1. Enabling Technologies for the Mass Storage Industry Dr
Enabling Technologies for the Mass Storage Industry Dr. David Tuckerman, CTO

2. Enabling Technologies for Data Storage
Semiconductor evolving to ever-smaller devices
Feature size going down, currently 65 nm
Die Thickness below 100 micron
Reduced voltages and power needs
Advanced Packaging keeps finished ICs small
Chip Scale Packaging, final footprint is die-size
Ball Grid Arrays attach directly to PCB without leads
Stacked and Folded Packages
“Systems in a Package” Designs
Different functions combined at die level
One chip does the work of many die
Complete function in a single package (GPS, cellular, imaging)

3. Tessera Enabling Technologies
µZ™-Ball Stack
Package
Single Die
µBGA®-W Package
Multi-Die µZ™
Folded Package
µZ™ Fold-Over and
Stack Package
µBGA® Package

4. FLASH µZ™ Ball Stack FLASH Die Substrate Wire Bond and Encapsulation
~2mm
Wire Bond and Encapsulation

5. µZ™ - Ball Stack Package
The µZ Ball Stack package is a multi-chip solution that is capable of increasing memory capacity up to 8x for DRAM, SRAM and for Flash applications.
Tessera’s technology provides near-100% yield by allowing each die to be individually tested prior to stacking.
Ball Stack uses the existing µBGA® assembly infrastructure, ensuring low cost.
Stacking of DDR-SDRAM chips in memory modules for increased memory density in space restricted applications.
Flash Stacking applications include high density solid state drives, solid state mission recorder and memory cards.
2-Stack DRAM
4-Stack Flash
4-Stack DRAM
8-Stack DRAM

6. Small Device Applications
Cellular Phones
Intel pioneered stacked memory in hand-held devices
Features added while shrinking overall phone dimensions
New features require more memory
Federal mandate requires GPS receivers on new cellular phones
PC and Server Memory
Blade servers and laptops are severely space constrained
Die stacking allows 8X the device count in same footprint
Fewer leads, simpler PCB
Military and Aerospace
“Land Warrior” requires ultra small “wearable” computer
Devices must work in hostile environments (high G, vacuum)
High reliability, low power, “survivability” are key issues

7. Packaging technology for system-level miniaturization
Computing/Gaming Systems
Wireless/Consumer Electronics
Enabling Tomorrow’s Feature-Rich Products

8. Typical Applications
Military & Space Harsh environment Solid State Mass Storage
90GB
275GB
Up to 32 GB Flash.
Advanced protection in conditions of extremely high shock, vibration, temperature, and altitude.
MONSSTR: MOdular Non-volatile Solid STate Recorder
RMS-SS Solid-State Removable Memory System
Network Solid State Disks
Records all types of airborne data, including data from reconnaissance sensors Up to 25 GB
Solid State Mission Data Recorder (SSMDR)
2.048GB - 688GB

9. Solid State Drive Application
THIS PRESENTATION being delivered via FSSD in a Dell Laptop
20 GByte in 2.5” HDD form factor
24 stacks of 7 die, using 1 Gbit Flash devices
Instant on, no spin-up time
Very low power, needs no air for head flight or cooling
Extremely robust, works in space … under water too.
Parallel controller achieves >30 MByte/sec transfer rate
Same speed as a conventional HDD
Custom controller addresses 8 die in parallel
Roadmap shows 192 GByte using current technology
4 Gbit Flash devices, 24 stacks of 8, Dual Nand die
2.5” HDD form factor, 9.5mm high

10. 3D Packaging: 21 GB Solid State Drive
System designed to leverage stacked packaging
Low-profile (9.5 mm) 2.5” flash solid state drive (F-SSD)
drop-in replacement for conventional hard disk drive
custom FPGA controller required to handle high capacity
SDRAM, processor included
NAND flash stacks:
7 ICs/site
12 sites / side
2 sides
24 sites
168 devices
Miniaturization of Flash storage capability – achieved with
Tessera’s stacked packaging – allows drop-in solid state
replacement for conventional hard disk drive.

11. Dual NAND FLASH Options
3.92mm

12. Dual Die in 2.5” Solid State Drive
Drive Height
Max Pkg Height
Capacity
(1Gb Die)
(2Gb Die)
(4Gb Die)
# of Stacked Packages
9.5 mm
3.92 mm
48GB
96GB
192GB 8
8.5 mm
2.94 mm
36GB
72GB
144GB 6
8.0 mm
2.45 mm
30GB
60GB
120GB 5
5.0 mm
0.98 mm
12GB
24GB 2
Dual NAND flash stacks:
16 ICs/site (8 high package stack)
12 sites / side
2 sides
24 sites, 384 devices

13. PCB area savings Size Reductions Translate to Higher Density
21.0 GB in a 2.5” Flash Solid State Drive (FSSD)
Area of 168 TSOP array is cm2, equivalent area for 24 µZTM stacks (7 die each) is 50.4 cm2
Space consumed by stacks is 12% of TSOP, space savings is 88% !
Size Reductions Translate to Higher Density

14. Summary and Conclusions
Semiconductor Packaging a key element for solid state memory products
Higher frequencies need shortest possible connections
“System in a Package” simplifies PCB, improves reliability
Memory demand growth requires die stacking
Today’s “nice to have” will be tomorrow’s “must have” features
DDR-2 requires Chip Scale Packaging, so will DDR-3
More products must be tolerant of hostile environments
Additional space savings from Integrated passives
More products will depend on miniature and/or hand-held form factors
Military devices carried by personnel and ordnance
Business needs for tracking people, equipment, products (RFID)
Consumer goods, increasing use of wired/wireless networks