1. 1/20 Passive components and circuits - CCP Lecture 13

2. 2/20 Content  Electronic packaging levelsElectronic packaging levels  Manufacturing the Printed Circuit Boards PCBManufacturing the Printed Circuit Boards PCB

3. 3/20 Packaging  Is a domain which combine the engineering with manufacturing technologies needs to transform an electrical diagram in an operational product. This domain combines knowledge's from electronics, mechanics, materials and quality assurance.  Packaging of electronics microsystems include a set of fundamentals technologies: micro and nanoelectronics, photonics, micro-electro-mechanical systems (MEMS), radio frequency (RF) and wireless technologies.  In order to integrate all these functions in a system, the functions must be designed, manufactured and tested for assuring reliability and an adequate thermal regime.

4. 4/20 Level 0: Interconnection on a silicon die Level 1: Chip encapsulation Level 2: Manufacturing of multi-chip modules Level 3: PCB Level 4: Interconnection of electronics and mechanics sub-assemblies at a system level Packaging levels

5. 5/20 Packaging levels

6. 6/20 Interconnections inside the silicon chip. Level 0

7. 7/20 Single Chip Module (SCM)  In-line packages  Small outline packages  Quad packages  Array packages Level 1

8. 8/20 Multi Chip Modules (MCM)  MCM-D – deposited MCM. The modules are deposited on the base substrate using thin film technology.  MCM-C – ceramic substrate MCMs (thick-film or cofired ceramic technology). A very good variant is LTCC – low temperature cofiread ceramic)  MCM-L – laminated MCM. The substrate is a multi-layer laminated PCB (organic laminate technology) Level 2

9. 9/20 Printed Wiring Board (PWB)  Paul Esler from Germany invented this technology in 1943.  Actual production 45,250 mil $/ year, with an 11%/year increasing rate  The large producers made 250,000 m 2 /year, adding the small producers 50,000 m 2 / year. Level 3

10. 10/20 The final integration stage:  printed circuit boards PWB/PCB  Subassemblies: power supplies, micro-motors, etc.  User interfaces: displays, keyboards,etc.  Special components:transformers, fans, heaters, etc.  Cables  Boxes Level 4

11. 11/20  Is the most important integration level in packaging  Assures the interconnection between components using Copper traces  Assures mechanical support for components Printed Wiring Board (PWB) or Printed Circuit Board (PCB) http://www.ett.bme.hu/vlab/start.htmlhttp://www.ett.bme.hu/vlab/start.html - PWB section

12. 12/20  Width of the interconnection traces  Resolution of traces/elements (pitch)  Number of pads for component connections per square cm  Metalized vias dimensions (passing holes)  Number of layers for the traces PWB/PCB are characterized by:

13. 13/20 PCB technology evolution Line Width Year 1985 : 500  m Years 90-95: 250  m Years 95-2000 : 150  m Years 2000-2005 : 100  m Years 2003-2006 : 75  m Years 2005-2008 : 50  m Years 2008-2010 : 30  m Tehnology Single layer Two layers Multilayers With micro via and high density Substrate Rigid Flexible Rigid-flexible 3-D board

14. 14/20 The most restrictive technological operation is the drilling operation

15. 15/20 Technological steps for Single Sided Board 1. Cutting of laminated board 2. Screen Printing – using photo technology or serigraphy 3. Etching 4. Roller Tinning - covering with safety tin 5. Drilling

16. 16/20 Technological steps for Double Sided Board 1. Cutting of laminated board 2. Drilling 3. Plating through Holes 4. Traces printing (Dry film Imaging) – solid photo-resist technology 5. Tin plating 6. Stripping- elimination of photo-resist 7. Etching 8. Deposition of masks (soldering masks, Silkscreen mask )

17. 17/20 Technological steps for Multilayer Board A.The internal layers are made as single sided or double sided boards B.Each internal layer is treated with adhesive and then are laminated together with external layers completely covered with Cu C.Is made like a double sided board

18. 18/20 Double sided board -example

19. 19/20 Equipped boards - example

20. 20/20 Equipped boards - example