI Computer Telephony
Extends CompactPCI to support Computer Telephony applications.
Included is a hot-swappable backplane based TDM bus (ECTF H.110)
Supports Kbps time slots (2048 bi-directional DS0s)
PICMG 2.5 R1.0 was ratified on April
PICMG 2.5 allows for the inclusion of a TDM (H.110) bus within the CompactPCI architecture. The CPX and MXP families both have options for the PICMG 2.5 H.110 implementation. MCG expects circuit-switched applications to be around for some time; PICMG 2.5 allows for continued support of these applications and networks.

15. HA Networking GR-253-CORE SONET/SDH Automatic Protection Switching
ATM over SONET/SDH
Packet Over SONET/SDH
I.630 ATM Protection Switching
Bridge
Selector
Working
Entity
PICMG 2.5 R1.0 was ratified on April
PICMG 2.5 allows for the inclusion of a TDM (H.110) bus within the CompactPCI architecture. The CPX and MXP families both have options for the PICMG 2.5 H.110 implementation. MCG expects circuit-switched applications to be around for some time; PICMG 2.5 allows for continued support of these applications and networks.
1+1 Linear APS
Protection
Entity
Protection Function

16. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

17. HA Systems Management PICMG 2.1 R2.0 – CompactPCI Hot Swap
Extends CompactPCI to hot swap applications
Specifies the required features to allow silicon, board and system vendors to develop Hot Swap capability
Assigns a framework of terminology and overall architecture for Hot Swap systems
This is not a “detailed” specification for a Hot Swap Compact system
Specific implementation for Hot Swap software routines is not defined
PICMG 2.1 R2.0 was ratified January 17, 2001.
Hot Swap is a key function for High Availability systems. CPX and MXP platforms and respective payload boards adhere to this specification.

18. HA Systems Management PICMG 2.9 R1.0 – CompactPCI System Management
A standard method for managing CompactPCI Platforms
Based on Intel’s IPMI architecture
Significant third party hardware and software support
improved device monitoring and diagnostic capabilities
Distributed nature of IPMI management removes necessity for system management bus (CompactPCI)
PICMG 2.9 R1.0 was ratified on February 2, 2000.
Along with PICMG 2.16, PICMG 2.9 distinguishes the MXP platform from MCG’s traditional CPX platforms. MXP Intelligent Platform Management Interface (IPMI) is implemented with all slots within the platform being radially connected through Intelligent Platform Management Bus 0 (IPMB 0) to the Alarm Management Card (AMC). The AMC supports the Baseboard Management Controller (BMC) function as defined by PICMG 2.9. IPMI allows for the removal of the CompactPCI bus (per PICMG 2.0) and the reliance on bridging. This provides the basis for a purely distributed architecture that is not reliant on system host slots.

19. SAF Compliant Middleware
HA Systems Management
SAF Compliant Middleware
SAF AIS: Interface between an HA application and the HA middleware
Cluster Management
Checkpoint Service
Event Service
Message Service
Global Lock Service
Availability Management
SAF HPI: Interface between the HA middleware and the hardware
Middleware interface to the IPMI subsystem
HA Application
SAF Middleware
Platform H/W
AIS
HPI

20. Agenda Why go standards-based for telco? The PICMG family of platforms
Intrinsic HA features
HA networking standards
HA systems management standards
The future of PICMG

21. CompactTCA CompactTCA is ... Interoperability
CompactTCA is ... A system specification
CompactTCA is ... A single specification for combination of popular PICMG 2.x standards
6U CPCI form factor, connectors, power, cooling (PICMG 2.0)
Hot Swap (PICMG 2.1)
IPMI (PICMG 2.9)
PSB (PICMG 2.16)
Communication Architecture based on Ethernet/IP
No PCI bus to be maintained
S/W architecture based on network nodes
Planned Optional Interconnects
PICMG 2.5(H.110), 2.17(Starfabric) and 2.20(Mesh)
This slide takes a look at the basic premise of CTCA in more detail. CTCA marks a general move towards the blade mode of operation.

22. cPCI vs ATCA 2002 2003 AdvancedTCATM (PICMG 3.0)
Serial Mesh Fabric (3.4?)
Ethernet Fabric (3.1)
System Management
Larger, more functional modules
Higher Density, Power
Central Office in a box
PICMG 2.xx
2002
2003
PICMG 3.xx
High Availability OS
PICMG 2.xx
Serial Mesh Fabric (2.20)
Ethernet Fabric (2.16)
System Management (2.9)
Modular Resources
General Purpose Processors
Network Processors
Packet Processors
Digital Signal Processors

23. Quick Comparison CompactPCI® AdvancedTCATM 6U x 160 mm
0.8” pitch (20.32 mm)
57 in2 (368 cm2)
50 Watts
In the discussions that led to 8U x 280, there were 3 important factors:
The desire to achieve from 120 to 150 in2 of board space.
The desire to keep the system size to 12U (so you get 3 in a 40U rack)
The desire to remain within a 600mm rack depth
The debate centered around the need for IO.
The two proposals wer 6U x 340 and 8U x 280.
The 6U x 340 didn’t leave enough space in the back of the board for any rear IO TM or cabling.
The focus was is this spec a server spec with telco attributes, or a telco spec that accommodates
servers. The telco camp won and the 8U x 280 form factor was chosen.
8U x 280 mm
1.2” pitch (30.48 mm
140 in2 (903 cm2)
150 Watts

24. CompactPCI - AdvancedTCATM
50W per board
150W per board
57 square in.
140 square in.
700Gb/s Fabric (2.20) (17 x 18 x 2.5Gb/s)
2.4Tb/s Fabric (15 x 16 x 10Gb/s)
OC3 / OC48
OC192 / OC768
300mm and 450mm chassis
600mm chassis
500W – 1.5KW per shelf
1KW – 3KW per shelf

25. (Dual -48VDC Power Rails)
PICMG 3.0 – Advanced TCATM
92 mm Tandem Fans
4 x 2 arrangement
~ 350 CFM simulated
Telco
Alarm
Board
14 Slot Backplane
in 19” Shelf
2 Switch Slots
12 Payload Slots
1.2” Board Pitch
150W – 200W per module
12U
533.4 mm
(21”)
-48 VCD
Power Input
(Dual -48VDC Power Rails)
Air
Inlet
(open)
437 mm (17.2”)
420 mm (16.5”)

26. ATCA Media Gateway on-a-card
Vertical Integration simplifies HA
ATCA Media Gateway on-a-card
Signal Procs
Packet Procs
Network Procs
General Procs
PICMG 2.xx Modules
I O
DSP NP GP
F a b r i c